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微细加工技术 2005年 5结论 获得了一种用常规微细加工方法制作微 结构的方法—准LIGA技术,但它通常只 能加工单层的准三维结构。本文研究和探索 了用准LIGA技术加工三维复杂结构的可行 性,并找到了一套可行的工艺参数,是拓宽准 LIGA加工技术应用范围的一次有益尝试。 3456820Kyx30946 a整体 参考文献 [1]叶雄英,周兆英.准LIGA工艺[J].仪器仪表 学报,1996,17(1):84-87 [2]刘景全,朱军,丁桂甫,等,用SU-8胶制高深 宽比微结构的试验研究[].微细加工技术 2002,(1):27-29 [3]吴茂松,杨春生,茅昕辉,等.MEMS螺线管型 电感器正负胶结合的加工工艺[J.微细加工 技术,2002,(2):53-57 0345992eKγx6:喜 [4 Paul M Dentinger, Clift W Miles, Steven H Goods Removal of SU-8 photoresist for thick film applica- tions[J] 图3码轮组SEM照片 93-1000 Process Research of Complicated Multiple-layer Microstructure Using UV-LIGA JIANG yong, CHEN Wen-yuan, ZHAO Xiao-lin DING Gui-fu, NI Zhi-ping, WANG Zhi-min Key laboratory for Thin Film and Microfabrication Technology of Ministry of Educ f Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030, China) Abstract: UV-LIGA process entionally used for 2. 5 dimensions and single layer structure Using SU-8 based UV-LIGA and overcoming difficulties in overlap of multiple layers, difficulties in seed layer technology as well as difficulties in surface activation, we fabricated a 3-dimension and 5-layer structure. The process given here is proved to be practical and it expands the applica tion of UV-LIGa Key words: UV-LIGA; SU-8 resist; overlap; seed layer; 万方数据78 微细加工技术 2005年 a整体 h局部 图3码轮组SEM照片 5 结论 获得了一种用常规微细加工方法制作微 结构的方法——准LIGA技术,但它通常只 能加工单层的准三维结构。本文研究和探索 了用准LIGA技术加工三维复杂结构的可行 性,并找到了一套可行的工艺参数,是拓宽准 LIGA加工技术应用范围的~次有益尝试。 参考文献: [1]叶雄英,周兆英.准LIGA工艺[J].仪器仪表 学报,1996,17(1):84—87. [2]刘景全,朱军,丁桂甫,等.用SU一8胶制高深 宽比微结构的试验研究[J].微细加工技术, 2002,(1):27—29. [3]吴茂松,杨春生。茅昕辉,等.MEMS螺线管型 电感器正负胶结合的加工工艺[J].微细加工 技术,2002,(2):53—57. [4]Paul M Dentinger,Clift W Miles,Steven H Goods. Removal of SU-8 photoresist for thick fdm印plica— tions[J].Microelectronic Engineering,2002,61-62: 993—1000. icated Multiple-layer Microstructure Using UV-LIGA JIANG yong,CHEN Wen—yuan,ZHAO Xiao—lin, DING Gui—fu,NI Zhi-ping,WANG Zhi—min (Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education,Research Institute of Micro/Nanometer Science and Technology,Shanghai Jiaotong University,Shanghai 200030,China) Abstract:U V.LIGA Drocess is conventionally used for 2.5 dimensions and single layer structure. Using SU.8 based U V.LIGA and overcoming difficulties in overlap of multiple layers,difficulties in seed 1aver technologv as well as difficulties in surface activation, we fabricated a 3一dimension and 5.1ayer structure.The process given here is proved to be practical and it expands the applica— tion of UV—LIGA. Key words:UV.LIGA;SU。8 resist;overlap;seed layer;surface activation 万方数据
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