●● ●0 ● ●● 概述 ●●●● ●●●● Early 1990%s-Fabrication Line had 50 to 1000 defects per million (dpm)chips IBM wants to get 3.4 defects per million(dpm)chips (0 defects) Conventional way to reduce defects: Increasing test fault coverage Increasing burn-in coverage Increase Electro-Static Damage awareness New way to reduce defects: >IDo Testing-also useful for Failure Effect Analysis 44 概述  Early 1990’s – Fabrication Line had 50 to 1000 defects per million (dpm) chips  IBM wants to get 3.4 defects per million (dpm) chips (0 defects)  Conventional way to reduce defects:  Increasing test fault coverage  Increasing burn-in coverage  Increase Electro-Static Damage awareness  New way to reduce defects:  IDDQ Testing – also useful for Failure Effect Analysis