(金玲玥，孙海燕，周婷，等.LGA焊点可靠性分析及热疲劳寿命预测.电子元件与材料，2021,40(9)：893) [23]LI Y,TIAN Y,CONG S,et al.Multi-scale Finite Element Analysis into Fatigue Lives of Various Component Solder Joints on Printed Circuit Board.Journal of Mechanical Engineering.2019,55(06):54 (李跃，田艳红，丛森，等.PCB组装板多器件焊点疲劳寿命跨尺度有限元计算.机械工程学报，2019,55(06)：54) [24]SYEDA.Predicting solder joint reliability for thermal,power,and bend cycle within 25%accuracy[C]//2001 Proceedings.5Ist Electronic Components and Technology Conference.2001:255 [25]TIAN R,HANGC,TIAN Y,et al.Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment.Journal of Alloys and Compounds,2019,777:463 [26]TIAN R,HANG C,TIAN Y,et al.Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes.Journal of Materials Processing Technology,2019,268:1. 非最终出版 27]PENG L.Research on long-life storage reliability of multilayer ceramic capcatior[Disser arbin:Harbin Institute of Technology,2016 彭磊.多层瓷介电容器长期贮存寿命可靠性研究[学位论文].哈尔滨：哈尔 录用稿件(金玲玥,孙海燕, 周 婷, 等. LGA 焊点可靠性分析及热疲劳寿命预测. 电子元件与材料, 2021, 40(9): 893). [23] LI Y, TIAN Y, CONG S, et al. Multi-scale Finite Element Analysis into Fatigue Lives of Various Component Solder Joints on Printed Circuit Board. Journal of Mechanical Engineering, 2019, 55(06): 54． (李跃, 田艳红, 丛森, 等．PCB 组装板多器件焊点疲劳寿命跨尺度有限元计算．机械工程学报, 2019, 55(06): 54). [24] SYED A. Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy[C]//2001 Proceedings. 51st Electronic Components and Technology Conference.2001: 255. [25] TIAN R, HANG C, TIAN Y, et al. Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment. Journal of Alloys and Compounds, 2019, 777: 463. [26] TIAN R, HANG C, TIAN Y, et al. Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes. Journal of Materials Processing Technology, 2019, 268: 1. [27] PENG L. Research on long-life storage reliability of multilayer ceramic capcatior[Dissertation]．Harbin: Harbin Institute of Technology, 2016. 彭磊．多层瓷介电容器长期贮存寿命可靠性研究[学位论文]．哈尔滨: 哈尔滨工业大学, 2016． 录用稿件，非最终出版稿