for components, recycling, and materials technology as well. Below is a brief summary of technology develop- ments and their associated environment impacts as well as tools to address the many environmental concerns facing the industry. The electronics industry has taken active steps toward environmental stewardship, evidenced by the formu lation of the IEEE Environment, Safety and Health Committee, the 1996 Electronics Industry Environmental Roadmap published by MCC, and chapters focused on environment in The National Technology Roadmap for Semiconductors. Moves such as this, taken together with the technical sophistication of control systems used in manufacturing processes, have allowed the electronics industry to maintain low emission levels relative to ome other industries. Despite the industry's environmental actions, the projected growth in electronics over the next 10 to 20 years is dramatic and continued technological innovation will be required to maintain istorically low environmental impacts. Moreover, the rapid pace of technological change generates concomi- antly high rates of product obsolescence and disposal, a factor that has led countries such as Germany and the Netherlands to focus on electronics products for environmental management. Environmental considerations are not, of course, the only forces driving the technological evolution in the electronics industry. Major driving forces, as always, also include price, cost, performance, and market/regula tory requirements. However, to the extent that the trend is toward smaller devices, fewer processing steps, increased automation, and higher performance per device, such evolution will likely have a positive environ- mental impact at the unit production level, i. e, less materials, less chemicals, less waste related to each unit produced. Technology advances that have environmental implications at the upstream processing stage may well have significant benefits in the later stages of systems development and production. For example, material substitution in early production stages may decrease waste implications throughout the entire process. Since both semiconductors and printed wiring boards are produced in high volume and are present in virtually all electronic products ranging from electronic appliances, to computers, automotive, aerospace, and military applications, we will briefly examine the impact of these two areas of the electronic industry Integrated Circuits The complex process of manufacturing semiconductor integrated circuits(IC)often consists of over a hundred steps during which many copies of an individual IC are formed on a single wafer. Each of the major process teps used in IC manufacturing involves some combination of energy use, material consumption, and material waste. Water usage is high due to the many cleaning and rinsing process steps. Absent process innovation, this trend will continue as wafer sizes increase, driving up the cost of water and waste water fees, and increasing mandated water conservation used for connection and attachment, the energy consumed in high-temperature processes, and the chemicals Environmental issues that also require attention include the constituent materials for encapsulants, the and solvents used in the packaging process. Here, emerging packaging technologies will reducing the quantity of materials used in the packaging process by shrinking IC package sizes. Increasing predominance of plastic packaging will reduce energy consumption associated with hermetic ceramic packaging Printed Wiring Boards Printed wiring boards represent the dominant interconnect technology on which chips will be attached and represents another key opportunity for making significant environmental advances. PWB manufacturing is a complicated process and uses large amounts of materials and energy(e.g, 1 Megaw of heat and 220 kw of ergy is consumed during fabrication of prepeg for PWBs ). On average, the waste streams constitute 92%and the final product just 8%of the total weight of the materials used in PwB production process Approximately 80% of the waste produced is hazardous and most of the waste is aqueous, including a range f hazardous chemicals. Printed wiring boards are not recycled because the removal of soldered sub assemblies is costly and advanced chip designs require new printed wiring boards to be competitive jead result. the boards are incinerated and the residual ash buried in hazardous waste landfills due to th content(from lead solder) e 2000 by CRC Press LLC© 2000 by CRC Press LLC for components, recycling, and materials technology as well. Below is a brief summary of technology develop￾ments and their associated environment impacts as well as tools to address the many environmental concerns facing the industry. The electronics industry has taken active steps toward environmental stewardship, evidenced by the formu￾lation of the IEEE Environment, Safety and Health Committee, the 1996 Electronics Industry Environmental Roadmap published by MCC, and chapters focused on environment in The National Technology Roadmap for Semiconductors. Moves such as this, taken together with the technical sophistication of control systems used in manufacturing processes, have allowed the electronics industry to maintain low emission levels relative to some other industries. Despite the industry’s environmental actions, the projected growth in electronics over the next 10 to 20 years is dramatic and continued technological innovation will be required to maintain historically low environmental impacts. Moreover, the rapid pace of technological change generates concomi￾tantly high rates of product obsolescence and disposal, a factor that has led countries such as Germany and the Netherlands to focus on electronics products for environmental management. Environmental considerations are not, of course, the only forces driving the technological evolution in the electronics industry. Major driving forces, as always, also include price, cost, performance, and market/regula￾tory requirements. However, to the extent that the trend is toward smaller devices, fewer processing steps, increased automation, and higher performance per device, such evolution will likely have a positive environ￾mental impact at the unit production level, i.e., less materials, less chemicals, less waste related to each unit produced. Technology advances that have environmental implications at the upstream processing stage may well have significant benefits in the later stages of systems development and production. For example, material substitution in early production stages may decrease waste implications throughout the entire process. Since both semiconductors and printed wiring boards are produced in high volume and are present in virtually all electronic products ranging from electronic appliances, to computers, automotive, aerospace, and military applications, we will briefly examine the impact of these two areas of the electronic industry. Integrated Circuits The complex process of manufacturing semiconductor integrated circuits (IC) often consists of over a hundred steps during which many copies of an individual IC are formed on a single wafer. Each of the major process steps used in IC manufacturing involves some combination of energy use, material consumption, and material waste. Water usage is high due to the many cleaning and rinsing process steps. Absent process innovation, this trend will continue as wafer sizes increase, driving up the cost of water and waste water fees, and increasing mandated water conservation. Environmental issues that also require attention include the constituent materials for encapsulants, the metals used for connection and attachment, the energy consumed in high-temperature processes, and the chemicals and solvents used in the packaging process. Here, emerging packaging technologies will have the effect of reducing the quantity of materials used in the packaging process by shrinking IC package sizes. Increasing predominance of plastic packaging will reduce energy consumption associated with hermetic ceramic packaging. Printed Wiring Boards Printed wiring boards represent the dominant interconnect technology on which chips will be attached and represents another key opportunity for making significant environmental advances. PWB manufacturing is a complicated process and uses large amounts of materials and energy (e.g., 1 MegaW of heat and 220 kW of energy is consumed during fabrication of prepeg for PWBs). On average, the waste streams constitutes 92%—and the final product just 8%—of the total weight of the materials used in PWB production process. Approximately 80% of the waste produced is hazardous and most of the waste is aqueous, including a range of hazardous chemicals. Printed wiring boards are not recycled because the removal of soldered sub￾assemblies is costly and advanced chip designs require new printed wiring boards to be competitive. As a result, the boards are incinerated and the residual ash buried in hazardous waste landfills due to the lead content (from lead solder)