刘冰等：单晶硅脆塑转变临界厚度的原位实验 ·349· 1602 2015 28th IEEE International Conference on Micro Electro Me- (赵宏伟，杨柏豪，赵宏健，等.单品硅纳米力学性能的测试 chanical Systems.Estoril,2015:389 光学精密工程，2009,17(7)：1602) [11]Wang Z G,Zhang P,Chen J X,et al.Effect of C-C bond 4]Gong S,Ren X C,Chen G,et al.Effect of microstructure on the breakage on diamond tool wear in nanometric cutting of silicon cleavage fracture stress of high-peed railway wheel steel.Chin J Acta Phys Sin,2015,64(19):ArtNo.198104 Eng,2016,38(4):522 (王治国，张鹏，陈家轩，等.单品硅纳米切削中C一C键断 (龚帅，任学冲，陈刚，等.微观组织对高速车轮钢解理断裂 裂对金刚石刀具磨损的影响.物理学报，2015,64(19)：At- 应力的影响.工程科学学报，2016,38(4)：522) No.198104) [5]Chavoshi S Z,Goel S,Luo X C.Influence of temperature on the [12]Fang F Z,Xu FF,Lai M.Size effect in material removal by cut- anisotropic cutting behaviour of single crystal silicon:a molecular ting at nano scale.Int J Ade Manuf Technol,2015,80(14): dynamics simulation investigation.J Manuf Processes,2016,23: 591 201 [13]Han X S,Lin B,Yu S Y,et al.Investigation of tool geometry in 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brittle-ductile transition during the elliptical vibration-assis- and Influencing Factors of Ultra-Precision Turning Single Crystal ted nanocutting process on monocrystalline silicon tia molecular Silicon [Dissertation].Harbin:Harbin Institute of Technology, dynamic simulations.RSC Adv,2017,7:4179 2006 [17]Fang F Z,Liu B,Xu Z W.Nanometric cutting in a scanning (王明海.单品硅超精密切削脆塑转变机理及影响因素的研 electron microscope.Precis Eng,2015,41:145 究[学位论文].哈尔滨：哈尔滨工业大学，2006) [18]Zhang Z Y,Wu Y Q,Guo D M,et al.Phase transformation of [10]Uesugi A,Hirai Y,Tsuchiya T,et al.Size effect on brittle-duc- single crystal silicon induced by grinding with ultrafine diamond tile transition temperature of silicon by means of tensile testing// grits.Scripta Mater,2011,64(2):177刘 冰等: 单晶硅脆塑转变临界厚度的原位实验 1602 ( 赵宏伟，杨柏豪，赵宏健，等． 单晶硅纳米力学性能的测试． 光学精密工程，2009，17( 7) : 1602) ［4］ Gong S，Ｒen X C，Chen G，et al． Effect of microstructure on the cleavage fracture stress of high-speed railway wheel steel． Chin J Eng，2016，38( 4) : 522 ( 龚帅，任学冲，陈刚，等． 微观组织对高速车轮钢解理断裂 应力的影响． 工程科学学报，2016，38( 4) : 522) ［5］ Chavoshi S Z，Goel S，Luo X C． Influence of temperature on the anisotropic cutting behaviour of single crystal silicon: a molecular dynamics simulation investigation． J Manuf Processes，2016，23: 201 ［6］ Yao M Q，Tang B，Su W． Morphologic control of wet anisotropic silicon etching． Opt Precis Eng，2016，24( 2) : 350 ( 姚明秋，唐彬，苏伟． 单晶硅各向异性湿法刻蚀的形貌控 制． 光学精密工程，2016，24( 2) : 350) ［7］ Lee S H． Analysis of ductile mode and brittle transition of AFM nanomachining of silicon． Int J Mach Tools Manuf，2012，61: 71 ［8］ Wu H，Melkote S N． Effect of crystallographic orientation on duc￾tile scribing of crystalline silicon: role of phase transformation and slip． Mater Sci Eng A，2012，549: 200 ［9］ Wang M H． Ｒesearch on Mechanism of Brittle--Ductile Transition and Influencing Factors of Ultra-Precision Turning Single Crystal Silicon ［Dissertation］． Harbin: Harbin Institute of Technology， 2006 ( 王明海． 单晶硅超精密切削脆塑转变机理及影响因素的研 究 ［学位论文］． 哈尔滨: 哈尔滨工业大学，2006) ［10］ Uesugi A，Hirai Y，Tsuchiya T，et al． Size effect on brittle-duc￾tile transition temperature of silicon by means of tensile testing / / 2015 28th IEEE International Conference on Micro Electro Me￾chanical Systems． Estoril，2015: 389 ［11］ Wang Z G，Zhang P，Chen J X，et al． Effect of C—C bond breakage on diamond tool wear in nanometric cutting of silicon． Acta Phys Sin，2015，64( 19) : ArtNo． 198104 ( 王治国，张鹏，陈家轩，等． 单晶硅纳米切削中 C—C 键断 裂对金刚石刀具磨损的影响． 物理学报，2015，64( 19) : Art￾No． 198104) ［12］ Fang F Z，Xu F F，Lai M． Size effect in material removal by cut￾ting at nano scale． Int J Adv Manuf Technol，2015，80 ( 1-4) : 591 ［13］ Han X S，Lin B，Yu S Y，et al． Investigation of tool geometry in nanometric cutting by molecular dynamics simulation． J Mater Process Technol，2002，129( 1-3) : 105 ［14］ Liu K，Li X P，Ｒahman M，et al． A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers． Int J Adv Manuf Technol，2007，32( 7) : 631 ［15］ Mir A，Luo X C，Sun J N． The investigation of influence of tool wear on ductile to brittle transition in single point diamond turn￾ing of silicon． Wear，2016，364-365: 233 ［16］ Zhu B，Zhao D，Zhao H W，et al． A study on the surface quality and brittle--ductile transition during the elliptical vibration-assis￾ted nanocutting process on monocrystalline silicon via molecular dynamic simulations． ＲSC Adv，2017，7: 4179 ［17］ Fang F Z，Liu B，Xu Z W． Nanometric cutting in a scanning electron microscope． Precis Eng，2015，41: 145 ［18］ Zhang Z Y，Wu Y Q，Guo D M，et al． Phase transformation of single crystal silicon induced by grinding with ultrafine diamond grits． Scripta Mater，2011，64( 2) : 177 · 943 ·