(散射) Drift vel Va=He 迁移速率 Electron mobility: ue(m2/V-s) 电于迁移率 电子迁移性 Conductivity: o=neue 电导率 电子净运动 INFLUENCE OF TEMPERATURE (温度的影响) P1+P+ t- thermal(热) (杂质) d- deformation(形变) o与a为材料常数 INFLUENCE OF PLASTIC DEFORMATION INFLUENCE OF IMPURITIES (塑性形变的影响) (杂质的影响) impurity concentration c, in terms of the atom fraction -2.16 at %Ni 杂质浓度为原子分数 Deformed For a two-phase alloy consisting of a and B phases u+L 12 at Ni 两相体系:P-PBa+pB3 E Scattering events （散射） 电子净运动 电子迁移性 Drift velocity: Vd = µeE Conductivity: e σ = n e µ Electron mobility: µe (m2/V-s) 迁移速率 电子迁移率 电导率 t – thermal （热） i – impurity （杂质） d – deformation （形变） Mathiessen’s Law ρtotal = ρt + ρi +ρd ρt = ρ0 + aT INFLUENCE OF TEMPERATURE （温度的影响） ρ0与a为材料常数 两相体系： ρi = ραVα+ ρβVβ For a two-phase alloy consisting of α and β phases ρi = Aci (1-ci ) impurity concentration ci in terms of the atom fraction 杂质浓度为原子分数 INFLUENCE OF IMPURITIES (杂质的影响） INFI.UENCE OF PI.ASTIC DEFORMATION （塑性形变的影响） –250 –200 –150 –100 –50 0 +50 Cu + 3.32 at % Ni Cu+2.16 at % Ni Deformed Cu+1.12 at % Ni “Pure” copper Temperature (°C) Electrical resistivity ( Ω-m×10-8) 6 5 4 3 2 1 0 ρd ρi ρt