J Fail. Anal and Preven.(2008)8: 524-532 Fig. 2 FT-IR spectra of bare board (a) Type l.(b) Type 2 45 3500300025002000 500 884288642066620864 FU DAN UNIV 3500300025002000 1000 Wavenumbers (cm-1) fatigue simulation testing to determine whether delamina- Results and discussion tion influenced the reliability of resin-coated copper(rCC) ard before and after the test is presented in Fig. 9. The The results of chemical compositions and thermal analys results show that there is only a slight increase in the dis- show that the material quality of the bare board is accept play of delamination on the whole board after the test and able. Meanwhile, the component configuration of type 1 there is almost no noticeable delamination around the PCB is reasonable, but warpage has been found in type 2 failure sections. Therefore, the open circuit is not caused by PCB through the macroscopic inspection. It can be con- cluded from the SAM inspection that delamination is not the 2 Springerfatigue simulation testing to determine whether delamina￾tion influenced the reliability of resin-coated copper (RCC) foil. Testing conditions and parameters are listed in Table 1, and the delamination comparison of the bare board before and after the test is presented in Fig. 9. The results show that there is only a slight increase in the dis￾play of delamination on the whole board after the test and there is almost no noticeable delamination around the failure sections. Therefore, the open circuit is not caused by delamination. Results and Discussion The primary faults of these two types of PCBs are open circuits and the resistance deviating from the standard value. The results of chemical compositions and thermal analysis show that the material quality of the bare board is accept￾able. Meanwhile, the component configuration of type 1 PCB is reasonable, but warpage has been found in type 2 PCB through the macroscopic inspection. It can be con￾cluded from the SAM inspection that delamination is not the Fig. 2 FT-IR spectra of bare board. (a) Type 1. (b) Type 2 526 J Fail. Anal. and Preven. (2008) 8:524–532 123