11/26 10.2.1 Operational Amplifiers-IC Packages 0.400(10.16) 0.365(9.27) 人 ◆Package: 0.355(9.02) 凸凸凸 DIP, 0.280(7.11) 0.250(6.35) SOIC(N W), 0.240(6.10) 0.325(8.26) MSOP 0.310(7.87 0.100(2.54) 0.300(7.62) LFCSP BSC 0.195(4.95) 0.210(5.33) 00601殷 0.130(3.30) MAX 0.015 0.1152.92) 0.150(3.81) 0.38) 0.015(0.38) 0.1303.30) MIN GAUGE 0.115(2.92 SEATING PLANE 0.014(0.36) PLANE +0.010(0.25) 0.022(0.56) 0.018(0.46)+ 0.005(0.13) 0.430(10.92 0.008(0.201 MIN MAX 0.014(0.36) 0.070(1.78) 0.060(1.52 0.045(1.14) COMPLIANT TO JEDEC STANDARDS MS-001 CONTROLLING DIMENSIONS ARE IN INCHES:MILLIMETER DIMENSIONS 腔aE5思9RRE8 APPROPRIATE FOR USE IN D8icN. CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS. Figure 35.8-Lead Plastic Dual-in-Line Package [PDIP] P-Suffix (N-8) Dimensions shown in inches and(millimeters) 12/26 10.2.2 Instrumentation Amplifiers Major characteristics: High common-mode rejection ratio; High input impedance; ●Low noise and drift;: eo=(ez-4)R 2R2 R ●Moderate bandwidth; Limited range of gain. R3 Gain control‹ Package: DIP, SOIC(N & W), MSOP LFCSP 10.2.1 Operational Amplifiers – IC Packages 11/26 4 2 0 21 3 1 2 ( ) (1 ) R R e ee R R =− + 10.2.2 Instrumentation Amplifiers 12/26 ‹ Major characteristics: z High common-mode rejection ratio; z High input impedance; z Low noise and drift; z Moderate bandwidth; z Limited range of gain