·1040· 工程科学学报，第39卷，第7期 Lea (Al)+0(CuAl)+S(CuMgAl,).(3) B] Zhao L,Cui C X.Liu S J,et al.Microstructure and mechanical 三元相的共晶温度是507℃，远低于本文采用的 properties of TC4 alloy modified and reinforced by TiB TiN/Ti 热等静压温度.过烧成分的组成随着温度的增加，经 inoculants ribbons.Mater Sci Eng A,2016,663:8 4 Immarigeon J P.Holt R T,Koul A K,et al.Lightweight materials 历了从重熔共晶到三角结晶区的变化.除此之外，柯 for aircraft applications.Mater Charact,1995,35(1):41 肯达尔效应还导致了在A2A12一侧孔隙的形成.过 [5]Fukutomi H,Nakamura M,Suzuki T,et al.Void formation by 烧和孔隙得共同作用使得力学性能下降.断裂和剥落 the reactive diffusion of titanium and aluminum foils.Mater Trans, 容易在过烧区和孔隙处发生，试验中所有的断裂均发 JM,2000,41(9):1244 生在扩散区靠近A12A12一侧也验证了这一结论.根 [6]Wei Y N,Li J L,Xiong J T,et al.Joining aluminum to titanium 据图8断口的形貌分析可知，断裂方式是脆性断裂. alloy by friction stir lap welding with cutting pin.Mater Charact, 2012,71:1 Ren J W,Li Y J,Feng T.Microstructure characteristics in the in- terface zone of Ti/Al diffusion bonding.Mater Lett,2002,56 (5):647 [8]Alhazaa A N,Khan T I.Diffusion bonding of Al7075 to Ti-6Al- 4V using Cu coatings and Sn-3.6Ag-1Cu interlayers.J Alloys Compd,2010,494(12):351 [9]Kenevisi M S,Khoie S MM.A study on the effect of bonding time on the properties of Al7075 to Ti-6Al-4V diffusion bonded joint.Mater Lett,2012,76:144 [10]Samavatian M,Halvace A,Amadeh AA,et al.An investigation 图8断口处扫描电镜照片 on microstructure evolution and mechanical properties during liq- Fig.8 SEM micrograph of the fracture uid state diffusion bonding of Al2024 to Ti-6Al-4V.Mater Charact,2014,98:113 [11]Alhazaa A,Khan T I,Hag I.Transient liquid phase (TLP) 3结论 bonding of Al7075 to Ti-6Al-4V alloy.Mater Charact,2010, (1)采用热等静压工艺连接T6Al4V固体和 61(3):312 A2A12粉末，在590℃，130MPa,保温2.5h的条件下 [12]Sohn W H,Bong HH,Hong S H.Microstructure and bonding 制备成功 mechanism of Al/Ti bonded joint using Al-10Si-1Mg filler met- al.Mater Sci Eng A,2003,355(12)231 (2)Ti/1之间不同的扩散速度引发三种不同金 [13]Okamoto H.Al-Ti alumnium-titanium).J Phase Equilib, 属化合物的形成，分别是ALTi、TiAL,和TiL. 1993,14(1):120 (3)扩散连接处的硬度值是163HV,较软反应层 14]Xu L,Cui YY,Hao YL,et al.Growth of intermetallic layer in 的形成导致该值比基体材料的低. multi-aminated Ti/Al diffusion couples.Mater Sci Eng A, (4)剪切强度比只有22μm铜镀层而没有其他中 2006,435436:638 间层的高了约17.9%，但低于带有中间层的连接强 [15]Luo J G,Acoff V L.Using cold roll bonding and annealing to 度.由于过烧和孔隙的形成使得断裂方式是脆性 process Ti/Al multi-ayered composites from elemental foils.Ma- ter Sci Eng A,2004,379(12):164 断裂. [16]Liu J P,Luo L S,Su Y Q,et al.Numerical simulation of inter- mediate phase growth in Ti/Al alternate foils.Trans Nonferrous 参考文献 Met Soc China,2011,21(3):598 [1]Yan J,Zeng X Y,Gao M,et al.Effect of welding wires on micro- [17]Romankov S,Sha W,Ermakov E,et al.Characterization of alu- structure and mechanical properties of 2A12 aluminum alloy in minized layer formation during annealing of Ti coated with an Al CO2 laser-MIG hybrid welding.Appl Surf Sci,2009,255 (16): film.J Alloys Compd,2006,420(12):63 7307 [18]De Wilde J,Froyen L,Rex S.Coupled two-phase Lo (Al)+ Dong H G,Yu L Z,Deng D W,et al.Effect of post-weld heat (AlCu]planar growth and destabilisation along the univariant treatment on properties of friction welded joint between TCA titanium eutectic reaction in Al-Cu-Ag alloys.Scr Mater,2004,51 (6): alloy and 40Cr steel rods.J Mater Sci Technol,2015,31(9):962 533工程科学学报，第 39 卷，第 7 期 Lα( Al) + θ( CuAl2 ) + S( CuMgAl2 ) ． ( 3) 三元相的共晶温度是 507 ℃，远低于本文采用的 热等静压温度． 过烧成分的组成随着温度的增加，经 历了从重熔共晶到三角结晶区的变化． 除此之外，柯 肯达尔效应还导致了在 Al2A12 一侧孔隙的形成． 过 烧和孔隙得共同作用使得力学性能下降． 断裂和剥落 容易在过烧区和孔隙处发生，试验中所有的断裂均发 生在扩散区靠近 Al2A12 一侧也验证了这一结论． 根 据图 8 断口的形貌分析可知，断裂方式是脆性断裂． 图 8 断口处扫描电镜照片 Fig． 8 SEM micrograph of the fracture 3 结论 ( 1) 采 用 热 等 静 压 工 艺 连 接 Ti6Al4V 固 体 和 Al2A12 粉末，在 590 ℃，130 MPa，保温 2. 5 h 的条件下 制备成功． ( 2) Ti /Al 之间不同的扩散速度引发三种不同金 属化合物的形成，分别是 Al3Ti、TiAl2和 TiAl． ( 3) 扩散连接处的硬度值是 163 HV，较软反应层 的形成导致该值比基体材料的低． ( 4) 剪切强度比只有 22 μm 铜镀层而没有其他中 间层的高了约 17. 9% ，但低于带有中间层的连接强 度． 由于过烧和孔隙的形成使得断裂方式是脆性 断裂． 参 考 文 献 ［1］ Yan J，Zeng X Y，Gao M，et al． Effect of welding wires on micro￾structure and mechanical properties of 2A12 aluminum alloy in CO2 laser-MIG hybrid welding． Appl Surf Sci，2009，255 ( 16) : 7307 ［2］ Dong H G，Yu L Z，Deng D W，et al． Effect of post-weld heat treatment on properties of friction welded joint between TC4 titanium alloy and 40Cr steel rods． J Mater Sci Technol，2015，31( 9) : 962 ［3］ Zhao L，Cui C X，Liu S J，et al． Microstructure and mechanical properties of TC4 alloy modified and reinforced by TiB + TiN /Ti inoculants ribbons． Mater Sci Eng A，2016，663: 8 ［4］ Immarigeon J P，Holt Ｒ T，Koul A K，et al． Lightweight materials for aircraft applications． Mater Charact，1995，35( 1) : 41 ［5］ Fukutomi H，Nakamura M，Suzuki T，et al． Void formation by the reactive diffusion of titanium and aluminum foils． Mater Trans， JIM，2000，41( 9) : 1244 ［6］ Wei Y N，Li J L，Xiong J T，et al． Joining aluminum to titanium alloy by friction stir lap welding with cutting pin． Mater Charact， 2012，71: 1 ［7］ Ｒen J W，Li Y J，Feng T． Microstructure characteristics in the in￾terface zone of Ti /Al diffusion bonding． Mater Lett，2002，56 ( 5) : 647 ［8］ Alhazaa A N，Khan T I． Diffusion bonding of Al7075 to Ti--6Al-- 4V using Cu coatings and Sn--3． 6Ag--1Cu interlayers． J Alloys Compd，2010，494( 1-2) : 351 ［9］ Kenevisi M S，Khoie S M M． A study on the effect of bonding time on the properties of Al7075 to Ti--6Al--4V diffusion bonded joint． Mater Lett，2012，76: 144 ［10］ Samavatian M，Halvaee A，Amadeh A A，et al． An investigation on microstructure evolution and mechanical properties during liq￾uid state diffusion bonding of Al2024 to Ti--6Al--4V． Mater Charact，2014，98: 113 ［11］ Alhazaa A，Khan T I，Haq I． Transient liquid phase ( TLP) bonding of Al7075 to Ti--6Al--4V alloy． Mater Charact，2010， 61( 3) : 312 ［12］ Sohn W H，Bong H H，Hong S H． Microstructure and bonding mechanism of Al /Ti bonded joint using Al--10Si--1Mg filler met￾al． Mater Sci Eng A，2003，355( 1-2) : 231 ［13］ Okamoto H． Al--Ti ( alumnium--titanium) ． J Phase Equilib， 1993，14( 1) : 120 ［14］ Xu L，Cui Y Y，Hao Y L，et al． Growth of intermetallic layer in multi-laminated Ti /Al diffusion couples． Mater Sci Eng A， 2006，435-436: 638 ［15］ Luo J G，Acoff V L． Using cold roll bonding and annealing to process Ti /Al multi-layered composites from elemental foils． Ma￾ter Sci Eng A，2004，379( 1-2) : 164 ［16］ Liu J P，Luo L S，Su Y Q，et al． Numerical simulation of inter￾mediate phase growth in Ti /Al alternate foils． Trans Nonferrous Met Soc China，2011，21( 3) : 598 ［17］ Ｒomankov S，Sha W，Ermakov E，et al． Characterization of alu￾minized layer formation during annealing of Ti coated with an Al film． J Alloys Compd，2006，420( 1-2) : 63 ［18］ De Wilde J，Froyen L，Ｒex S． Coupled two-phase ［α( Al) + θ ( Al2Cu) ］planar growth and destabilisation along the univariant eutectic reaction in Al--Cu--Ag alloys． Scr Mater，2004，51( 6) : 533 · 0401 ·