图 残余应力 Channel crack Low-k dielectric Copper (OSG) interconnect line KFAB 1.0kV 4.4mm x15.0k SE(U)5/19/2000 3.00um Channel cracking,a fracture mode in which through-film cracks propagate in the film due to a tensile residual stress The above picture is of a new pressure vessel that failed during its hydraulic test.The vessel had been stress relieved,but some OGS:organosilicate glass parts of it did not reach the required temperature and consequently did not experience adequate tempering.This 残余应力的起因和种类：生长 coupled with a small hydrogen crack,was sufficient to cause catastrophic failure under test conditions.It is therefore 应力；表面应力；焊接应力；相 important when considering PWHT or its avoidance,to ensure that all possible failure modes and their consequences are 变应力等 carefully considered before any action is taken 材料科学与工程学院 5 School of Materials Science and Engineering材料科学与工程学院 School of Materials Science and Engineering 残余应力 5 Channel cracking, a fracture mode in which through-film cracks propagate in the film due to a tensile residual stress OGS: organosilicate glass The above picture is of a new pressure vessel that failed during its hydraulic test. The vessel had been stress relieved, but some parts of it did not reach the required temperature and consequently did not experience adequate tempering. This coupled with a small hydrogen crack, was sufficient to cause catastrophic failure under test conditions. It is therefore important when considering PWHT or its avoidance, to ensure that all possible failure modes and their consequences are carefully considered before any action is taken 残余应力的起因和种类：生长 应力;表面应力;焊接应力;相 变应力等