Eex MP02XXX190 Series PACKAGE DETAILS For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise DO NOT SCALE 2 holes 06.5 8O@ Circuit type: HBN G. K 3 BP 3 Circuit type: HBT Nominal weight: 350g Recommended fixings for mounting: M6 socket head cap screws Recommended mounting torque: 6Nm(55lb ins) Recommended torque for electrical connections: 5Nm(44lb. ins) Maximum torque for electrical connections: 8Nm(7Olb. ins) Module outline ty pe code: MP02 MOUNTING RECOMMENDATIONS Adequate heatsinking is required to maintain the base An even coating of thermal compound (eg. Unial) should be temperature at 75C if full rated current is to be achieved Power applied to both the heatsink and module mounting surfaces dissipation may be calculated by use of VTo and information This should ideally be 0.05mm(0.002") per surface to ensure in accordance with rd formulae. We can provide ptimum thermal performance assistance with calculations or choice of heatsink if required After application of thermal compound, place the module The heatsink surface must be smooth and flat; a surface finish squarely over the mounting holes, (or T' slots) in the heatsink of N6 (32uin) and a flatness within 0.05mm(0.002")are Fit and finger tighten the recommended fixing bolts at each end recommended Using a torque wrench, continue to tighten the fixing bolts by mediately prior to mounting, the heatsink surface should be rotating each bolt in turn no more than 1/4 of a revolution at a lightly scrubbed with fine emery, Scotch Brite or a mild chemical time, until the required torque of 6Nm(55lbs ins) is reached on etchant and then cleaned with a solvent to remove oxide build all bolts at both ends up and foreign material. Care should be taken to ensure no It is not acceptable to fully tighten one fixing bolt before starting foreign particles remain to tighten the others. Such action may dAMAGE the module 718 www.dynexsemi.com7/8 www.dynexsemi.com MP02XXX190 Series PACKAGE DETAILS For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 23 23 24 13 80 34 30 94 3x M6 12.8 2 holes Ø6.5 1 2 3 24 5 15 K2 G2 K1 G1 Nominal weight: 350g Recommended fixings for mounting: M6 socket head cap screws Recommended mounting torque: 6Nm (55lb.ins) Recommended torque for electrical connections: 5Nm (44lb.ins) Maximum torque for electrical connections: 8Nm (70lb.ins) Module outline type code: MP02 1 2 3 K2 G2 G1 K1 1 2 3 Circuit type: HBN Circuit type: HBT Circuit type: HBP G1 K1 1 2 3 K2 G2 MOUNTING RECOMMENDATIONS Adequate heatsinking is required to maintain the base temperature at 75˚ C if full rated current is to be achieved. Power dissipation may be calculated by use of VT(TO) and rT information in accordance with standard formulae. We can provide assistance with calculations or choice of heatsink if required. The heatsink surface must be smooth and flat; a surface finish of N6 (32µin) and a flatness within 0.05mm (0.002") are recommended. Immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, Scotch Brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. Care should be taken to ensure no foreign particles remain. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance. After application of thermal compound, place the module squarely over the mounting holes, (or ‘T’ slots) in the heatsink. Fit and finger tighten the recommended fixing bolts at each end. Using a torque wrench, continue to tighten the fixing bolts by rotating each bolt in turn no more than 1/4 of a revolution at a time, until the required torque of 6Nm (55lbs.ins) is reached on all bolts at both ends. It is not acceptable to fully tighten one fixing bolt before starting to tighten the others. Such action may DAMAGE the module