(ENEx POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling(with flow rates)is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer services http://www.dynexsemi.com e-mail:power_solutions@dynexsemi.com CUSTOMER SERVICE DYNEX SEMICONDUCTOR LTD Te:+44(0)1522502753/502901.Fax:+44(0)1522500020 Doddington Road, Lincoln Lincolnshire. LN6 3LF. United Kingdom SALES OFFICES Te:+44-(0)1522-500500 Benelux, Italy Switzerland: Tel: +33(0)1 64 66 42 17. Fax: +33(0)164 6642 19. Fax:+44-(0)1522500550 France:Te:+33(0)247557553.Fax:+33(0)247557559 any, Northern Europe, Spain& Rest Of World: Tel: +44(0)1522 502753/502901 Fax:+44(0)1522500020 North America:Tel:(440)259-2060.Fax:(440)259-2059.Te:(949)7333005.Fax:(949)7332986 These office @ Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION-N RESALE. PRODUCED IN UNITED KINGDOM 签三 or death to he user. All products and materals are sold and services provided subject to the Company' s conditions of sale, which are available on request. A brand names and product used in this publication are trademarks, registered trademarks or trade names of their respective owners. dynexsemicowww.dynexsemi.com POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 SALES OFFICES Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19. France: Tel: +33 (0)2 47 55 75 53. Fax: +33 (0)2 47 55 75 59. Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 North America: Tel: (440) 259-2060. Fax: (440) 259-2059. Tel: (949) 733-3005. Fax: (949) 733-2986. These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com