Semiconductor Roadmap Year of first DRAM Shipment 1997 1999 2003 2006 2009 2012 DRAM Bits/ Chip 256M1G 4G 64G256G Minimum Feature Size nm Isolated Lines(MPU 200 140 100 Dense Lines (DRAM) 250 130 100 70 Contacts 200 140 110 Gate CD Control 3c(nm) 10 Alignment(mean 3o)(nm) 65 Depth of Focus(um) 0.8 0.7 0.6 0.5 0.5 0.5 Defect Density (per layer/m?) 100 80 60 40 Defect Size (nm) @80@60@40⊙30@20⊙15 DRAM Chip Size(mm?) 280 560 790 11201580 MPU Chip Size(mm2) 300 360 430 520 620 750 Field Size(mm) 22x2225x3225x3625x4025x4425x52 Exposure Technology 248mm248nm248nm193mm193mm? DUV DUV DUVDUV 193nm UV Minimum Mask Count 22/2424 24/26262828 Fall 2003-MA Schmidt 3. 155]6. 152]-Lecture 10-Slide 5Semiconductor Roadmap Fall 2003 – M.A. Schmidt 3.155J/6.152J – Lecture 10 – Slide 5