Wafer Fab- Lithography Most Common measure of Complexity of Masks, Minimum Feature(examples) Approximately 50% of the process steps Oxidation H Litho Etch H Oxidation/ Deposition H Litho Etch H Implant Anneal H Litho Etch H Metal Deposition Litho i Etch Sinter Drives infrastructure Cleanliness Vibration Temperature and humidity Fall 2003-MA Schmidt 3.155] 6.152]-Lecture 10-Slide 4Wafer Fab - Lithography „ Most Common Measure of Complexity „ # of Masks, Minimum Feature (examples) „ Approximately 50% of the Process Steps Litho Etch Oxidation/Deposition Litho Etch Implant Anneal Litho Etch Metal Deposition Litho Etch Sinter Oxidation „ Drives Infrastructure „ Cleanliness „ Vibration „ Temperature and Humidity Fall 2003 – M.A. Schmidt 3.155J/6.152J – Lecture 10 – Slide 4