12.1 General Considerations 12.2 Classification of PAs 12.3 High-efficiency PAs 12.5 Large-signal Impedance Matching 12.6 Basic Linearization Tech 12.7 Polar Modulation 12.8 Outphasing

7.1 General Considerations 7.2 Inductors 7.3 Transformers 7.4 Transmission lines 7.5 Varactors 7.6 Constant Capacitors

电子科技大学：《射频集成电路 RF Integrated Circuits》课程教学资源（课件讲稿）第七讲 混合器 Mixers

电子科技大学：《射频集成电路 RF Integrated Circuits》课程教学资源（课件讲稿）第六讲 Low-Noise Amplifier

电子科技大学：《射频集成电路 RF Integrated Circuits》课程教学资源（课件讲稿）第五讲 Transceiver Architecture

电子科技大学：《射频集成电路 RF Integrated Circuits》课程教学资源（课件讲稿）第四讲 噪声 Noise

电子科技大学：《射频集成电路 RF Integrated Circuits》课程教学资源（课件讲稿）第三讲 单级放大器

Simplistic Model Physical Structure Threshold Voltage Long Channel Current Equations Regions of Operation Transconductance Channel Length Modulation CMOS Processing Technology MOS Layout Device Capacitances Device Capacitances Passive Devices Small Signal Models Circuit Impedance Equivalent Transconductance Short-Channel Effects Drain-Induced Barrier Lowering (DIBL) Effects of Velocity Saturation Hot Carrier Effects

1. Why CMOS? 2. CMOS Process Step

11.1 分布式并行计算系统 11.2 MapReduce计算架构 11.3 实际案例展示