Heat exchange and 先进材料疑固实验室 Laboratory of Advanced Materials Solidification temperature field One dimensional heat exchange problem Assumptions: 1.Uniform temperature of mold and mold cavity,Pouring temperature T10,mold temperature T20: 2.Pure metal solidification 3. No latent heat release 4. Parameters:Casting:入1、C1、p1 5. Mold:入2、C2、P2 6. No heat resistance between casting and mold Then: ot 02T &t er2 a---Heat diffusion coefficient,=cp) 上降充通大学 SHANGHAI JIAO TONG UNIVERSITYAssumptions: 1. Uniform temperature of mold and mold cavity, Pouring temperature T10, mold temperature T20: 2. Pure metal solidification 3. No latent heat release 4. Parameters: Casting: λ1 、c1 、ρ1 5. Mold: λ2 、c2 、ρ2 6. No heat resistance between casting and mold Then: Heat exchange and temperature field One dimensional heat exchange problem α---Heat diffusion coefficient , = λ/(cρ)