·1506· 北京科技大学学报 第35卷 (a) () d e 图13AgCu28纤料在不同镀覆时间的镀层上的铺展形貌.(a)5min;(b)10min;(c)20min;(d)30min;(e)40min Fig.13 Morphology of AgCu28 filler spreading on the coatings with different plating time:(a)5 min;(b)10 min;(c)20 min;(d) 30 min;(e)40 min (⑤)权衡以上分析，Ni-P合金镀层中磷质量分 化学工业出版社，2003) 数为8.7%、厚度为58m时，其整体性能最好. [6]Jiang XX,Shen W.The Theory and Practice of Elec- troless Plating.Beijing:National Defence Industry Press, 2000 参考文献 (姜晓霞，沈伟.化学镀理论及实践.北京：国防工业出版社 2000) [1]Zweben C.Advances in composite materials for thermal [7]Balaraju J N,Sankara Narayanan T S N,Seshadri S K. management in electronic packaging.JOM,1998,50(6):47 Electroless Ni-P composite coatings.J Appl Electrochem, [2)Hanada K,Matsuzaki K,Sano T.Thermal properties of 2003,33:807 diamond particle-dispersed Cu composites.J Mater Pro- 8 Liang Z J.Modern Surface Plating Technology.Beijing: cess Technol,2004,153-154:514 National Defence Industry Press,2005 [3 Gray K J.Effective thermal conductivity of a diamond (梁志杰。现代表面镀覆技术北京：国防工业出版社， coated heat spreader.Diamond Relat Mater,2000,9(2): 2005) 201 [9]Gao J Q,Hu W B.A research on the control of phospho- [4]Deng A Q,Fan J B.Tan Z Q,et al.Research progress of rous content in electroless Ni-P coating and the effect on diamond/Cu composite material for electronic packaging the performances of the coating.Electroplat Pollut Con- Diamond Abras Eng,2010,30(5):56 tol.2002,22(1):1 (邓安强，樊静波，谭占秋，等.金刚石/铜复合材料在电子 (高加强，胡文彬.化学镀镍磷镀层中磷含量的控制及性能 封装材料领域的研究进展.金刚石与磨料磨具工程，2010， 研究.电镀与环保，2002,22(1)：1) 30(5):56) [10]Yao W,Wang S A,Shen Z S.Study of spreading for 5]Hu W B,Liu L,Wu Y T.Electroless Nickel Plating Tech- AgCu28 eutectic filler metal.Electron Compon Mater, nology of Difficult Plating Base Material.Beijing:Chem- 2004,23(8):36 ical Industry Press,2003 (姚伟，王思爱，沈卓身.AgC28共品纤料的铺展性研究. (胡文彬，刘磊，仵亚婷.难镀基材的化学镀镍技术.北京： 电子元件与材料，2004,23(8)：36)· 1506 · 北 京 科 技 大 学 学 报 第 35 卷 图 13 AgCu28 钎料在不同镀覆时间的镀层上的铺展形貌.(a) 5 min; (b) 10 min; (c) 20 min; (d) 30 min; (e) 40 min Fig.13 Morphology of AgCu28 filler spreading on the coatings with different plating time: (a) 5 min; (b) 10 min; (c) 20 min; (d) 30 min; (e) 40 min (5) 权衡以上分析，Ni-P 合金镀层中磷质量分 数为 8.7%、厚度为 5∼8 µm 时，其整体性能最好. 参 考 文 献 [1] Zweben C. Advances in composite materials for thermal management in electronic packaging. JOM, 1998, 50(6):47 [2] Hanada K, Matsuzaki K, Sano T. Thermal properties of diamond particle-dispersed Cu composites. J Mater Pro￾cess Technol, 2004, 153-154: 514 [3] Gray K J. Effective thermal conductivity of a diamond coated heat spreader. Diamond Relat Mater, 2000, 9(2): 201 [4] Deng A Q, Fan J B, Tan Z Q, et al. Research progress of diamond/ Cu composite material for electronic packaging. Diamond Abras Eng, 2010, 30(5): 56 (邓安强, 樊静波, 谭占秋, 等. 金刚石/铜复合材料在电子 封装材料领域的研究进展. 金刚石与磨料磨具工程, 2010, 30(5): 56) [5] Hu W B, Liu L, Wu Y T. Electroless Nickel Plating Tech￾nology of Difficult Plating Base Material. Beijing: Chem￾ical Industry Press, 2003 (胡文彬, 刘磊, 仵亚婷. 难镀基材的化学镀镍技术. 北京: 化学工业出版社, 2003) [6] Jiang X X, Shen W. The Theory and Practice of Elec￾troless Plating. Beijing: National Defence Industry Press, 2000 (姜晓霞, 沈伟. 化学镀理论及实践. 北京: 国防工业出版社, 2000) [7] Balaraju J N, Sankara Narayanan T S N, Seshadri S K. Electroless Ni-P composite coatings.J Appl Electrochem, 2003, 33: 807 [8] Liang Z J. Modern Surface Plating Technology. Beijing: National Defence Industry Press, 2005 (梁志杰. 现代表面镀覆技术. 北京: 国防工业出版社, 2005) [9] Gao J Q, Hu W B. A research on the control of phospho￾rous content in electroless Ni-P coating and the effect on the performances of the coating. Electroplat Pollut Con￾trol, 2002, 22(1): 1 (高加强, 胡文彬. 化学镀镍磷镀层中磷含量的控制及性能 研究. 电镀与环保, 2002, 22(1): 1) [10] Yao W, Wang S A, Shen Z S. Study of spreading for AgCu28 eutectic filler metal. Electron Compon Mater, 2004, 23(8): 36 (姚伟, 王思爱, 沈卓身. AgCu28 共晶钎料的铺展性研究. 电子元件与材料, 2004, 23(8): 36)