第36卷第4期 北京科技大学学报 Vol.36 No.4 2014年4月 Journal of University of Science and Technology Beijing Apr.2014 伪半固态触变成形制备SiCp/Al电子封装材料的组织 与性能 郭明海，刘俊友”，贾成厂”，果世驹”，李艳霞》，周洪宇 1)北京科技大学材料科学与工程学院，北京1000832)北华航天工业学院材料系，廊坊065000 ☒通信作者，E-mail:qifeng_guo(@126.com 摘要采用伪半固态触变成形工艺制备了40%、56%和63%三种不同SiC体积分数颗粒增强A1基电子封装材料，并借助 光学显微镜和扫描电镜分析了材料中A!和Si汇的形态分布及其断口形貌，测定了材料的密度、致密度、热导率、热膨胀系数、 抗压强度和抗弯强度.结果表明，通过伪半固态触变成形工艺可制备出的不同SC体积分数A!基电子封装材料，其致密度 高，热膨胀系数可控，材料中A1基体相互连接构成网状，SC颗粒均匀镶嵌分布于A1基体中.随着SC颗粒体积分数的增加， 电子封装材料密度和室温下的热导率稍有增加，热膨胀系数逐渐减小，室温下的抗压强度和抗弯强度逐渐增加.SC/A1电子 封装材料的断裂方式为SiC的脆性断裂，同时伴随着A!基体的韧性断裂. 关键词电子封装；颗粒增强复合材料：触变成形；热导率；热膨胀：材料强度 分类号TN405 Microstructure and properties of SiCp/Al electronic packaging materials fabricated by pseudo-semi-solid thixoforming GUO Ming-hai,LIU Jun-you,JIA Cheng-chang",GUO Shi-ju,LI Yan-xia,ZHOU Hong-yu) 1)School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China 2)Department of Materials,North China Institute of Aerospace Engineering,Langfang 065000,China Corresponding author,E-mail:qifeng_guo@126.com ABSTRACT SiC particles reinforced Al matrix composites with three different SiC volume fractions of 40%,56%and 63%for elec- tronic packaging were prepared by pseudo-semi-solid thixoforming.The Al and SiC distribution and the fractographs of the SiCp/Al electronic packaging materials were examined by optical microscopy and scanning electron microscopy.The density,relative density, thermal conductivity (TC),coefficient of thermal expansion (CTE),compressive strength and bending strength of the SiCp/Al elec- tronic packaging materials were tested.It is found that the SiCp/Al electronic packaging materials have controllable coefficients of ther- mal expansion and high relative density.The Al matrix is connected into a network,and SiC particles are uniformly distributed in the Al matrix.When the SiC volume fraction increases,the density and thermal conductivity at room temperature lightly increase,the coef- ficient of thermal expansion gradually decreases,and the compressive strength and bending strength increase.The main fracture mode of the SiC/Al electronic packaging materials is brittle fracture of SiC particles accompanied by ductile fracture of the Al matrix at the same time. KEY WORDS electronic packaging:particle reinforced composites:thixoforming:thermal conductivity:thermal expansion:strength of materials 半导体集成电路的速度和集成度提高，导致芯元件的失效率与其工作温度呈指数关系，功能则与 片发热率增加，电路工作温度上升.实验证明，单个 其成反比口，因而如何提高芯片的散热效率，使得 收稿日期：201304-一17 DOI:10.13374/j.issn1001-053x.2014.04.011:http:/jourals.ustb.edu.cn第 36 卷 第 4 期 2014 年 4 月 北京科技大学学报 Journal of University of Science and Technology Beijing Vol． 36 No． 4 Apr． 2014 伪半固态触变成形制备 SiCp /Al 电子封装材料的组织 与性能 郭明海1) ，刘俊友1) ，贾成厂1) ，果世驹1) ，李艳霞2) ，周洪宇1) 1) 北京科技大学材料科学与工程学院，北京 100083 2) 北华航天工业学院材料系，廊坊 065000  通信作者，E-mail: qifeng_guo@ 126． com 摘 要 采用伪半固态触变成形工艺制备了 40% 、56% 和 63% 三种不同 SiC 体积分数颗粒增强 Al 基电子封装材料，并借助 光学显微镜和扫描电镜分析了材料中 Al 和 SiC 的形态分布及其断口形貌，测定了材料的密度、致密度、热导率、热膨胀系数、 抗压强度和抗弯强度． 结果表明，通过伪半固态触变成形工艺可制备出的不同 SiC 体积分数 Al 基电子封装材料，其致密度 高，热膨胀系数可控，材料中 Al 基体相互连接构成网状，SiC 颗粒均匀镶嵌分布于 Al 基体中． 随着 SiC 颗粒体积分数的增加， 电子封装材料密度和室温下的热导率稍有增加，热膨胀系数逐渐减小，室温下的抗压强度和抗弯强度逐渐增加． SiC/Al 电子 封装材料的断裂方式为 SiC 的脆性断裂，同时伴随着 Al 基体的韧性断裂． 关键词 电子封装; 颗粒增强复合材料; 触变成形; 热导率; 热膨胀; 材料强度 分类号 TN405 Microstructure and properties of SiCp /Al electronic packaging materials fabricated by pseudo-semi-solid thixoforming GUO Ming-hai 1)  ，LIU Jun-you1) ，JIA Cheng-chang1) ，GUO Shi-ju1) ，LI Yan-xia2) ，ZHOU Hong-yu1) 1) School of Materials Science and Engineering，University of Science and Technology Beijing，Beijing 100083，China 2) Department of Materials，North China Institute of Aerospace Engineering，Langfang 065000，China  Corresponding author，E-mail: qifeng_guo@ 126． com ABSTＲACT SiC particles reinforced Al matrix composites with three different SiC volume fractions of 40% ，56% and 63% for elec￾tronic packaging were prepared by pseudo-semi-solid thixoforming． The Al and SiC distribution and the fractographs of the SiCp /Al electronic packaging materials were examined by optical microscopy and scanning electron microscopy． The density，relative density， thermal conductivity ( TC) ，coefficient of thermal expansion ( CTE) ，compressive strength and bending strength of the SiCp /Al elec￾tronic packaging materials were tested． It is found that the SiCp /Al electronic packaging materials have controllable coefficients of ther￾mal expansion and high relative density． The Al matrix is connected into a network，and SiC particles are uniformly distributed in the Al matrix． When the SiC volume fraction increases，the density and thermal conductivity at room temperature lightly increase，the coef￾ficient of thermal expansion gradually decreases，and the compressive strength and bending strength increase． The main fracture mode of the SiC/Al electronic packaging materials is brittle fracture of SiC particles accompanied by ductile fracture of the Al matrix at the same time． KEY WOＲDS electronic packaging; particle reinforced composites; thixoforming; thermal conductivity; thermal expansion; strength of materials 收稿日期: 2013--04--17 DOI: 10． 13374 /j． issn1001--053x． 2014． 04． 011; http: / /journals． ustb． edu． cn 半导体集成电路的速度和集成度提高，导致芯 片发热率增加，电路工作温度上升． 实验证明，单个 元件的失效率与其工作温度呈指数关系，功能则与 其成反比［1］，因而如何提高芯片的散热效率，使得