第10期 童震松等：镀层对金刚石/玻璃复合材料性能的影响 ·1347· 2006,21(2):267 Nonferrous Met,2013,23(1)802 (王悦辉，周济，崔学民，等.低温共烧陶瓷(LTCC)技术在材 (陈代刚，于家康，于威，等.镀层厚度对镀钛金刚石/铝复合 料学上的进展.无机材料学报，2006,21(2)：267) 材料热导率的影响.中国有色金属学报，2013,23(1)：802) [6]Tong Z S,Sheng Z S,Zhang Y J.Preparation and properties of [15]Zhang W K,Peng F,Guo Z T,et al.Research on thermal con- diamond/glass composite materials with high thermal conductivity. ductivity of diamond with Cr,Ti coating/copper composite mate- Electron Compon Mater,2009,28(11):52 rials by sintering under high pressure.Chin J High Pressure (童震松，沈卓身，张毓隽.高导热金刚石玻璃复合材料的制 Phs,2012,26(3):306 备和性能研究.电子元件与材料，2009,28(11)：52) (张文凯，彭放，郭振堂，等.高压烧结镀C、T膜金刚石/铜 Zhao H S,Chen L.Gao N Z,et al.Low temperature sintering 复合材料热导率研究.高压物理学报，2012,26(3)：306) and performance of aluminum nitride/borosilicate glass.Zhejiang 6 Xue C,Yu J K.Enhanced thermal conductivity in diamond/alu- niv Sci A,2009,10(1):109 minum composites:comparison between the methods of adding Ti [8]Williams CT,Demetry C.Li R.Structure 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nology Beijing,2009 tion of carbide interface layer.Diamond Relat Mater,2014,46: (张毓隽.电子封装用铜金刚石复合材料的研究[学位论 35 文].北京：北京科技大学，2009) [14]Chen D G,Yu J H,Yu W,et al.Effect of coating thickness on 22]Agari Y,Uno T.Estimation on thermal conductivities of filled thermal conductivity of Ti-coated diamond/Al composites.ChinJ polymers.J Appl Polym Sci,1986,32(5):705第 10 期 童震松等: 镀层对金刚石/玻璃复合材料性能的影响 2006，21( 2) : 267 ( 王悦辉，周济，崔学民，等． 低温共烧陶瓷( LTCC) 技术在材 料学上的进展． 无机材料学报，2006，21( 2) : 267) ［6］ Tong Z S，Sheng Z S，Zhang Y J． Preparation and properties of diamond /glass composite materials with high thermal conductivity． Electron Compon Mater，2009，28( 11) : 52 ( 童震松，沈卓身，张毓隽． 高导热金刚石/玻璃复合材料的制 备和性能研究． 电子元件与材料，2009，28( 11) : 52) ［7］ Zhao H S，Chen L，Gao N Z，et al． Low temperature sintering and performance of aluminum nitride / borosilicate glass． J Zhejiang Univ Sci A，2009，10( 1) : 109 ［8］ Williams C T，Demetry C，Li Ｒ． Structure and strength of inter￾faces in titanium-coated diamond-glass composites． Ceram Eng Sci Proc，2000，21( 3) : 697 ［9］ Lin K H，Peng S F，Lin S T． Sintering parameters and wear per￾formances of vitrified bond diamond grinding wheels． Int J Ｒefract Met Hard Mater，2007，25( 1) : 25 ［10］ Lee M T，Chung C Y，Yen S C，et al． High thermal conductive diamond /Ag--Ti composites fabricated by low-cost cold pressing and vacuum liquid sintering techniques． Diamond Ｒelat Mater， 2014，44: 95 ［11］ Zhang X M，Guo H，Yin F Z，et al． Influences of Cr element on interface structures and thermal properties of diamond /Cu com￾posites． Chin J Ｒare Met，2010，34( 2) : 221 ( 张习敏，郭 宏，尹法章，等． Cr 元素对 Diamond/Cu 复合材料界 面结构及热导性能的影响． 稀有金属，2010，34( 2) : 221) ［12］ Yin F Z，Guo H，Zhang X M，et al． Effect of Ti on microstruc￾tures and properties of diamond /copper composites． Acta Mater Compos Sin，2010，28( 3) : 138 ( 尹法章，郭宏，张习敏，等． 添加微量 Ti 元素对 Diamond /Cu 复合材料组织及性能的影响． 复合材料学报，2010，27( 3) : 138) ［13］ Yang W L，Peng K，Zhu J J，et al． Enhanced thermal conduc￾tivity and stability of diamond /aluminum composite by introduc￾tion of carbide interface layer． Diamond Ｒelat Mater，2014，46: 35 ［14］ Chen D G，Yu J H，Yu W，et al． Effect of coating thickness on thermal conductivity of Ti-coated diamond /Al composites． Chin J Nonferrous Met，2013，23( 1) : 802 ( 陈代刚，于家康，于威，等． 镀层厚度对镀钛金刚石/铝复合 材料热导率的影响． 中国有色金属学报，2013，23( 1) : 802) ［15］ Zhang W K，Peng F，Guo Z T，et al． Ｒesearch on thermal con￾ductivity of diamond with Cr，Ti coating /copper composite mate￾rials by sintering under high pressure． Chin J High Pressure Phys，2012，26( 3) : 306 ( 张文凯，彭放，郭振堂，等． 高压烧结镀 Cr、Ti 膜金刚石/铜 复合材料热导率研究． 高压物理学报，2012，26( 3) : 306) ［16］ Xue C，Yu J K． Enhanced thermal conductivity in diamond /alu￾minum composites: comparison between the methods of adding Ti into Al matrix and coating Ti onto diamond surface． Surf Coat Technol，2013，217: 46 ［17］ Tong Z S，Shen Z S，Xing Y． Properties of Ti-coated diamond￾reinforced glass matrix composites． J Univ Sci Technol Beijing， 2014，36( 7) : 946 ( 童震松，沈卓身，邢奕． 镀钛金刚石增强玻璃基复合材料的 性能． 北京科技大学学报，2014，36( 7) : 946) ［18］ Tong Z S，Zhang Y J，Shen Z S． Controlled oxidation of copper coatings on the surfaces of diamond particles． J Univ Sci Technol Beijing，2009，31( 6) : 733 ( 童震松，张毓隽，沈卓身． 金刚石颗粒表面镀铜层的控制氧 化． 北京科技大学学报，2009，31( 8) : 733) ［19］ Michaelsen C，Barmak K，Weihs T． Investigating the thermody￾namics and kinetics of thin film reactions by differential scanning calorimetry． J Phys D，1997，30( 23) : 3167 ［20］ Ma W Y，Zhao Y H，Mai X． Effect of Cr coating on the thermal properties of Ag / diamond composites． Powder Metall Technol， 2014，32( 1) : 30 ( 马文跃，赵云辉，麦鑫． Cr 镀层对 Ag /金刚石复合材料热学 性能的影响． 粉末冶金技术，2014，32( 1) : 30) ［21］ Zhang Y J． Study on Cu /Diamond Composites for Electronic Pack￾aging ［Dissertation］． Beijing: University of Science and Tech￾nology Beijing，2009 ( 张毓隽． 电子封装用铜金刚石复合材料的研究［学 位 论 文］． 北京: 北京科技大学，2009) ［22］ Agari Y，Uno T． Estimation on thermal conductivities of filled polymers． J Appl Polym Sci，1986，32( 5) : 705 · 7431 ·