第8期 张毓隽等：SS方法制备铜/金刚石复合材料 。1023。 参考文献 [6 Ekimov E A.Suetin N V.Popovich A F.et al.Themal conduc- tivity of diamond composites sintered under high pessues.Dia- [1]Zhou X L.Wu J H.Zhang J Y,et al.A meview of meta-matrix mond Relat Mater,2008.17:838 composites for electronic packaging.J Nanchang Inst Aeronaut [7 Schubert T.Trindade B Weibgatber T.et al.Interfacial design Technol2001,15(1片11 of Cubased composites prepared by pow der metallurgy for heat (周贤良，吴江晖，张建云，等。电子封装用金属基复合材料 sink applications.Mater Sci Engi A.2008 475:39 的研究现状.南昌航空工业学院学报。2001,15(1)：11) [8 Ding L Y.Chen JH.Wei X L.The change of metal inclusions [2 Huang Q.Gu M Y.Status and prospects of metal matrix com pos- and its influence on the strength of synthetic diamond.ChinJ ites for electronic packaging.Electmon Packag,2003.3(2):22 High Pressure Phys.1990.4(2):96 (黄强顾明元.电子封装用金属基复合材料的研究现状.电 (丁立业陈江华，魏晓莉.金属包裹体的变化及对人造金刚 子与封装2003.3(2)片22) 石强度的影响.高压物理学报。19904(2)：96) [3 Tong Z S Shen Z S.Status and devebpment of materials for [9 Maxw ell JC.A Treatise on Electriciry and Magnetism.3rd Ed. metal packaging.E lectron Packag.2005.23(5):6 Cambridge:Oxford University Press.1892 (童震松，沈卓身.金属封装材料的现状及发展.电子与封装，【10 Hatta H,Taya M.Eqivalent inclusion method for steady state 2005.23(5):6) heat conduction in composites.Int J Eng Sci.1986.24(7): [4]Yoshida K.Morigami H.Themal properties of diamond copper 1159 composite material.Microelectron Reliab,2004 44:303 11]Turner P S.Thermal expansion stresses in reinforced plastics.J [5 Hanada K.Matsuzaki K.Sano T.Thermal pmoperties of diamond Res Natl Bureau Standard.1946.37(1/2):239 particle dispersed Cu composites.J Mater Proass Techmol. [12]Kemer E H.The elastic and themoelastic properties of com- 2004153/154:514 posite media.Proc Phys Soc B.1956.69:808参 考 文 献 [ 1] Zhou X L , Wu J H , Zhang J Y , et al.A review of metal-matrix composites for electronic packaging .J Nanchang Inst Aeronaut Technol, 2001 , 15(1):11 (周贤良, 吴江晖, 张建云, 等.电子封装用金属基复合材料 的研究现状.南昌航空工业学院学报, 2001 , 15(1):11) [ 2] Huang Q , Gu M Y .St atus and prospects of metal matrix com pos￾it es for electronic packaging .Electron Packag , 2003 , 3(2):22 (黄强, 顾明元.电子封装用金属基复合材料的研究现状.电 子与封装, 2003 , 3(2):22 ) [ 3] Tong Z S , Shen Z S.S tatus and development of materials for met al packaging .E lectron Packag , 2005 , 23(5):6 (童震松, 沈卓身.金属封装材料的现状及发展.电子与封装, 2005 , 23(5):6) [ 4] Yoshida K , M origami H .Thermal properties of diamond/ copper composite mat erial.Microelectron Reliab , 2004 , 44:303 [ 5] Hanada K , Matsuzaki K , Sano T .Thermal properties of diam ond particle-dispersed Cu composites.J Mater Process Tech nol , 2004 , 153/ 154:514 [ 6] Ekimov E A, Suetin N V, Popovich A F , et al.Thermal conduc￾tivity of diamond composit es sint ered under high pressu res.Dia￾mond Relat Ma ter , 2008 , 17:838 [ 7] Schubert T , Trindade B, Weibgarber T , et al.In terf acial design of Cu-based composit es prepared by pow der m etallurgy for heat sink applications.Mater S ci Engi A , 2008 , 475:39 [ 8] Ding L Y , Chen J H , Wei X L .The change of metal inclusions and its influence on the strength of synthetic diamond.Chin J High Pressure Phys, 1990 , 4(2):96 (丁立业, 陈江华, 魏晓莉.金属包裹体的变化及对人造金刚 石强度的影响.高压物理学报, 1990, 4(2):96) [ 9] Maxw ell J C .A Treatise on Electri city an d Magnetism .3rd Ed. Cambridge :Oxford Uni versit y Press, 1892 [ 10] Hatta H , Taya M .Equivalen t inclusion method f or st eady state heat conduction in composit es.In t J Eng S ci , 1986 , 24(7): 1159 [ 11] Turner P S.Thermal expansion stresses in reinf orced plastics.J Res Na tl Bureau S tandar d , 1946 , 37(1/2):239 [ 12] Kerner E H .The elastic and thermo-elastic properties of com￾posite media .Proc Phys Soc B , 1956 , 69:808 第 8 期 张毓隽等:SPS 方法制备铜/ 金刚石复合材料 · 1023 ·