微细加工技术 2005年 5结论 获得了一种用常规微细加工方法制作微 结构的方法—准LIGA技术,但它通常只 能加工单层的准三维结构。本文研究和探索 了用准LIGA技术加工三维复杂结构的可行 性,并找到了一套可行的工艺参数,是拓宽准 LIGA加工技术应用范围的一次有益尝试。 3456820Kyx30946 a整体 参考文献 [1]叶雄英,周兆英.准LIGA工艺[J].仪器仪表 学报,1996,17(1):84-87 [2]刘景全,朱军,丁桂甫,等,用SU-8胶制高深 宽比微结构的试验研究[].微细加工技术 2002,(1):27-29 [3]吴茂松,杨春生,茅昕辉,等.MEMS螺线管型 电感器正负胶结合的加工工艺[J.微细加工 技术,2002,(2):53-57 0345992eKγx6:喜 [4 Paul M Dentinger, Clift W Miles, Steven H Goods Removal of SU-8 photoresist for thick film applica- tions[J] 图3码轮组SEM照片 93-1000 Process Research of Complicated Multiple-layer Microstructure Using UV-LIGA JIANG yong, CHEN Wen-yuan, ZHAO Xiao-lin DING Gui-fu, NI Zhi-ping, WANG Zhi-min Key laboratory for Thin Film and Microfabrication Technology of Ministry of Educ f Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030, China) Abstract: UV-LIGA process entionally used for 2. 5 dimensions and single layer structure Using SU-8 based UV-LIGA and overcoming difficulties in overlap of multiple layers, difficulties in seed layer technology as well as difficulties in surface activation, we fabricated a 3-dimension and 5-layer structure. The process given here is proved to be practical and it expands the applica tion of UV-LIGa Key words: UV-LIGA; SU-8 resist; overlap; seed layer; 万方数据78 微细加工技术 2005年 a整体 h局部 图3码轮组SEM照片 5 结论 获得了一种用常规微细加工方法制作微 结构的方法——准LIGA技术，但它通常只 能加工单层的准三维结构。本文研究和探索 了用准LIGA技术加工三维复杂结构的可行 性，并找到了一套可行的工艺参数，是拓宽准 LIGA加工技术应用范围的～次有益尝试。 参考文献： [1]叶雄英，周兆英．准LIGA工艺[J]．仪器仪表 学报，1996，17(1)：84—87． [2]刘景全，朱军，丁桂甫，等．用SU一8胶制高深 宽比微结构的试验研究[J]．微细加工技术， 2002，(1)：27—29． [3]吴茂松，杨春生。茅昕辉，等．MEMS螺线管型 电感器正负胶结合的加工工艺[J]．微细加工 技术，2002，(2)：53—57． [4]Paul M Dentinger，Clift W Miles，Steven H Goods． Removal of SU-8 photoresist for thick fdm印plica— tions[J]．Microelectronic Engineering，2002，61-62： 993—1000． icated Multiple-layer Microstructure Using UV-LIGA JIANG yong，CHEN Wen—yuan，ZHAO Xiao—lin， DING Gui—fu，NI Zhi-ping，WANG Zhi—min (Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education，Research Institute of Micro／Nanometer Science and Technology，Shanghai Jiaotong University，Shanghai 200030，China) Abstract：U V．LIGA Drocess is conventionally used for 2．5 dimensions and single layer structure． Using SU．8 based U V．LIGA and overcoming difficulties in overlap of multiple layers，difficulties in seed 1aver technologv as well as difficulties in surface activation， we fabricated a 3一dimension and 5．1ayer structure．The process given here is proved to be practical and it expands the applica— tion of UV—LIGA． Key words：UV．LIGA；SU。8 resist；overlap；seed layer；surface activation 万方数据