Surface Micromachining: Layer by layer addition Starting from bare silicon wafer, deposit pattern multiple layers to form a(shippable)MEMS wafer 10 mask steps METAL METAL Silicon Substrate Patterned con Substrate Photoresist Completed MEMS wafer Silicon substrat PoLY重 Poly o P。lyo Etch Diced and released mems device Release isotropic chemical etch to remove oxides Special techniques may be used to remove liquid (e.g, critical point drying) Silicon Substrate Assembly= mechanical manipulation of structures (e.g., raising and latching a vertical mirror plate) Various techniques used, some highly proprietary FromCronos/jdsuMumpsuserguideatwww.Memsrus.comSurface Micromachining: Layer by layer addition Starting from bare silicon wafer, deposit & pattern multiple layers to form a (shippable) MEMS wafer From Cronos/JDSU MUMPS user guide at www.MEMSRUS.com Assembly = mechanical manipulation of structures (e.g., raising and latching a vertical mirror plate) Various techniques used, some highly proprietary Release = isotropic chemical etch to remove oxides Special techniques may be used to remove liquid (e.g., critical point drying) Diced and released MEMS device Completed MEMS wafer ~ 10 mask steps