34.1 Introduction 34.2 Design Entry 34.3 Synthesis 34.4 Verification Timing Analysis. Simulation.Analog Simulation.Emulation 34.5 Physical Design

成都信息工程大学：《51单片机及其应用》课程教学资源（PPT课件讲稿）第三课 显示器及其接口（LLED数码显示方式及电路D）

1 试证：平行板电容器的位移电流可写成

33.1 Introduction Motivation .Requirements 33.2 Heat Transfer Fundamentals Avram Bar-Cohen 33.3 Chip Module Thermal Resistance Definition. Internal Resistance. External Resistance.Total

31.2 Sources and Detectors Lucent Technologies Properties of Light. Absorption Coherence. Geometric Optics. Incoherent Light. Detectors, R.A.Becker

30.1 Power Semiconductor Devices Thyristor and Triac. Gate Turn-Off Thyristor(GTO). Reverse- Conducting Thyristor(RCT) and Asymmetrical Silicon-Controlled Rectifier (ASCR). Power Transistor Power MOSFET. Insulated-Gate Bipolar Transistor (IGBT). MOS Controlled

28.1 Large Signal Analysis DC Operating Point. Graphical Approach.Power Amplifiers Gordon. Carpenter 28.2 Small Signal Analysis California State University. Hybrid-Pi Equivalent Circuit. Hybrid-Pi Equivalent Circuit of a Long Beach

99.1 Introduction 99.2 History 99.3 The Internet Today

85.1 Digital IC Testing Taxonomy of Testing • Fault Models • Test Pattern Generation • Output Response Analysis 85.2 Design for Test The Testability Problem • Design for Testability • Future for Design

93.1 Introduction 93.2 Hardware Redundancy 93.3 Information Redundancy 93.4 Time Redundancy 93.5 Software Redundancy 93.6 Dependability Evaluation