1.6.3 After the etch is complete, inspect the wafers under the microscope. The exposed patterned regions should appear to be silicon colored (metallic whitish or grayish). If not, report to the specialist in charge of the LAM490B. The wafers should be evaluated and may need further etchin 1.7 REMOVE PHOTORESIST 7. 1 Tool: Matrix 106 System One Stripper(Asher) 1.7.2 For 2 uM thick photoresisit on a 6 wafer, the ashing time is 4 30"per wafer to remove the photoresisit 8 MEASURE NITRIDE THICKNESS 1.8.1.Tool:Uv1280 1.8.2. The thickness of the remaining silicon nitride film will be measured so we know the thickness of the cantilever that will be released in lab session 2 PRE-LAB QUESTIONS: Why is the photoresist soft-baked before exposure? 2. What is the difference between a positive resist and a negative resist? 3. Why is it important to keep gold processing separate from CMOS processing? 4. Is the Nitride mask clear -field or dark-field? 5. Using the mask shown below(Figure 1. 1), sketch how the cross-section A-A would appear after Step 1.6 Fi 1.1 3 of 31.6.3 After the etch is complete, inspect the wafers under the microscope. The exposed patterned regions should appear to be silicon colored (metallic whitish or grayish). If not, report to the specialist in charge of the LAM490B. The wafers should be evaluated and may need further etching. 1.7 REMOVE PHOTORESIST 1.7.1 Tool: Matrix 106 System One Stripper (Asher) 1.7.2 For 2 uM thick photoresisit on a 6” wafer, the ashing time is 4’30” per wafer to remove the photoresisit. 1.8 MEASURE NITRIDE THICKNESS 1.8.1. Tool: UV1280 1.8.2. The thickness of the remaining silicon nitride film will be measured so we know the thickness of the cantilever that will be released in lab session 2. PRE-LAB QUESTIONS: 1. Why is the photoresist soft-baked before exposure? 2. What is the difference between a positive resist and a negative resist? 3. Why is it important to keep gold processing separate from CMOS processing? 4. Is the NITRIDE Mask clear-field or dark-field? 5. Using the mask shown below (Figure 1.1), sketch how the cross-section A-A would appear after Step 1.6. A A Figure 1.1 Page 3 of 3