《工程科学学报》录用稿，htps:/doi.org/10.13374/i,issn2095-9389.2021.11.14.002©北京科技大学2020 工程科学学报DO: 62S36Pb2Ag组装焊点长期贮存界面化合物生长 动力学及寿命预测 张贺)，冯佳运，丛森2)，王尚)，安荣)，吴朗火 艳红) 1)哈尔滨工业大学先进焊接与连接国家重点实验室，哈尔滨1500012)中国工程物理研究院电予工 所，绵阳621900 ☒通信作者，E-mail:tianyh@hit.edu..cn 摘要锡基合金焊接接头是电子产品不可或缺的关键部位，是实现电子元器件能化的基础，电子整机失效往往由 于焊点的损伤所导致，焊点的寿命预测对电子产品的可靠性研究具有重要意义。金属间化合物(MC)厚度是衡量 焊点质量的重要参数，本文以IMC层厚度为关键性能退化参数，以62Sn6Pb2Ag组装的QFP器件焊点为研究对象， 采用对在94℃，120℃和150℃三种温度贮存不同时间后的微观形貌进行观察，测量了IMC层的厚度，基于阿伦 尼乌斯方程建立了双侧界面金属间化合物生长动力学模型。并以其作为关键性能退化函数，通过对初始MC厚度进 行正态分布拟合获得失效密度函数，进而获得可靠度函数对焊点的长期贮存失效寿命进行了预测。本研究结果有望 对长期贮存焊点的寿命预测方式提供新的思路，为O2S36Pb2Ag钎料的可靠应用提供试验和数据支撑。 关键词62Sn36Pb2Ag:QFP器件：金属间化合物：软纤焊，长期贮存：寿命预测 分类号TB383.1 Long-term StorageLife Prediction and Growth Kinetics of Intermetallic Compounds in 62Sn36Pb2Ag solder joints ZHANG He,FENG Ji yun CONG Sen2,WANG Shang,AN Rong,WU Lang,TIAN Yan-hong 1)State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China 2)Institute of Electronic Engmneering,China Academy of Engineering Physics,Mianyang 621900,China Corresponding author E-mail:tianyh@hit.edu.cn ABSTRACT Tin-based alloy solder joints are indispensable key part of electronic products and the basis of realizing the functionalization of electronic components.The failure of electronic product is often caused by solder joint damage.Life prediction of the solder joint is of great significance for the reliability research of electronic products.Intermetallic compound (IMC)thickness is an important parameter to evaluate the quality of solder joints.In this paper,the thickness of IMC layer is taken as the key performance degradation parameter,and the assembly solder joints of 62Sn36Pb2Ag QFP device are taken as the research object.After reflowing process,CuSns and CuSn IMC phases were observed at the copper lead side,and (Cu Ni.x)Sns phase was observed at the PCB side.The evolution of interfacial microstructures was observed by scanning 败高日期2021-11-14 演自：黑龙江省“头雁”团队经费资助工程科学学报 DOI: 62Sn36Pb2Ag 组装焊点长期贮存界面化合物生长 动力学及寿命预测1 张 贺 1)，冯佳运 1)，丛 森 2)，王 尚 1)，安 荣 1)，吴 朗 1)，田艳红 1) 1) 哈尔滨工业大学先进焊接与连接国家重点实验室，哈尔滨 150001 2) 中国工程物理研究院电子工程研究所，绵阳 621900  通信作者，E-mail:tianyh@hit.edu.cn 摘 要 锡基合金焊接接头是电子产品不可或缺的关键部位，是实现电子元器件功能化的基础，电子整机失效往往由 于焊点的损伤所导致，焊点的寿命预测对电子产品的可靠性研究具有重要意义。金属间化合物（ IMC）厚度是衡量 焊点质量的重要参数，本文以 IMC 层厚度为关键性能退化参数，以 62Sn36Pb2Ag 组装的 QFP 器件焊点为研究对象， 采用对在 94 °C , 120 °C 和 150 °C 三种温度贮存不同时间后的微观形貌进行观察，测量了 IMC 层的厚度，基于阿伦 尼乌斯方程建立了双侧界面金属间化合物生长动力学模型。并以其作为关键性能退化函数，通过对初始 IMC 厚度进 行正态分布拟合获得失效密度函数，进而获得可靠度函数对焊点的长期贮存失效寿命进行了预测。本研究结果有望 对长期贮存焊点的寿命预测方式提供新的思路，为 62Sn36Pb2Ag 钎料的可靠应用提供试验和数据支撑。 关键词 62Sn36Pb2Ag；QFP 器件；金属间化合物；软钎焊；长期贮存；寿命预测 分类号 TB383.1 Long-term Storage Life Prediction and Growth Kinetics of Intermetallic Compounds in 62Sn36Pb2Ag solder joints ZHANG He1) , FENG Jia-yun1) , CONG Sen2) , WANG Shang1) , AN Rong1) , WU Lang1) , TIAN Yan-hong1)  1) State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China 2) Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621900, China  Corresponding author, E-mail: tianyh@hit.edu.cn ABSTRACT Tin-based alloy solder joints are indispensable key part of electronic products and the basis of realizing the functionalization of electronic components. The failure of electronic product is often caused by solder joint damage. Life prediction of the solder joint is of great significance for the reliability research of electronic products. Intermetallic compound (IMC) thickness is an important parameter to evaluate the quality of solder joints. In this paper, the thickness of IMC layer is taken as the key performance degradation parameter, and the assembly solder joints of 62Sn36Pb2Ag QFP device are taken as the research object. After reflowing process, Cu6Sn5 and Cu3Sn IMC phases were observed at the copper lead side, and (CuxNi1-x)6Sn5 phase was observed at the PCB side. The evolution of interfacial microstructures was observed by scanning 1收稿日期:2021-11-14 基金项目: 黑龙江省“头雁”团队经费资助 《工程科学学报》录用稿，https://doi.org/10.13374/j.issn2095-9389.2021.11.14.002 ©北京科技大学 2020 录用稿件，非最终出版稿