.474 北京科技大学学报 第29卷 望.佳木斯大学学报：自然科学版，2005(3)：138 mer.J Eur Ceram Soc.1995.15(2):729 [5]罗铁钢，曲选辉，秦明礼，注射成形Kvar合金蜡基粘结剂的 [9]Matar S A.Edirisinghe M J.Evans J R G.et al.Modelling the 优化.矿业研究与开发，2005(1)：39 removal of organic vehicle from ceramic or metal moulding the ef- [6]LiS L.Huang B Y.Qu X H.et al.Development of a waxoil- fect of gas permeation on the incidence of defects.J Mater Sci. polyethylene binder for FeNiz injection molding.Trans Nonfer- 1995,30(2):3805 rous Met Soc China.2000.10(5):680 [1O]武高辉，张强等，姜龙涛，等.SiCP/Al复合材料在电子封装 [7]林好转，氧化钴注射成形喂料流变性能测试和分析·粉末冶 应用中基础研究.电子元件与材料，2003,22(6)：27 金材料科学与工程，2004(1)：87 [1l]平延磊，贾成厂，曲选辉，等.SiCp/Al电子封装复合材料预 [8]Zhang T,Evans JR G.Woodthorpe J.Injection moulding of sili- 成形坯的制备.北京科技大学学报，2004,26(3)：77 con carbide using an organic vehicle based on a preceramic poly- Fabrication of the electronic package box preform of SiCp/Al composites by powder injection molding CHU Ke,JIA Chengchang,LIA NG Xuebing,Qu Xuanhui Material Science and Engineering School,University of Science and Technology Beijing.Beijing 100083.China ABSTRACI Suitable feedstock was obtained after analyzing the rheological properties of silicon carbide ceram- ics.SiCp package box performs used in pressure infiltration experiment were manufactured through powder in- jection molding and debinding pre-sintering process.Experimental results showed that the feedstork with 65% SiCp load and 70%PW(paraffin wax)9%HPDE (high-density polyethylene)1%SA (stearic acid)had the best injection properties in the wide ranges of temperature and shear rate.The injection part with no defects could be manufactured at suitable injection parameters.The debinder was successfully removed from the injection part by solvent and thermal debinding process.SiCp package box preforms with good appearance,enough strength and proper porosity were obtained by pre-sintering process at 1150C,which was up to the request of following pressure infiltration experiment to fabricate SiCp/Al composites package boxes. KEY WORDS electronic packaging materials;silicon carbide;feedstork;powder injection molding:debind望．佳木斯大学学报：自然科学版‚2005（3）：138 ［5］ 罗铁钢‚曲选辉‚秦明礼．注射成形 Kovar 合金蜡基粘结剂的 优化．矿业研究与开发‚2005（1）：39 ［6］ Li S L‚Huang B Y‚Qu X H‚et al．Development of a wax-oi-l polyethylene binder for Fe－Ni2injection molding．Trans Nonfer￾rous Met Soc China‚2000‚10（5）：680 ［7］ 林好转．氧化锆注射成形喂料流变性能测试和分析．粉末冶 金材料科学与工程‚2004（1）：87 ［8］ Zhang T‚Evans J R G‚Woodthorpe J．Injection moulding of sili￾con carbide using an organic vehicle based on a preceramic poly￾mer．J Eur Ceram Soc‚1995‚15（2）：729 ［9］ Matar S A‚Edirisinghe M J‚Evans J R G‚et al．Modelling the removal of organic vehicle from ceramic or metal moulding the ef￾fect of gas permeation on the incidence of defects．J Mater Sci‚ 1995‚30（2）：3805 ［10］ 武高辉‚张强等‚姜龙涛‚等．SiCP／Al 复合材料在电子封装 应用中基础研究．电子元件与材料‚2003‚22（6）：27 ［11］ 平延磊‚贾成厂‚曲选辉‚等．SiCp／Al 电子封装复合材料预 成形坯的制备．北京科技大学学报‚2004‚26（3）：77 Fabrication of the electronic package box preform of SiCp／Al composites by powder injection molding CHU Ke‚JIA Chengchang‚LIA NG Xuebing‚Qu Xuanhui Material Science and Engineering School‚University of Science and Technology Beijing‚Beijing100083‚China ABSTRACT Suitable feedstock was obtained after analyzing the rheological properties of silicon carbide ceram￾ics．SiCp package box performs used in pressure infiltration experiment were manufactured through powder in￾jection molding and debinding-pre-sintering process．Experimental results showed that the feedstork with 65％ SiCp load and70％ PW （paraffin wax）＋29％ HPDE （high-density polyethylene）＋1％ SA （stearic acid） had the best injection properties in the wide ranges of temperature and shear rate．The injection part with no defects could be manufactured at suitable injection parameters．The debinder was successfully removed from the injection part by solvent and thermal debinding process．SiCp package box preforms with good appearance‚enough strength and proper porosity were obtained by pre-sintering process at 1150℃‚which was up to the request of following pressure infiltration experiment to fabricate SiCp／Al composites package boxes． KEY WORDS electronic packaging materials；silicon carbide；feedstork；powder injection molding；debind ·474· 北 京 科 技 大 学 学 报 第29卷