SONY CXA1619BM/BS Package Outline Unit:mm CXA1619BM 28PIN SOP (PLASTIC) 18B亡8 23815 滑AH月月月月月月月月月A庄 018品s H 0.45±0.1 127 0286 0 ⊙024匈 PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE s0-28L04 LEAD TREATMENT SOLDER PLATING EIAJ CODE S0P028-P.0375 LEAD MATERIAL 42/COPPER ALLOY JEDEC CODE PACKAGE MASS 0.7g CXA1619BS 30PIN SDIP(PLASTIC) 28.9-81 30 aoononoanoon 于于几 1.778 Two kinds of package surface: 1All mat surface type. 2All mirror surface type. 0.5±0.1 0.9±0.15 PACKAGE STRUCTURE MOLDING COMPOUND EPOXY RESIN SONY CODE SDP.30P.01 LEAD TREATVENT EIAJ CODE SDP030-P.0400 LEAD MATERIAL COPPER AL⊥OY JEDEC CODE PACKAGE MASS 1.8g NOTE:PALLADIUM PLATING This product uses S-PdPPF(Sony Spec.-Palladium Pre-Plated Lead Frame). 11-SONY CODE EIAJ CODE JEDEC CODE SOP-28P-L04 PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS 42/COPPER ALLOY SOLDER PLATING EPOXY RESIN 28PIN SOP (PLASTIC) 18.8 – 0.1 + 0.4 28 15 0.45 ± 0.1 1.27 9 3. 2.3 – 0.15 + 0.4 0.1 – 0.05 + 0.2 0 5. ± 0.2 0.2 – 0.05 + 0.1 7 6. – 0.1 + 0 3. 10.3 ± 0.4 14 0.24 M SOP028-P-0375 1 0.7g 0.15 SONY CODE EIAJ CODE JEDEC CODE 30PIN SDIP (PLASTIC) 26.9 – 0.1 + 0.4 15 30 16 1.778 10.16 8 5. – 0.1 + 0 3. 0 2. 5 – 0 0. 5 + 0 1. 0° to 15° 0.5 ± 0.1 0.9 ± 0.15 3.0 M NI 0.5 M NI 3.7 – 0.1 + 0.4 SDIP-30P-01 SDIP030-P-0400 1 PACKAGE STRUCTURE MOLDING COMPOUND LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN PLATING COPPER ALLOY 1.8g SOLDER/PALLADIUM 1.All mat surface type. Two kinds of package surface: 2.All mirror surface type. Package Outline Unit : mm CXA1619BM CXA1619BS CXA1619BM/BS —11— NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame)