.1420 工程科学学报，第43卷，第10期 (a) Shear force (a)Crack initiators Shear force Ice Ice Crack initiators surface LSM surface Substrate Substrate After the ice accretion size exceeds the critical size (b):crack propagation Pore Crack Shear force Ice 和 00m LIT surface 图9裂纹源表面除冰机理及该表面典型形式.()裂纹源表面机理 Substrate 示意图：(b)亚微米级泡沫的横截面SEM图像和相应的变形性能示 意图网 图8超过临界尺寸后，界面滑动表面与冰的界面断裂由自发断裂模 Fig.9 De-icing mechanism and typical form of crack source surface: 式向裂纹扩展断裂模式转变的示意图 (a)schematic diagram of the surface mechanism of the crack source; Fig.8 After the critical size is exceeded,the interface fracture between (b)SEM image of the cross-section of the submicron foam and the the sliding surface of the interface and the ice changes from a schematic diagram of the deformation performance spontaneous fracture mode to a crack propagation fracture mode 为精细的粗糙结构抑制冰核的稳定形成以延迟结 冰52-5刈但在高湿度和较高的气压环境下，其微纳 冰，利用SHSs的特性回弹过冷液滴防止表面结 结构内部将可能发生结霜，最终导致超疏水表面 (a) Force Force Force Ice Cracks Cracks (b) Pattern 1: Directions of the applied SU8 template shear force on ice Silicon wafer SU8 a=1 mm,=5 um (or 10 um) PDMS coating(67 um)with b=c=1mm(or1.5,2.2.5,3mm) hollow sub-surface structures (c)Stress-localized icephobic (d) Ice detachment coating Phase II on phase II Shear Phase I force Ice Solid a-the length of the structure;b-the pitch of the structure in the x direction;c-the pitch of the structure in the y direction;/-the height of the structure 图10裂纹源表面设计的策略.()包含亚结构的PDMS表面剪切加载前后的变形的示意图以：(b)两图分别为样式1的硅模板及其得到的表面5o, (c)局部应力集中除冰表面结构示意图s,(d)第Ⅱ相位置形成裂纹示意图5例 Fig.10 Strategy of the crack source surface design:(a)schematic diagram of the deformation before and after shear loading on the PDMS surface with substructure(b)the two figures show the silicon template of style 1 and its surface(c)schematic diagram of the de-icing surface with the local stress(d)cracks are formed under the coordinates of phase为精细的粗糙结构抑制冰核的稳定形成以延迟结 冰，利用 SHSs 的特性回弹过冷液滴防止表面结 冰[52−54] . 但在高湿度和较高的气压环境下，其微纳 结构内部将可能发生结霜，最终导致超疏水表面 Force Ice PDMS Cracks PDMS Cracks PDMS Cracks y x b Ice Ice Force Force Ice detachment on phase Ⅱ Shear force Ice Stress-localized icephobic coating Phase Ⅰ Solid Phase Ⅱ Pattern 1: SU8 template a=1 mm, h=5 μm (or 10 μm) b=c=1 mm (or 1.5, 2, 2.5, 3 mm) Silicon wafer SU8 PDMS coating (67 μm) with hollow sub-surface structures Ice Glass Y X 45° Directions of the applied shear force on ice (a) (b) y x b a c h (c) (d) a—the length of the structure; b—the pitch of the structure in the x direction; c—the pitch of the structure in the y direction; h—the height of the structure 图 10    裂纹源表面设计的策略. （a）包含亚结构的 PDMS 表面剪切加载前后的变形的示意图[13] ；（b）两图分别为样式 1 的硅模板及其得到的表面[50] ； （c）局部应力集中除冰表面结构示意图[51] ；（d）第 II 相位置形成裂纹示意图[51] Fig.10    Strategy of the crack source surface design: (a) schematic diagram of the deformation before and after shear loading on the PDMS surface with substructure[13] ; (b) the two figures show the silicon template of style 1 and its surface[50] ; (c) schematic diagram of the de-icing surface with the local stress[51] ; (d) cracks are formed under the coordinates of phase II[51] Ice Ice : crack propagation After the ice accretion size exceeds the critical size Crack Shear force (a) (b) Shear force LSM surface Substrate LIT surface Substrate 图 8    超过临界尺寸后，界面滑动表面与冰的界面断裂由自发断裂模 式向裂纹扩展断裂模式转变的示意图 Fig.8    After the critical size is exceeded, the interface fracture between the  sliding  surface  of  the  interface  and  the  ice  changes  from  a spontaneous fracture mode to a crack propagation fracture mode (a) (b) Collapse Pore 100 μm Ice Crack initiators Shear force Crack initiators surface Substrate 图 9    裂纹源表面除冰机理及该表面典型形式. （a）裂纹源表面机理 示意图；（b）亚微米级泡沫的横截面 SEM 图像和相应的变形性能示 意图[49] Fig.9     De-icing  mechanism  and  typical  form  of  crack  source  surface: (a)  schematic  diagram  of  the  surface  mechanism  of  the  crack  source; (b)  SEM  image  of  the  cross-section  of  the  submicron  foam  and  the schematic diagram of the deformation performance[49] · 1420 · 工程科学学报，第 43 卷，第 10 期