CD4518BMS. CD4520BMS Chip Dimensions and Pad Layouts d已己 93:3e 骂包包 图1 24-837 CD4518BMS CD4520BMS derived from the basic inch dimensions as indicated rid graduations are in mils (10-3 inch) METALLIZATION: Thickness: 11kA-14kA. AL. PASSIVATION: 10.4kA-15.6kA, Silane OND PADS: 0.004 inches x o ches min DIE THICKNESS: 0.0198 inches-00218 inches All Intersil semiconductor products are manufactured, assembled and tested under iso9000 quality systems certification notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information fumished by intersil is believed to be accurate and reliable. However, no responsibility is assumed by intersil or its subsidiaries for its use, nor for any infringements of patents or other nights of third parties which may resut from its use. No license is granted by implication or othenwise under any patent or patent nights of intersil or its subsidiaries. ForinformationregardingIntersilCorporationanditsproductsseewebsitehttp:/lwww.intersil.com Sales Office Headquarters NORTH AMERICA EUROPE ASIA Intersil Corporation Intersil SA Intersil (Taiwan) Ltd. P.O. Box 883, Mail Stop 53-204 Mercure Cente Taiwan Limited Melbourne, FL 32902 100. Rue de la Fusee 7F-6, No. 101 Fu Hsing North Road TEL:(321)724-7000 1130 Brussels, Belgium FAX:(321)724-7240 TEL:(32)27242111 Republic of chin FAX:(32)27242205 TEL:(886)227169310 FAX:(886)227153029 12151215 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029 CD4518BMS, CD4520BMS Chip Dimensions and Pad Layouts CD4518BMS CD4520BMS Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch). METALLIZATION: Thickness: 11kÅ − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6kÅ, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches