Type I H Hh CommeNts Type I H Type Ill Intel does not recommond active devices be im in solder wan FIGURE 26. 2 Type I, Il, and III SMT circuit boards. Source: Intel Corporation, Packaging, Santa Clara, Calif: Intel Corporation, 1994. with permission. small active components such as transistors. This type board requires both reflow and wave soldering, and will require placement of bottom-side SMDs in adhesive Type Ill- top side has only through-hole components, which may be active and/or passive, while the bottom side has passive and small active SMDs. This type board uses wave soldering only, and also requires placement of the bottom-side SMDs in adhesive. It should be noted that with the ongoing increase in usage of various techniques to place IC dice directly on circuit boards, Type III in some articles means a mix of packaged SMT ICs and bare die on the same board. A Type I bare board will first have solder paste applied component pads on the board paste has been deposited, active and passive parts are placed in the paste For prototype and low-volume lines this can be done with manually guided X-Y tables using vacuum needles to hold the components, while in medium and high-volume lines automated placement equipment is used. This equipment will pick parts from c 2000 by CRC Press LLC© 2000 by CRC Press LLC small active components such as transistors. This type board requires both reflow and wave soldering, and will require placement of bottom-side SMDs in adhesive. Type III — top side has only through-hole components, which may be active and/or passive, while the bottom side has passive and small active SMDs. This type board uses wave soldering only, and also requires placement of the bottom-side SMDs in adhesive. It should be noted that with the ongoing increase in usage of various techniques to place IC dice directly on circuit boards, Type III in some articles means a mix of packaged SMT ICs and bare die on the same board. A Type I bare board will first have solder paste applied to the component pads on the board. Once solder paste has been deposited, active and passive parts are placed in the paste. For prototype and low-volume lines this can be done with manually guided X–Y tables using vacuum needles to hold the components, while in medium and high-volume lines automated placement equipment is used. This equipment will pick parts from FIGURE 26.2 Type I, II, and III SMT circuit boards. (Source: Intel Corporation, Packaging, Santa Clara, Calif.: Intel Corporation, 1994. With permission.)