。192 北京科技大学学报 第33卷 参考文献 by stearic aci via vacum evaportin J FunctMater 2010 41 (1):144 【】Lu HC WangC P LiNC et al ElectonicsManufacurng (刘文胜，崔鹏，马运柱，等.真空蒸镀硬脂酸包覆SA风C呒 wih Lead free Ha kgen free Conductive Adhesive Materia 铅焊料合金粉末研究.功能材料，201041(1)：144) Tmansled by JiangY F Zhang CN Beijing Chemical hdustry 8 Yu S I Li Y W.Spectrum Ana pysis Mehad Chongiing PE52005 Cham网ng Universit泄PesS1994 (刘汉诚.汪正平，李宁成.等.电子制造技术：利用无铅、无卤 (于世林，李寅蔚.波谱分析方法.重庆：重庆大学出版社， 素和导电胶材料.姜岩峰，张常年，译.北京：化学工业出版 1994) 社，2005 【身Luo M Guan P Lu WH The dentifcation of sevelumd [2 Diective 2002/95/Ec of the European Parliment and of he fatty acids and their salts by meansof nfaed spec tmetry Spe Council of27 January2003 an the restric tion of the use of ce na in trosc SpectmlAnal 2007 27(2):250 hazardous substances in electrical and electron ic equiment Off J (罗曼，关平，刘文汇.利用红外光谱鉴别饱和脂肪酸及其盐 rUn2003L3719 光谱学与光谱分析，200727(2：250) 3]Dav d Karl The current smus of kad free soler alkys I10 Wagner C D Ris W M Handlook of X-Ray Phopelectron EEE TmnsE kectron Packag Manuf 2001 24(4)244 Spectrosc Minneso PerkinEmer Coporation 1979 I4 Anderson IE Development of SnA&Cu ad SnAgCux a lkys [11]Tan MB Thin Fim Technobgies and Materials Beiing Tsin for Pb fiee e kectonic soHer applicat ons JMater SciMater Elec ghua Universit Press 2006 on200718(1/3):55 (田民波.薄膜技术与薄膜材料.北京：清华大学出版社， Sucanuma K Solderng Techro kgy of LeadF ree Tmnslated by 2006) NingX Beijing Science Press 2004 [12 Chen MH LuN Xu Y D Develdpmentof research an the wet (营沼克昭.无铅焊接技术.宁晓山译.北京：科学出版社， mabilie ofmetal on cermics Cmmented Carbice 2002 19(4) 2004) 199 I6 ShiYW.LeiYP XiZD et al Desgn and prospect of lead (陈名海，刘宁，许育东.金属陶瓷润湿性的研究现状.硬质 fiee soHer paste Ekctron Conpon Mater 2008,27(9):31 合金，200219(4：199) (史耀武，雷永平，夏志东，等.无铅焊膏的设计与展望.电子元 13 Usher B F The contrilution of kinetic nuc eatin theories o 件与材料，200827(9：31) sudies ofVomerW eber thin fim growt ApplSurf Sci 1985 I7 LuW CuiP MaYZ etal Coat ofSnCu alkyed pavder 223(Pat2):506北 京 科 技 大 学 学 报 第 33卷 参 考 文 献 [ 1] LiuHC, WangCP, LiNC, etal.ElectronicsManufacturing withLead-free, Halogen-free＆ Conductive-AdhesiveMaterials. TranslatedbyJiangYF, ZhangCN.Beijing:ChemicalIndustry Press, 2005 (刘汉诚, 汪正平, 李宁成, 等.电子制造技术:利用无铅、无卤 素和导电胶材料.姜岩峰, 张常年, 译.北京:化学工业出版 社, 2005) [ 2] Directive2002/95 /EcoftheEuropeanParliamentandofthe Councilof27 January2003 ontherestrictionoftheuseofcertain hazardoussubstancesinelectricalandelectronicequipment.OffJ EurUnion, 2003, L37:19 [ 3] DavidS, KarlS.Thecurrentstatusoflead-freesolderalloys. IEEETransElectronPackagManuf, 2001, 24( 4 ):244 [ 4] AndersonIE.DevelopmentofSn-Ag-CuandSn-Ag-Cu-Xalloys forPb-freeelectronicsolderapplications.JMaterSciMaterElec￾tron, 2007, 18( 1/3) :55 [ 5] SucanumaK.SolderingTechnologyofLead-Free.Translatedby NingXS.Beijing:SciencePress, 2004 (菅沼克昭.无铅焊接技术.宁晓山译.北京:科学出版社, 2004) [ 6] ShiYW, LeiYP, XiaZD, etal.Designandprospectoflead￾freesolderpaste.ElectronComponMater, 2008, 27 ( 9) :31 (史耀武, 雷永平, 夏志东, 等.无铅焊膏的设计与展望.电子元 件与材料, 2008, 27( 9) :31) [ 7] LiuWS, CuiP, MaYZ, etal.CoatyofSnAgCualloyedpowder bystearicacidviavacuumevaporation.JFunctMater, 2010, 41 ( 1 ) :144 (刘文胜, 崔鹏, 马运柱, 等.真空蒸镀硬脂酸包覆 SnAgCu无 铅焊料合金粉末研究.功能材料, 2010, 41( 1) :144) [ 8] YuS L, LiY W.Spectrum AnalysisMethod. Chongqing: ChongqingUniversityPress, 1994 (于世林, 李寅蔚.波谱分析方法.重庆:重庆大学出版社, 1994 ) [ 9] LuoM, GuanP, LiuWH.Theidentificationofseveralsaturated fattyacidsandtheirsaltsbymeansofinfraredspectrometry.Spec￾troscSpectralAnal, 2007, 27( 2 ) :250 (罗曼, 关平, 刘文汇.利用红外光谱鉴别饱和脂肪酸及其盐. 光谱学与光谱分析, 2007, 27 ( 2) :250 ) [ 10] WagnerCD, RiggsW M.HandbookofX-RayPhotoelectron Spectroscopy.Minnesota:Perkin-ElmerCorporation, 1979 [ 11] TianMB.ThinFilmTechnologiesandMaterials.Beijing:Tsin￾ghuaUniversityPress, 2006 (田民波.薄膜技术与薄膜材料.北京:清华大学出版社, 2006 ) [ 12] ChenMH, LiuN, XuYD.Developmentofresearchonthewet￾tabilityofmetalonceramics.CementedCarbide, 2002, 19( 4 ): 199 (陈名海, 刘宁, 许育东.金属 /陶瓷润湿性的研究现状.硬质 合金, 2002, 19 ( 4) :199 ) [ 13] UsherB F.Thecontributionofkineticnucleationtheoriesto studiesofVolmer-Weberthinfilmgrowth.ApplSurfSci, 1985, 22 /23( Part2) :506 · 192·