View of the Integrated circuit 双列直插式封装DIP 平面（扁平）封装 无引线陶瓷片式LCC Dual In-line Package Flat Pack Leadless Ceramic Chip 系统级封装SiP System in Package thermal flow hoat sproador providos thermal conduction bypass capacilo dia bottom surface OO■000■Obur5 top surface aminate substrate provides low-resistance interconnect LGA BGA providos mochanical stability BGA PGA electrical currents LGA=land grid array栅格阵列装 BGA=ball grid array焊球阵列 LGA PGA=pin grid array针栅阵列 PGA 2021/1/13 ASIC Design,by Yan Bo 9ASIC Design, by Yan Bo View of the Integrated circuit 2021/1/13 9 BGA 无引线陶瓷片式LCC Leadless Ceramic Chip 双列直插式封装DIP Dual In-line Package PGA 平面（扁平）封装 Flat Pack LGA = land grid array栅格阵列装 BGA = ball grid array 焊球阵列 PGA = pin grid array 针栅阵列 系统级封装SiP System in Package LGA