33.1 Introduction Motivation .Requirements 33.2 Heat Transfer Fundamentals Avram Bar-Cohen 33.3 Chip Module Thermal Resistance Definition. Internal Resistance. External Resistance.Total

31.2 Sources and Detectors Lucent Technologies Properties of Light. Absorption Coherence. Geometric Optics. Incoherent Light. Detectors, R.A.Becker

7.1 磁场的基本物理量 7.2 磁性材料的磁性能 7.3 磁路及其基本定律 7.4 交流铁心线圈电路 7.5 变压器 7.6 电磁铁

30.1 Power Semiconductor Devices Thyristor and Triac. Gate Turn-Off Thyristor(GTO). Reverse- Conducting Thyristor(RCT) and Asymmetrical Silicon-Controlled Rectifier (ASCR). Power Transistor Power MOSFET. Insulated-Gate Bipolar Transistor (IGBT). MOS Controlled

29.1 Synthesis of Low-Pass Forms Passive and Active Filters Active Filter Classification and J W. Steadman Sensitivity. Cascaded Second-Order Sections. Passive Ladder University of wyoming

5.1 三相电压 5.2 负载星形联结的三相电路 5.3 负载三角形联结的三相电路 5.4 三相功率

28.1 Large Signal Analysis DC Operating Point. Graphical Approach.Power Amplifiers Gordon. Carpenter 28.2 Small Signal Analysis California State University. Hybrid-Pi Equivalent Circuit. Hybrid-Pi Equivalent Circuit of a Long Beach

The Ideal Op Amp- Practical Op Amps- SPICE Computer Models John V.Wait University of Arizona (Retired) 27.2 Applications Noninverting Circuits 27.1 Ideal and Practical Models

26.1Introduction 26.2 Definition and Considerations Considerations in the Implementation of SMT 26.3 SMT Design, Assembly, and Test Overview

25.1 Integrated Circuit Technology Technology Perspectives. Technology Generations.National Technology Roadmap for Semiconductors Joe E.Brewer 25.2 Layout, Placement, and Routing Northrop Grumman Corporation What Is Layout?. Floorplanning Techniques.Placement