Process Flow- Overview Unexposed Si口 5U-8(100 Surface treatment PDMS photolithography PDMS口 UV light Si口 removing elastomer from Si口 master development PDMS囗 seal against glass after plasma treatment and insert tubi ing Si口 master tubing Our process was changed lere Fall 2003-MA schmidt 3. 155J/ 6. 152]-Lecture 22-Slide 4Process Flow - Overview Si Unexposed SU-8 (100 µm) Surface treatment & casting PDMS photolithography UV light Si mask Si PDMS removing elastomer from master development Si ing “master” here PDMS seal against glass after plasma treatment and insert tub tubing Our process was changed Fall 2003 – M.A. Schmidt 3.155J/6.152J – Lecture 22 – Slide 4