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. Corni et al Jounal of the European Ceramic Sociery 28(2008)1353-1367 4. Conclusions 8. Boccaccini, A. R, Roether, J. A, Thomas, B. J. C. Shaffer, M. S.P. Chavez, E, Stoll, E. et al., The electrophoretic deposition of inorganic Electrophoretic deposition is a very versatile and cost- nanoscaled materials. J. Ceram. Soc. Jpn., 2006, 114, 1-14 effective material processing technique, offering control over Kanamura, K and Hamagami, J, Innovation of novel functional material nano and microstructure, stoichiometry, microscopic and macro- State Ionics,2004,172,303-308 scopic dimensions and properties. In the last 10 years there 10 Boccaccini, A.R., Van der Biest, O. 0 and Talbot, J.B,ed, has been a considerable increase of the areas of application of Electrophoretic Deposition: Fundamental and Applications. The Electro- EPD, such as production of ceramic layers for solid oxide fuel chemical Society, Pennington, US. 2002. cells and fabrication of ceramic matrix composites, functionally 11. Boccaccini, A R, Van der Biest O. O and Clasen, R, ed, E graded materials, laminated ceramics and advanced coatings Deposition: Fundamentals and Applications l1. Key Eng. M for tribological and functional applications as well as manip- 12. Fukada, Y, Nagarajan, N, Mekky, W,Bao, Y, Kim, H.S.and Nicholson, P. ulation of nanoparticles, nanotubes and other nanostructures. S, Electrophoretic deposition mechanisms, myths and materials. J. Mater Moreover Epd demonstrates substantial technical advantages Sci,2004,39,787-801 compared with other fabrication routes due to the fact that it 13. Hamaker, H C, Formation of deposition by electrophoresis. Trans. Farad. Soc,1940,36,279-283 operates at low temperatures, can be easily scaled up usin 14. Hamaker, H. C and Verwey, E.J. w, The role of the forces between the inexpensive equipment and, consequently, this method has the particles in electrodeposition and other phenomena. Trans. Farad. Soc. 1940.36,180-185 duction. Specific areas where EpD is expected to expand are: 15. Grillon, F Fayeulle, D. and Jeandin, M, Quantitative image-analysis of fabrication of nanostructured and hybrid composite materials, 16. Brown, D R. and Salt, E. W. The mechanism of electrophoretic deposition functionally graded materials, laminated nanoceramics as well JApp.Chem,1965,15,40-48. as nanostructured films and coatings for functional applications, 17. Koelmans, H, Philips Res. Rep, 1955, 10, 161-193 in the electric, superconducting, semiconducting, optical, mag 18. Solomentsev, Y, Guelcher, S A, Bevan, M. and Anderson. J L, Aggre- netic and biomedical fields gation dynamics for two particles during electrophoretic deposition under It is also recognized that further research efforts in the areas eady fields. La of analytical and numerical modelling of the mechanisms of …,00069208-9216 19. Sides, P J, Electrodynamically particle aggregation on an elec by an alternating electric field normal to it. Langmuir, 2001, 17, electrophoretic deposition are necessary, in order to change the 20. Guelcher, S.A., Solomentsev, Y. and Anderson, J. L, Agg empirical, often non-satisfactory and time consuming trial-and airs of particles on electrodes during electrophoretic deposition. Powder error approaches which have dominated the experimental work Technol.,2000.110.90-97 and technological developments in the area so far. A holistic 21. Perez, A T. Saville, D and Soria, C, Modeling the electrophoretic de 22. Greil, P. Cordelair, J. and Bezold. A. Discrete element simulation of of processing/structure/property relationships will allow better ceramic powder processing. Z. Metallk, 2001, 92, 682-689. design of EPD systems for given applications 23. Sarkar, P. De, D, Yamashita, K.Nicholson. P. S. and Umegaki, T. Mimicking nanometer atomic processes on a micrometer scale via elec- Acknowledgements trophoretic deposition. J. Am. Ceram Soc., 2000, 83, 1399-1401 24. Anne, G, Vanmeensel, K, vleugels, J. and Van der Biest, O.O,A mathematical description of the kinetics of the electrophoretic deposition The authors gratefully acknowledge the financial support of process for Al2O3-based suspensions. J. Am. Cerar. Soc., 2005, 88, 2036- Ing grant(MEST-CT-2004-514661). 25. Anne, G- Neirinck, B, Vanme We also thank Dr. E. Jane Minay(now with British Energy, UK) for her input and helpful discussions. J, Influence of electrostatic interactions in the deposit on the electrical field strength during electrophoretic deposition. Electrophoretic Deposi tion: Fundamentals and Applications ll. Key Eng Mater, 2006. 314, 18 References 186. 26. Anne, G, Neirinck, B, Vanmeensel, K. Van der Biest, O. and vleugels, J. 1. Sarkar, P and Nicholson, P. S, Electrophoretic deposition(EPD): mecha- Throwing power during electrophoretic deposition. Electrophoretic Depo- ism, kinetics and application to ceramics. J. Am. Ceram. Soc., 1996, 79, 1987-2002 Cation: Fundamentals and Applications Il. Key Eng. Mater, 2006, 314, 2. Boccaccini, A.R. and Zhitomirsky, I, Application of electrophoretic and 27. Anne, G Neirinck, B-Vanmeensel, K, Van der Biest, O and vleugels, electrolytic deposition techniques in ceramics processing. Curr Opin. Solid J, Origin of the potential drop over the deposit during electrophoretic position.JAm Ceram. Soc., 2006, 89, 823-828 3. Van der Biest, O. O and Vandeperre, L.J., Electrophoretic deposition of 28. Van Tassel, J.J. and Randall,C.A. Role of ion depletion on the elec- materials. Annu. Rev. Mater Sci., 1999, 29, 327-352. trophoretic deposition of alumina powder from ethanol with increasing 4. Heavens, S N Electrophoretic deposition as a processing route for ceram- quantities of HCL. J. Mater. Sci, 2006, 41. 8031-8046 ics. Advanced Ceramic Processing and Technology. Noyes Publications 29. Ristenpart, w. D, Aksay, I. A. and Saville, D. A, Electrohydrodynamic ow around a colloidal particle near an electrode with an oscillating poten 5. Besra, L and Liu, M, A review on fundamentals and applications of tial. J. Fluid Mech. 2007. 575, 83-109. electrophoretic deposition(EPD). Prog. Mater. Sci., 2007, 52, 1-61 30 Ristenpart, W.D., Aksay, I.A. and Saville, D. A, Electrically driven 6. Gani, M. S.J. Electrophoretic depositio ow near a colloidal particle close to an electrode with a faradaic current. 14.163-174 ignor,2007,23,4071-4080 7. Boccaccini,A.R, Cho, J, Roether, J.A., Thomas, B. J.C., Minay, E. 31. Clark, D. E, Dalzell, w.J. and Folz, D. C, Electrophoretic alumina M. SP, Electrophoretic deposition of carbon nanotubes. Hgel coatings on metallic substrates. Ceram. Eng. Sci. Proc., 1988.9 3149-31I. Corni et al. / Journal of the European Ceramic Society 28 (2008) 1353–1367 1363 4. Conclusions Electrophoretic deposition is a very versatile and cost￾effective material processing technique, offering control over nano and microstructure, stoichiometry, microscopic and macro￾scopic dimensions and properties. In the last 10 years there has been a considerable increase of the areas of application of EPD, such as production of ceramic layers for solid oxide fuel cells and fabrication of ceramic matrix composites, functionally graded materials, laminated ceramics and advanced coatings for tribological and functional applications as well as manip￾ulation of nanoparticles, nanotubes and other nanostructures. Moreover EPD demonstrates substantial technical advantages compared with other fabrication routes due to the fact that it operates at low temperatures, can be easily scaled up using inexpensive equipment and, consequently, this method has the potential to lead to commercial success and large-scale pro￾duction. Specific areas where EPD is expected to expand are: fabrication of nanostructured and hybrid composite materials, functionally graded materials, laminated nanoceramics as well as nanostructured films and coatings for functional applications, in the electric, superconducting, semiconducting, optical, mag￾netic and biomedical fields. It is also recognized that further research efforts in the areas of analytical and numerical modelling of the mechanisms of electrophoretic deposition are necessary, in order to change the empirical, often non-satisfactory and time consuming trial-and￾error approaches which have dominated the experimental work and technological developments in the area so far. A holistic understanding of the mechanisms involved and development of processing/structure/property relationships will allow better design of EPD systems for given applications. Acknowledgements The authors gratefully acknowledge the financial support of the EU Marie Curie training grant (MEST-CT-2004-514667). We also thank Dr. E. Jane Minay (now with British Energy, UK) for her input and helpful discussions. References 1. Sarkar, P. and Nicholson, P. S., Electrophoretic deposition (EPD): mecha￾nism, kinetics and application to ceramics. J. Am. Ceram. Soc., 1996, 79, 1987–2002. 2. Boccaccini, A. R. and Zhitomirsky, I., Application of electrophoretic and electrolytic deposition techniques in ceramics processing.Curr. Opin. Solid State Mater. Sci., 2002, 6, 251–260. 3. Van der Biest, O. O. and Vandeperre, L. J., Electrophoretic deposition of materials. Annu. Rev. Mater. Sci., 1999, 29, 327–352. 4. Heavens, S. N., Electrophoretic deposition as a processing route for ceram￾ics. Advanced Ceramic Processing and Technology. Noyes Publications, New Jersey, 1990, pp. 255–283. 5. Besra, L. and Liu, M., A review on fundamentals and applications of electrophoretic deposition (EPD). Prog. Mater. Sci., 2007, 52, 1–61. 6. Gani, M. S. J., Electrophoretic deposition. A review. Ind. Ceram., 1994, 14, 163–174. 7. Boccaccini, A. R., Cho, J., Roether, J. A., Thomas, B. J. C., Minay, E. J. and Shaffer, M. S. P., Electrophoretic deposition of carbon nanotubes. Carbon, 2006, 44, 3149–3160. 8. Boccaccini, A. R., Roether, J. A., Thomas, B. J. C., Shaffer, M. S. P., Chavez, E., Stoll, E. et al., The electrophoretic deposition of inorganic nanoscaled materials. J. Ceram. Soc. Jpn., 2006, 114, 1–14. 9. Kanamura, K. and Hamagami, J., Innovation of novel functional material processing technique by using electrophoretic deposition process. Solid State Ionics, 2004, 172, 303–308. 10. Boccaccini, A. R., Van der Biest, O. O. and Talbot, J. B., ed., Electrophoretic Deposition: Fundamental and Applications. The Electro￾chemical Society, Pennington, US, 2002. 11. Boccaccini, A. R., Van der Biest, O. O. and Clasen, R., ed., Electrophoretic Deposition: Fundamentals and Applications II. Key Eng. Mater., 2006, Vol 314. 12. Fukada, Y., Nagarajan, N., Mekky, W., Bao, Y., Kim, H. S. and Nicholson, P. S., Electrophoretic deposition mechanisms, myths and materials. J. Mater. Sci., 2004, 39, 787–801. 13. Hamaker, H. C., Formation of deposition by electrophoresis. Trans. Farad. Soc., 1940, 36, 279–283. 14. Hamaker, H. C. and Verwey, E. J. W., The role of the forces between the particles in electrodeposition and other phenomena. Trans. Farad. Soc., 1940, 36, 180–185. 15. Grillon, F., Fayeulle, D. and Jeandin, M., Quantitative image-analysis of electrophoretic coatings. J. Mater. Sci. Lett., 1992, 11, 272–275. 16. Brown, D. R. and Salt, F. W., The mechanism of electrophoretic deposition. J. Appl. Chem., 1965, 15, 40–48. 17. Koelmans, H., Philips Res. Rep., 1955, 10, 161–193. 18. Solomentsev, Y., Guelcher, S. A., Bevan, M. and Anderson, J. L., Aggre￾gation dynamics for two particles during electrophoretic deposition under steady fields. Langmuir, 2000, 16, 9208–9216. 19. Sides, P. J., Electrodynamically particle aggregation on an electrode driven by an alternating electric field normal to it. Langmuir, 2001, 17, 5791–5800. 20. Guelcher, S. A., Solomentsev, Y. and Anderson, J. L., Aggregation of pairs of particles on electrodes during electrophoretic deposition. Powder Technol., 2000, 110, 90–97. 21. Perez, A. T., Saville, D. and Soria, C., Modeling the electrophoretic depo￾sition of colloidal particles. Europhys. Lett., 2001, 55, 425–431. 22. Greil, P., Cordelair, J. and Bezold, A., Discrete element simulation of ceramic powder processing. Z. Metallk., 2001, 92, 682–689. 23. Sarkar, P., De, D., Yamashita, K., Nicholson, P. S. and Umegaki, T., Mimicking nanometer atomic processes on a micrometer scale via elec￾trophoretic deposition. J. Am. Ceram. Soc., 2000, 83, 1399–1401. 24. Anne, G., Vanmeensel, K., Vleugels, J. and Van der Biest, O. O., A mathematical description of the kinetics of the electrophoretic deposition process for Al2O3-based suspensions. J. Am. Ceram. Soc., 2005, 88, 2036– 2039. 25. Anne, G., Neirinck, B., Vanmeensel, K., Van der Biest, O. and Vleugels, J., Influence of electrostatic interactions in the deposit on the electrical field strength during electrophoretic deposition. Electrophoretic Deposi￾tion: Fundamentals and Applications II. Key Eng. Mater., 2006, 314, 181– 186. 26. Anne, G., Neirinck, B., Vanmeensel, K., Van der Biest, O. and Vleugels, J., Throwing power during electrophoretic deposition. Electrophoretic Depo￾sition: Fundamentals and Applications II. Key Eng. Mater., 2006, 314, 187–191. 27. Anne, G., Neirinck, B., Vanmeensel, K., Van der Biest, O. and Vleugels, J., Origin of the potential drop over the deposit during electrophoretic deposition. J. Am. Ceram. Soc., 2006, 89, 823–828. 28. Van Tassel, J. J. and Randall, C. A., Role of ion depletion on the elec￾trophoretic deposition of alumina powder from ethanol with increasing quantities of HCl. J. Mater. Sci., 2006, 41, 8031–8046. 29. Ristenpart, W. D., Aksay, I. A. and Saville, D. A., Electrohydrodynamic flow around a colloidal particle near an electrode with an oscillating poten￾tial. J. Fluid Mech., 2007, 575, 83–109. 30. Ristenpart, W. D., Aksay, I. A. and Saville, D. A., Electrically driven flow near a colloidal particle close to an electrode with a faradaic current. Langmuir, 2007, 23, 4071–4080. 31. Clark, D. E., Dalzell, W. J. and Folz, D. C., Electrophoretic alumina sol–gel coatings on metallic substrates. Ceram. Eng. Sci. Proc., 1988, 9, 1111–1118
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