JEDEC PUBLICATION 95 PAGE 4.21-2/A INTERNAL STACKING MODULE LAND GRID ARRAY PACKAGES WITH EXTERNAL INTERCONNECT TERMINALS (ISM) 4.21 SCOPE This Design Guide applies to packages with optional external bond finger configurations and various height profiles and pitches.Height Prefixes(W,U,X,etc.)and Fine-pitch(F)prefixes will not be referenced unless the detail in questions pertains only to a specific variation.Refer to JESD30 for formal package designators. 4.21-1 ILLUSTRATIONS Row of Metalized Terminals(Bond Fingers)for Next Level of Interconnect. To be referred to as TERMINALS. Metalized LGA Matrix Array for Electrical Testing.To be referred to as TEST PADS 00加u100中.0000加1.000加J a.0000010000011000uJ0 0○○ O ● 0000000000000000000000 OPTION 1: OPTION 2: OPTION 3: OPTION 4: Interconnect Interconnect Interconnect Interconnect Terminals 1 Side Terminals 2 Sides Terminals 3 Sides Terminals 4 Sides FIGURE 4.21-1-Internal Stacking Module Land Grid Array Packages with External Interconnect TerminalsJEDEC PUBLICATION 95 PAGE 4.21-2/A INTERNAL STACKING MODULE LAND GRID ARRAY PACKAGES WITH EXTERNAL INTERCONNECT TERMINALS (ISM) 4.21 SCOPE This Design Guide applies to packages with optional external bond finger configurations and various height profiles and pitches. Height Prefixes (W, U, X, etc.) and Fine-pitch (F) prefixes will not be referenced unless the detail in questions pertains only to a specific variation. Refer to JESD30 for formal package designators. 4.21-1 ILLUSTRATIONS FIGURE 4.21-1 — Internal Stacking Module Land Grid Array Packages with External Interconnect Terminals Metalized LGA Matrix Array for Electrical Testing. To be referred to as TEST PADS. Row of Metalized Terminals (Bond Fingers) for Next Level of Interconnect. To be referred to as TERMINALS. OPTION 1: Interconnect Terminals 1 Side OPTION 2: Interconnect Terminals 2 Sides OPTION 3: Interconnect Terminals 3 Sides OPTION 4: Interconnect Terminals 4 Sides