JEDEC DESIGN STANDARD DESIGN REQUIREMENTS FOR OUTLINES OF SOLID STATE AND RELATED PRODUCTS JEDEC PUBLICATION 95 Design Guide 4.21 INTERNAL STACKING MODULE,LAND GRID ARRAY PACKAGES WITH EXTERNAL INTERCONNECT TERMINALS (ISM) JEDEC SOLID STATE TECHNOLOGY ASSOCIATION Date:March 2007 Issue:A Item:11.2-699(s)
JEDEC DESIGN STANDARD DESIGN REQUIREMENTS FOR OUTLINES OF SOLID STATE AND RELATED PRODUCTS JEDEC PUBLICATION 95 Design Guide 4.21 INTERNAL STACKING MODULE, LAND GRID ARRAY PACKAGES WITH EXTERNAL INTERCONNECT TERMINALS (ISM) _______________________________________ _______________________________________ JEDEC SOLID STATE TECHNOLOGY ASSOCIATION Date: March 2007 Issue: A Item: 11.2-699(S)
JEDEC PUBLICATION 95 PAGE 4.21-1/A INTERNAL STACKING MODULE,LAND GRID ARRAY PACKAGES WITH EXTERNAL INTERCONNECT TERMINALS (ISM) Contents Sections Pages 4.21 Scope 4.21-2 4.21.1 Illustrations 4.21-2 4.21.2 Package Description 4.21-3 4.21.3 Concept 4.21-4 4.21.4 Recommended Package Outline 4.21-4 4.21.5 Recommended Values and Tolerances 4.21-4 4.21.6 Notes 4.21-12 Tables 4.21-1 Symbols,Recommended Values and Tolerances 4.21-5 Figures 4.21-1 Internal Stacking Module Land Grid Array Packages with 4.21-2 External Interconnect Terminals 4.21-2 ISM LGA Package Stacked within another Package 4.21-3 4.21-3 ISM Top,Side,and Bottom Views 4.21-9 4.21-4 Side View Detail 4.21-10 4.21-5 Bond Finger Terminal Detail 4.21-11
JEDEC PUBLICATION 95 PAGE 4.21-1/A INTERNAL STACKING MODULE, LAND GRID ARRAY PACKAGES WITH EXTERNAL INTERCONNECT TERMINALS (ISM) Contents Sections Pages 4.21 Scope 4.21-2 4.21.1 Illustrations 4.21-2 4.21.2 Package Description 4.21-3 4.21.3 Concept 4.21-4 4.21.4 Recommended Package Outline 4.21-4 4.21.5 Recommended Values and Tolerances 4.21-4 4.21.6 Notes 4.21-12 Tables 4.21-1 Symbols, Recommended Values and Tolerances 4.21-5 Figures 4.21-1 Internal Stacking Module Land Grid Array Packages with 4.21-2 External Interconnect Terminals 4.21-2 ISM LGA Package Stacked within another Package 4.21-3 4.21-3 ISM Top, Side, and Bottom Views 4.21-9 4.21-4 Side View Detail 4.21-10 4.21-5 Bond Finger Terminal Detail 4.21-11
JEDEC PUBLICATION 95 PAGE 4.21-2/A INTERNAL STACKING MODULE LAND GRID ARRAY PACKAGES WITH EXTERNAL INTERCONNECT TERMINALS (ISM) 4.21 SCOPE This Design Guide applies to packages with optional external bond finger configurations and various height profiles and pitches.Height Prefixes(W,U,X,etc.)and Fine-pitch(F)prefixes will not be referenced unless the detail in questions pertains only to a specific variation.Refer to JESD30 for formal package designators. 4.21-1 ILLUSTRATIONS Row of Metalized Terminals(Bond Fingers)for Next Level of Interconnect. To be referred to as TERMINALS. Metalized LGA Matrix Array for Electrical Testing.To be referred to as TEST PADS 00加u100中.0000加1.000加J a.0000010000011000uJ0 0○○ O ● 0000000000000000000000 OPTION 1: OPTION 2: OPTION 3: OPTION 4: Interconnect Interconnect Interconnect Interconnect Terminals 1 Side Terminals 2 Sides Terminals 3 Sides Terminals 4 Sides FIGURE 4.21-1-Internal Stacking Module Land Grid Array Packages with External Interconnect Terminals
JEDEC PUBLICATION 95 PAGE 4.21-2/A INTERNAL STACKING MODULE LAND GRID ARRAY PACKAGES WITH EXTERNAL INTERCONNECT TERMINALS (ISM) 4.21 SCOPE This Design Guide applies to packages with optional external bond finger configurations and various height profiles and pitches. Height Prefixes (W, U, X, etc.) and Fine-pitch (F) prefixes will not be referenced unless the detail in questions pertains only to a specific variation. Refer to JESD30 for formal package designators. 4.21-1 ILLUSTRATIONS FIGURE 4.21-1 — Internal Stacking Module Land Grid Array Packages with External Interconnect Terminals Metalized LGA Matrix Array for Electrical Testing. To be referred to as TEST PADS. Row of Metalized Terminals (Bond Fingers) for Next Level of Interconnect. To be referred to as TERMINALS. OPTION 1: Interconnect Terminals 1 Side OPTION 2: Interconnect Terminals 2 Sides OPTION 3: Interconnect Terminals 3 Sides OPTION 4: Interconnect Terminals 4 Sides
JEDEC PUBLICATION 95 PAGE 4.21-3/A 4.21-2 PACKAGE DESCRIPTION Internal Stacking Module(ISM)Land Grid Array Packages(LGA)with External Interconnect Terminals are plastic semiconductor packages with metalized package terminals or lands arranged in an array on the bottom surface of the package.These terminals are either flush with the bottom surface of the package or defined by solder mask. In addition to the land pad terminals arrayed on the bottom surface of the package,metalized fine pitch interconnect terminals(bond fingers)are located along the edges of the bottom surface of the package. These interconnect terminals can be on one side to all four sides of the package. The package can have a square or rectangular body as well as symmetric or asymmetric terminal patterns. The ISM LGA package is stacked within another BGA type package and then interconnect to base substrate is made by means of wire bonds attached to the external bond fingers of the ISM package per Figure 4.21-2.Therefore,the ISM LGA is embedded inside another package and the land pads are for testing purpose only(they have no 2 level or board level reliability impact).These land grid array pads can be eliminated altogether if testing of the bond finger terminals directly is implemented. Test Pads Terminals AW. Internal Stackina Module (ISM) Base Packaae ISM Stacked within Package FIGURE 4.21-2-ISM LGA Package Stacked within another Package
JEDEC PUBLICATION 95 PAGE 4.21-3/A 4.21-2 PACKAGE DESCRIPTION Internal Stacking Module (ISM) Land Grid Array Packages (LGA) with External Interconnect Terminals are plastic semiconductor packages with metalized package terminals or lands arranged in an array on the bottom surface of the package. These terminals are either flush with the bottom surface of the package or defined by solder mask. In addition to the land pad terminals arrayed on the bottom surface of the package, metalized fine pitch interconnect terminals (bond fingers) are located along the edges of the bottom surface of the package. These interconnect terminals can be on one side to all four sides of the package. The package can have a square or rectangular body as well as symmetric or asymmetric terminal patterns. The ISM LGA package is stacked within another BGA type package and then interconnect to base substrate is made by means of wire bonds attached to the external bond fingers of the ISM package per Figure 4.21-2. Therefore, the ISM LGA is embedded inside another package and the land pads are for testing purpose only (they have no 2nd level or board level reliability impact). These land grid array pads can be eliminated altogether if testing of the bond finger terminals directly is implemented. FIGURE 4.21-2 — ISM LGA Package Stacked within another Package Internal Stacking Module (ISM) ISM Stacked within Package Base Package Test Pads Terminals
JEDEC PUBLICATION 95 PAGE 4.21-4/A 4.21-3 CONCEPT This design guide defines the symbology,algorithms,dimensions and tolerances for ISM LGA packages with external bond fingers.The guidelines are based on metric dimensions and adhere to the geometric dimensioning and tolerancing principles defined in ASME Y14.5M-1994. 4.21-4 RECOMMENDED PACKAGE OUTLINE Refer to Table 4.21-1 and Figures 4.21-3 though 4.21-5 for the recommended symbology and outline format for ISM LGA packages. 4.21-5 RECOMMENDED VALUES AND TOLERANCES The following table defines the symbology and recommended algorithms,dimensions and tolerances that shall be used when preparing an ISM LGA package outline
JEDEC PUBLICATION 95 PAGE 4.21-4/A 4.21-3 CONCEPT This design guide defines the symbology, algorithms, dimensions and tolerances for ISM LGA packages with external bond fingers. The guidelines are based on metric dimensions and adhere to the geometric dimensioning and tolerancing principles defined in ASME Y14.5M-1994. 4.21-4 RECOMMENDED PACKAGE OUTLINE Refer to Table 4.21-1 and Figures 4.21-3 though 4.21-5 for the recommended symbology and outline format for ISM LGA packages. 4.21-5 RECOMMENDED VALUES AND TOLERANCES The following table defines the symbology and recommended algorithms, dimensions and tolerances that shall be used when preparing an ISM LGA package outline
JEDEC PUBLICATION 95 PAGE 4.21-5/A Table 4.21-1-Symbols,Recommended Values and Tolerances(values in mm) SYMBOL DEFINITION ele1 MIN NOM MAX NOTES Refer to JEDEC's Overall component height Publication 95,Section measured from seating All 4.3.and SPP-017 for plane height profiles (W,U,X, etc.recommended). e Diameter or width of 0.8 0.25 0.45 exposed metalized land array terminals(Test 0.75 0.25 0.4 Recommended diameters 6 Pads)exposed at the are for SMD(Type 1)or bottom surface of the 0.65 0.25 0.35 NSMD(Type 2) package 0.50 0.20 0.30 The package body D All Range:4mm to 16mm dimension parallel to Increment:0.5mm Basic Dimension datum B Center to center D1 dimension of span of land array terminals parallel to All D1=(ND -1)xe or D1 =(ND-2)xe Basic Dimension datum B Offset of center of D2 nterconnect terminal All D2=D/2-0.375mm Basic Dimension array from datum A SD Offset of land array All ND is odd:SD=0 ND is even:SD=e/2 Basic Dimension terminals from datum A The package body E dimension parallel to All Range:4mm to 16mm Basic Dimension Increment:0.5mm datum A Center to center E1 dimension of span of land E1=(NE-1)xe or array terminals parallel to All E1=(NE-2)xe Basic Dimension datum A Offset of center of E2 interconnect terminal All E2=E/2-0.375mm Basic Dimension array from datum B SE Offset of land array All NE is odd:SE=0 NE is even:SE=e/2 Basic Dimension terminals from datum B
JEDEC PUBLICATION 95 PAGE 4.21-5/A Table 4.21-1 – Symbols, Recommended Values and Tolerances (values in mm) SYMBOL DEFINITION e/e1 MIN NOM MAX NOTES A Overall component height measured from seating plane All - - - Refer to JEDEC's Publication 95, Section 4.3, and SPP-017 for height profiles (W, U, X, etc. recommended). e 0.8 0.25 - 0.45 0.75 0.25 - 0.4 0.65 0.25 - 0.35 b Diameter or width of exposed metalized land array terminals (Test Pads) exposed at the bottom surface of the package 0.50 0.20 - 0.30 Recommended diameters are for SMD (Type 1) or NSMD (Type 2) D The package body dimension parallel to datum B All Range: 4mm to 16mm Increment: 0.5mm Basic Dimension D1 Center to center dimension of span of land array terminals parallel to datum B All D1 = (ND - 1) x e or D1 = (ND - 2) x e Basic Dimension D2 Offset of center of interconnect terminal array from datum A All D2 = D/2 - 0.375mm Basic Dimension SD Offset of land array terminals from datum A All ND is odd: SD = 0 ND is even: SD = e/2 Basic Dimension E The package body dimension parallel to datum A All Range: 4mm to 16mm Increment: 0.5mm Basic Dimension E1 Center to center dimension of span of land array terminals parallel to datum A All E1 = (NE - 1) x e or E1 = (NE - 2) x e Basic Dimension E2 Offset of center of interconnect terminal array from datum B All E2 = E/2 - 0.375mm Basic Dimension SE Offset of land array terminals from datum B All NE is odd: SE = 0 NE is even: SE = e/2 Basic Dimension
JEDEC PUBLICATION 95 PAGE 4.21-6/A Table 4.21-1-Symbols,Recommended Values and Tolerances(cont'd) SYMBOL DEFINITION e/e1 MIN NOM MAX NOTES e=0.80mm Land array terminal (Test 0.75mm 0.65mm Pitch can be depopulated terminal metallization) along axis parallel to pitch 0.50mm datum A and/or B e is a Basic Dimension e1 0.14 0.055 0.080 Width of metalized Recommended widths are 0.13 0.050 0.075 b1 interconnect(bond finger) top widths for NSMD terminal 0.12 exposed interconnect 0.045 0.070 terminal along pitch e1 0.11 0.040 0.065 Width of two bridged b2 metalized interconnect All 0.150 0.220 b2=b1+e1 terminals Width of three bridged b3 metalized interconnect 0.260 0.360 b3=b1+(2×e1) terminals e1=0.14mm Pitch of exposed 0.13mm 0.12mm Pitch can be depopulated e1 metalized interconnect along axis parallel to (bond finger)terminals 0.11mm datum A and/or B e1 is a Basic Dimension ength of metalized Recommended lengths L interconnect (bond finger) All 0.200 0.250 0.400 are for SMD(Type 1)or terminals NSMD(Type 2) n The number of land array terminals present n less than or equal to N,where The symbol "n"factors in All The maximum number of N=ND'NE any land array terminal N depopulation and array terminals The symbol "m"factors in The number of m interconnect terminals any land array terminal present depopulation or bridging m is less than or equal to M, of two adjacent terminals where M=MD+ME Such depopulation or bridging must be completely dimensioned M The maximum number of interconnect terminals on individual outline drawings
JEDEC PUBLICATION 95 PAGE 4.21-6/A Table 4.21-1 – Symbols, Recommended Values and Tolerances (cont’d) SYMBOL DEFINITION e/e1 MIN NOM MAX NOTES e Land array terminal (Test terminal metallization) pitch e = 0.80mm 0.75mm 0.65mm 0.50mm e is a Basic Dimension Pitch can be depopulated along axis parallel to datum A and/or B e1 0.14 0.055 - 0.080 0.13 0.050 - 0.075 0.12 0.045 - 0.070 b1 Width of metalized interconnect (bond finger) terminal 0.11 0.040 - 0.065 Recommended widths are top widths for NSMD exposed interconnect terminal along pitch e1 b2 Width of two bridged metalized interconnect terminals All 0.150 - 0.220 b2 = b1 + e1 b3 Width of three bridged metalized interconnect terminals All 0.260 - 0.360 b3 = b1 + (2 x e1) e1 Pitch of exposed metalized interconnect (bond finger) terminals e1 = 0.14mm 0.13mm 0.12mm 0.11mm e1 is a Basic Dimension Pitch can be depopulated along axis parallel to datum A and/or B L Length of metalized interconnect (bond finger) terminals All 0.200 0.250 0.400 Recommended lengths are for SMD (Type 1) or NSMD (Type 2) n The number of land array terminals present N The maximum number of land array terminals All n less than or equal to N, where N = ND*NE The symbol "n" factors in any land array terminal depopulation m The number of interconnect terminals present M The maximum number of interconnect terminals All m is less than or equal to M, where M = MD+ME The symbol "m" factors in any land array terminal depopulation or bridging of two adjacent terminals. Such depopulation or bridging must be completely dimensioned on individual outline drawings
JEDEC PUBLICATION 95 PAGE 4.21-7/A Table 4.21-1-Symbols,Recommended Values and Tolerances(cont'd) SYMBOL DEFINITION ele1 MIN NOM MAX NOTES No interconnect terminals on The maximum number of either edge:ND =((D-1.0)/e)+ Truncate to an integer ND land array terminal rows 1 All in the axis parallel to (remove all decimal Interconnect terminals on one datum B portions) or both edges:ND=((D-2.0)/e) +1 No bond finger terminals on The maximum number of either edge:NE =((E-1.0)/e)+ NE land array terminal rows 1 Truncate to an integer in the axis parallel to All (remove all decimal Bond finger terminals on one or datum A portions) both edges:NE=((E-2.0)/e)+ 1 Bond finger terminals on one The maximum number of edge:MD=(D-1.0)/e1)+1 Truncate to an integer MD interconnect terminals in the axis parallel to datum All (remove all decimal Bond finger terminals on both portions).Variable pitch B edges:MD =(2*((D-1.0)/e1)) is allowed +1 Bond finger terminals on one The maximum number of edge:ME=(E-1.0)/e1)+1 Truncate to an integer ME interconnect terminals in the axis parallel to datum All (remove all decimal Bond finger terminals on two portions).Variable pitch is A edges:ME=(2*(E-1.0)/e1) allowed +1 The bilateral profile tolerance that controls the position of the package aaa body sides.The centers All 0.10 of the profile zones are defined by the basic dimensions D and E The tolerance zone located parallel to datum bbb C in which the top surface All 0.10 to the package must be ocated The tolerance within This tolerance is ddd which the bottom surface of all terminals must be All 0.10 commonly known as the coplanarity of the package ocated terminals
JEDEC PUBLICATION 95 PAGE 4.21-7/A Table 4.21-1 – Symbols, Recommended Values and Tolerances (cont’d) SYMBOL DEFINITION e/e1 MIN NOM MAX NOTES No interconnect terminals on either edge: ND = ((D-1.0)/e) + 1 ND The maximum number of land array terminal rows in the axis parallel to datum B All Interconnect terminals on one or both edges: ND = ((D-2.0)/e) + 1 Truncate to an integer (remove all decimal portions) No bond finger terminals on either edge: NE = ((E-1.0)/e) + 1 NE The maximum number of land array terminal rows in the axis parallel to datum A All Bond finger terminals on one or both edges: NE = ((E-2.0)/e) + 1 Truncate to an integer (remove all decimal portions) Bond finger terminals on one edge: MD = ((D-1.0)/e1) + 1 MD The maximum number of interconnect terminals in the axis parallel to datum B All Bond finger terminals on both edges: MD = (2*((D-1.0)/e1)) + 1 Truncate to an integer (remove all decimal portions). Variable pitch is allowed Bond finger terminals on one edge: ME = ((E-1.0)/e1) + 1 ME The maximum number of interconnect terminals in the axis parallel to datum A All Bond finger terminals on two edges: ME = (2*((E-1.0)/e1)) + 1 Truncate to an integer (remove all decimal portions). Variable pitch is allowed aaa The bilateral profile tolerance that controls the position of the package body sides. The centers of the profile zones are defined by the basic dimensions D and E All 0.10 bbb The tolerance zone located parallel to datum C in which the top surface to the package must be located All 0.10 ddd The tolerance within which the bottom surface of all terminals must be located All 0.10 This tolerance is commonly known as the coplanarity of the package terminals
JEDEC PUBLICATION 95 PAGE 4.21-8/A Table 4.21-1-Symbols,Recommended Values and Tolerances(cont'd) SYMBOL DEFINITION ele1 MIN NOM MAX NOTES The tolerance that controls the position of the entire test terminal pattern with respect to Datum's A eee and B.The center of the All 0.10 tolerance zone for each test terminal is defined by the basic dimension "e"as related to Datums A and B The tolerance that controls the position of the test terminals to each 仟 other.The centers of the All 0.05 profile zones are defined by the basic dimension "e" The tolerance that controls the position of the entire interconnect (bond finger)terminal pattern with respect to Datum's A 999 All and B.The center of the 0.125 tolerance zone for each terminal is defined by the basic dimension "e1"as related to Datums A and B The tolerance that controls the position of the interconnect(bond finger) hhh terminals to each other. All 0.005 The centers of the profile zones are defined by the basic dimension "e1
JEDEC PUBLICATION 95 PAGE 4.21-8/A Table 4.21-1 – Symbols, Recommended Values and Tolerances (cont’d) SYMBOL DEFINITION e/e1 MIN NOM MAX NOTES eee The tolerance that controls the position of the entire test terminal pattern with respect to Datum's A and B. The center of the tolerance zone for each test terminal is defined by the basic dimension "e" as related to Datums A and B All 0.10 fff The tolerance that controls the position of the test terminals to each other. The centers of the profile zones are defined by the basic dimension "e". All 0.05 ggg The tolerance that controls the position of the entire interconnect (bond finger) terminal pattern with respect to Datum's A and B. The center of the tolerance zone for each terminal is defined by the basic dimension "e1" as related to Datums A and B All 0.125 hhh The tolerance that controls the position of the interconnect (bond finger) terminals to each other. The centers of the profile zones are defined by the basic dimension "e1". All 0.005
JEDEC PUBLICATION 95 PAGE 4.21-9/A △aaoc 2X A TERMINAL A1 CORNER INDEX AREA 2.50X2.50MIN (D/2XE/2) FLAT AREA A 公 D △aoaC 2X TOP VIEW /bbb c e A Nx SE 中 eeeM C A B @fff C Nx K 雪⊕O⊕中⊕ w 0 H 6 0 ⊕ 0 0 D 0 0 0B 0 0 0 0⊕ (DATUM A) A 0 ⊕ SEE DETAIL B- 2 5 6 SHEET 2 e SEE DETAIL A HE2--1 SHEET 2 (DATUM B) SECTION A-A BOTTOM VIEW AA在 FIGURE 4.21-3-ISM TOP,SIDE,AND BOTTOM VIEW
JEDEC PUBLICATION 95 PAGE 4.21-9/A FIGURE 4.21-3 — ISM TOP, SIDE, AND BOTTOM VIEW
