33.1 Introduction Motivation .Requirements 33.2 Heat Transfer Fundamentals Avram Bar-Cohen 33.3 Chip Module Thermal Resistance Definition. Internal Resistance. External Resistance.Total

31.2 Sources and Detectors Lucent Technologies Properties of Light. Absorption Coherence. Geometric Optics. Incoherent Light. Detectors, R.A.Becker

30.1 Power Semiconductor Devices Thyristor and Triac. Gate Turn-Off Thyristor(GTO). Reverse- Conducting Thyristor(RCT) and Asymmetrical Silicon-Controlled Rectifier (ASCR). Power Transistor Power MOSFET. Insulated-Gate Bipolar Transistor (IGBT). MOS Controlled

29.1 Synthesis of Low-Pass Forms Passive and Active Filters Active Filter Classification and J W. Steadman Sensitivity. Cascaded Second-Order Sections. Passive Ladder University of wyoming

第一部分 电子束蒸发镀膜实验 第二部分 光刻实验 第三部分 刻蚀实验

28.1 Large Signal Analysis DC Operating Point. Graphical Approach.Power Amplifiers Gordon. Carpenter 28.2 Small Signal Analysis California State University. Hybrid-Pi Equivalent Circuit. Hybrid-Pi Equivalent Circuit of a Long Beach

电子科技大学：《移动通信系统》课程教学资源（授课电子教案，雷霞）

The Ideal Op Amp- Practical Op Amps- SPICE Computer Models John V.Wait University of Arizona (Retired) 27.2 Applications Noninverting Circuits 27.1 Ideal and Practical Models

26.1Introduction 26.2 Definition and Considerations Considerations in the Implementation of SMT 26.3 SMT Design, Assembly, and Test Overview

25.1 Integrated Circuit Technology Technology Perspectives. Technology Generations.National Technology Roadmap for Semiconductors Joe E.Brewer 25.2 Layout, Placement, and Routing Northrop Grumman Corporation What Is Layout?. Floorplanning Techniques.Placement