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第2期 刘嘉斌等：C一Ag合金中析出相界面结构及其对合金性能的影响 .215. [3]Schneider-Muntau HJ.Han K,Bednar N A.et al.Materials for crostructure,mechanical and electrical characteristics of Cu-6 100T monocoil magnets.IEEE Trans Appl Supercond.2004.14 wt.%Ag microcomposites.Scripta Mater,2005,52:587 (2):1153 [15]Zhang L.Meng L.Microstructure and properties of Cu Ag [4]Pantsyrnyi VI.Status and perspectives for microcomposite wind- Cu Ag Cr and Cu-Ag-Cr-RE alloys.Mater Sci Technol, ing materials for high field pulsed magnets.IEEE Trans Appl Su- 2003,19:75 percond,.2002,12(1):1189 [16]Hirota T,Imai A.Kumano T,et al.Development of Cu-Ag [5]Hong S I,Hill M A.Microstructural stability and mechanical re- alloys conductor for high field magnet.IEEE Trans Magn. sponse to Cu-Ag microcomposite wires.Acta Mater,1998.46 1994,30(4):1891 (12):4111 [17]Sakai Y.Inoue K.Asano T,et al.Development of a high [6] Han K,Embury J D.Sims J R.et al.The fabrication,properties strength,high conductivity copper-silver alloy for pulsed mag and microstructure of Cu-Ag and Cu-Nb composite conductors. nets.IEEE Trans Magn,1992.28(1):288 Mater Sci Eng.1999.A267:99 [18]Han K.Vasquez AA,Xin Y,et al.Microstructure and tensile [7]Sakai Y,Schneider muntau H J.Ultra high strength high con- properties of nanostructured Cu 25wt%Ag Acta Mater, ductivity Cu-Ag alloy wires.Acta Mater.1997.45:1017 2003,51.767 [8]张雷，孟亮.应变程度对Cm一12%Ag合金纤维相形成及导电 [19]Grinberger W,Heilmaier M.Schultz L.Microstructure and 性能的影响.金属学报，2005,41(3)：255 mechanical properties of Cu-Ag microcomposites for conductor [9]张雷，孟亮.纤维相强化C一12%Ag合金的组织和力学性能 wires in pulsed high-field magnets.Z Metallkd.2002.93:58 中国有色金属学报，2005,15(5)：751 [20]Gaganov A.Freudenberger J.Grinberger W,et al.Mi- [10]Benghalem A,Morris D G.Microstructure and strength of wire- crostructural evolution and its effect on the mechanical properties drawn CuAg filamentary composites.Acta Mater.1997.45: of Cu-Ag microcomposites.Z Metallkd.2004.95:425 397 [21] 李振锋，张雷，孟亮.稀土元素对Cm6%Ag及Cm一24%Ag [11]Sakai Y.Inoue K.Asano T,et al.Development of high- 合金微观组织的影响.中国稀土学报，2005,23(3)：334 strength.high conductivity Cu-Ag alloys for high field pulsed [22]Hong S 1.Hill M A.Mechanical stability and electrical conduc- magnet use.Appl Phys Lett,1991.59(23):2965 tivity of Cu-Ag filamentary microcomposites.Mater Sci Eng, [12]Lim M S.Song JS,Hong S 1.Microstructure and mechanical 1999,A264:151 stability of Cu-6wt.%Ag alloy.J Mater Sci.2000.35:4557 [23]Heringhaus F.Schneider-Muntau H J.Gottstein G.Analytical [13]Frommeyer G.Wassermann G.Microstructure and anomalous modeling of the electrical conductivity of metal matrix compos- mechanical properties of in situ produced silver-copper composite ites:application to Ag Cu and Cu-Nb.Mater Sci Eng.2003, wires.Acta Metall,1975,23:1353 A347:9 [14]Zhang L.Meng L.Liu J B.Effect of Cr addition on the mi- Interface structure between Ag precipitates and Cu matrix and its effect on the properties of the Cu Ag alloy LIU Jiabin,ZENG Yuewu2),ZHANG Lei,MENG Liang 1)Department of Materials Science and Engineering.Zhejiang University.Hangghou 310027.China 2)Center of Analysis and Measurement.Zhejiang University.Hanghou 310028.China 3)Materials Science and Engineering School.University of Science and Technology Beijing.Beijing 100083.China ABSTRACT The Cu6%Ag and Cu-24%Ag were cast and annealed or aging treated to precipitate Ag sec ondary particles from supersaturated Cu matrix.The interface and orientation relationship between Ag precipi- tates and Cu matrix were investigated.The effect of Ag precipitates on the mechanical and electrical properties of the alloys was discussed.There are a strict orientation relationship,(100)c(100)Ag and (110c (110g and semi-coherence interface between Ag precipitates and Cu matrix.One dislocation exists in average nine (111)cu lattice intervals to adjust the lattice misfit at the interface.The strict orientation relationship and semi-coherence interface may produce significant strengthening affect and hardly increase the electron scattering in the alloys.With prolonging aging time the amount of Ag precipitates and the hardness of the alloys increase but the electrical resistivity decreases.The changes of the amount,morphology and interface structure of the precipitates should be responsible for the change of the properties during aging treatment. KEY WORDS Cu Ag;hardness:resistivity;precipitate;interface［3］ Schneider-Muntau H JHan KBednar N Aet al．Materials for 100T monocoil magnets．IEEE Trans Appl Supercond200414 （2）：1153 ［4］ Pantsyrnyi V I．Status and perspectives for microcomposite winding materials for high field pulsed magnets．IEEE Trans Appl Supercond200212（1）：1189 ［5］ Hong S IHill M A．Microstructural stability and mechanical response to Cu－Ag microcomposite wires．Acta Mater199846 （12）：4111 ［6］ Han KEmbury J DSims J Ret al．The fabricationproperties and microstructure of Cu－Ag and Cu－Nb composite conductors． Mater Sci Eng1999A267：99 ［7］ Sakai YSchneider-muntau H J．Ultra-high strength high conductivity Cu－Ag alloy wires．Acta Mater199745：1017 ［8］ 张雷孟亮．应变程度对 Cu－12％Ag 合金纤维相形成及导电 性能的影响．金属学报200541（3）：255 ［9］ 张雷孟亮．纤维相强化 Cu－12％Ag 合金的组织和力学性能． 中国有色金属学报200515（5）：751 ［10］ Benghalem AMorris D G．Microstructure and strength of wiredrawn Cu－Ag filamentary composites．Acta Mater199745： 397 ［11］ Sakai YInoue KAsano Tet al．Development of highstrengthhigh-conductivity Cu－Ag alloys for high-field pulsed magnet use．Appl Phys Lett199159（23）：2965 ［12］ Lim M SSong J SHong S I．Microstructure and mechanical stability of Cu－6wt．％Ag alloy．J Mater Sci200035：4557 ［13］ Frommeyer GWassermann G．Microstructure and anomalous mechanical properties of in situ-produced silver-copper composite wires．Acta Metall197523：1353 ［14］ Zhang LMeng LLiu J B．Effect of Cr addition on the microstructuremechanical and electrical characteristics of Cu－6 wt．％Ag microcomposites．Scripta Mater200552：587 ［15］ Zhang LMeng L．Microstructure and properties of Cu－Ag Cu－Ag－Cr and Cu－Ag－Cr－RE alloys．Mater Sci Technol 200319：75 ［16］ Hirota TImai AKumano Tet al．Development of Cu－Ag alloys conductor for high field magnet．IEEE Trans Magn 199430（4）：1891 ［17］ Sakai YInoue KAsano Tet al．Development of a high strengthhigh conductivity copper-silver alloy for pulsed magnets．IEEE Trans Magn199228（1）：288 ［18］ Han KVasquez A AXin Yet al．Microstructure and tensile properties of nanostructured Cu－25wt％Ag． Acta Mater 200351：767 ［19］ Grünberger WHeilmaier MSchultz L．Microstructure and mechanical properties of Cu－Ag microcomposites for conductor wires in pulsed high-field magnets．Z Metallkd200293：58 ［20］ Gaganov AFreudenberger J Grünberger W et al． Microstructural evolution and its effect on the mechanical properties of Cu－Ag microcomposites．Z Metallkd200495：425 ［21］ 李振铎张雷孟亮．稀土元素对 Cu－6％Ag 及 Cu－24％Ag 合金微观组织的影响．中国稀土学报200523（3）：334 ［22］ Hong S IHill M A．Mechanical stability and electrical conductivity of Cu－Ag filamentary microcomposites．Mater Sci Eng 1999A264：151 ［23］ Heringhaus FSchneider-Muntau H JGottstein G．Analytical modeling of the electrical conductivity of metal matrix composites：application to Ag－Cu and Cu－Nb．Mater Sci Eng2003 A347：9 Interface structure between Ag precipitates and Cu matrix and its effect on the properties of the Cu－Ag alloy LIU Jiabin 1）ZENG Y uew u 2）ZHA NG Lei 3）MENG L iang 1） 1） Department of Materials Science and EngineeringZhejiang UniversityHangzhou310027China 2） Center of Analysis and MeasurementZhejiang UniversityHangzhou310028China 3） Materials Science and Engineering SchoolUniversity of Science and Technology BeijingBeijing100083China ABSTRACT The Cu－6％Ag and Cu－24％Ag were cast and annealed or aging treated to precipitate Ag secondary particles from supersaturated Cu matrix．The interface and orientation relationship between Ag precipitates and Cu matrix were investigated．The effect of Ag precipitates on the mechanical and electrical properties of the alloys was discussed．There are a strict orientation relationship（100）Cu ∥（100）Ag and 〈110〉Cu ∥ 〈110〉Agand sem-i coherence interface between Ag precipitates and Cu matrix．One dislocation exists in average nine （111）Cu lattice intervals to adjust the lattice misfit at the interface．The strict orientation relationship and sem-i coherence interface may produce significant strengthening affect and hardly increase the electron scattering in the alloys．With prolonging aging time the amount of Ag precipitates and the hardness of the alloys increase but the electrical resistivity decreases．The changes of the amountmorphology and interface structure of the precipitates should be responsible for the change of the properties during aging treatment． KEY WORDS Cu－Ag；hardness；resistivity；precipitate；interface 第2期 刘嘉斌等： Cu－Ag 合金中析出相界面结构及其对合金性能的影响 ·215·