·542· 北京科技大学学报 2000年第6期 Texture Effect of Interconnection Thin Films in Very Large-Scale Integrated Electronic Circuits MAO Weimin,ZHANG Hong 1)Materials Science and Engineering School,UST Beijing,Beijing 100083 China 2)Applied Materials,California 95054,USA ABSTRACT The texture of interconnecting aluminum films prepared by conventional and modified tech- nology was examined using X-ray diffraction.It is demonstrated,that the high volume fraction and high sha- rpness of the {111)fiber texture will drastically reduce the invalidation ratio of very large-scale integrated elec- tronic circuits.The reasons of invalidation and the positive effects of the {111)fiber texture are discussed.It is pointed out,that attention should be paid to the corresponding texture problems in new interconnecting cop- per films. KEY WORDS aluminum film;internal stress;fiber texture;interconnection Thermodynamic Study on Process in Copper Converters (The Copper-making Stage) CHEN Chunlin,ZHANG Jiayun,AHOU Tuping,WEI Shoukun, LU Xingxiang,BAI Mengi,JIANGJinhong 1)Metallurgy School,University of Science and Technology Beijing.Beijing 100083,China 2)Guixi Smelter,Jiangxi,335424 Abstract:Theoretical calculations were based on thermodynamic equilibrium in the multi-component and multi-phase system with heat and mass balance as well as the oxygen efficiency to take account for the effects of process kinetics.The variations of temperature,mass fractions of dissolved oxygen and sulfur in blister cop- per,partial pressures for O,S2,SO:in gas phase for the copper-making stage were calculated.The model pre- dicted temperature,time of blowing as well as mass of the blister copper at end points for 6 heats showed a fairly good agreements with corresponding plant data.The calculated O content of 0.065%and S content of 0.87%in blister copper were both at reasonable levels.Compared with the so called Goto model,the present model has very much improved process description of copper-making stage as well as the prediction of end points for a copper converter by introducing the oxygen efficiency. Key words:Peirce-Smith copper converter;thermodynamic model;copper-making stage [Journal of University of Science and Technology Beijing(English Edition),1999,7(3),184]引 北 京 科 技 大 学 学 报 年 第 期 犷 一 五侧口 肠 礼 月只 心 ， ， ， 创比 ， ， 仅 比 。 切 田力 份 比 印 毛 吨 一 廿曲 山 止 ， 也掀 印 甘 “ 访 加 止 时 一 月 万 ， 月只刀 刁 ， 乃切吨 气 砰百了 。 “ 加 ， 川笋 犷气 馆 ， 刀刁刃 天” 心 因 试留 ， ， 吨 ， 丘恤 加 几 】 ， 由瓜 一 找 琳 的 山 切吐 场 ， 姆 ， ， ， 仪 、 ， ’ 旦 幼 旦 ， 扰 吨 叮 一 七 比 勿 妙 哪沙 扩动 忍 ， ，