1学科基础课平台必修课 《高等数学》 《线性代数》 《复变函数与积分变换》 《概率论与数理统计》 《大学物理》 《大学物理实验》 《画法几何与工程制图》 《金工实训》 《电工电子实训》 《电路原理》 《模拟电子技术》 《人体解剖学》 2学科基础课平台选修课 《生物医学工程专业导论》 《生物医学工程专业认识实习》课程 《有机化学》 《临床医学导论》理论 《文献检索》 《生理学》 《生命科学通论》 《电磁场理论》 《微机原理及接口技术》 《信号与系统》 《数字信号处理》 《生医信号仿真基础（MATLAB）》 《生物医学工程概论》 《生物力学基础》 《生物医学光学导论》 《生医电子 CAD 与仿真实习》 《核物理导论》 3专业课平台必修课 《生物医学传感器原理》 《生物医学传感器原理》 《生物医学信号处理》 《生物医学信号处理》 《医学图像处理》 《医学电子仪器原理》 《放射物理学》 《生医生产实习》 毕业设计（论文） 4专业课平台选修课 《生物医学传感器原理实验》 《生物医学工程》 《生医毕业实习》 《放射生物学》 《核医学仪器与方法》 《核医学仪器与方法实验》 《单片机原理及应用》 《生物医学工程专业英语》 《加速器原理》 《加速器原理》 《医学影像诊断学》 《DSP 技术及应用》 《DSP 技术及应用》 《CCD 传感器技术》 《EDA 技术及应用》 《医用放射源辐射安全与防护》 《医用放射源辐射安全与防护》 《蒙特卡罗方法》 《ARM 技术基础》 《ARM 技术基础》 《虚拟仪器技术及应用 B》 《核医学 B》 《辐射防护基础》 《电子技术综合设计实验》 《生物医学信号处理实验》 《嵌入式系统的软件设计》 《医学影像设备学》 《医学仪器综合设计》 《放射物理学综合设计》 《电子技术课程设计》 《单片机原理及应用》 《生物医用材料导论》 《生物医学的法律与伦理》 《医学装备管理学》

2.1性质与使用性能 1.基础概念 2.性质与性能的区别与关系 3.材料的失效分析 4.材料(产品)使用性能的设计 5.材料性能数据库 6.其它问题

1-1.材料是人类社会进步的里程碑 1-2.材料是经济和社会发展的基础和先导 1.新材料技术是工业革命和产业发展的先导 2.新材料技术是高技术发展的基础

一、填空题: 1、陶瓷材料的晶体缺陷有点缺陷、线缺陷、面缺陷,其中导电性与点缺陷有直接 关系。 2、陶瓷材料的塑性和韧性较低,这是陶瓷材料的最大弱点。 3、陶瓷材料热膨胀系数小,这是由晶体结构和化学键决定的

一、填空题: 1、陶瓷材料的晶体缺陷有低,这是陶瓷材料的最大弱点。 2、陶瓷材料的和较低 3、陶瓷材料热膨胀系数小,这是由和决定的

Understanding materials, their properties and behavior is fundamental to engineering design, and a key application of materials science. Written for all students of engineering, materials science and design, this book describes the procedures for material selection in mechanical design in order to ensure that the most suitable materials for a given application are identified from the full range of materials and section shapes available. Extensively revised for this fourth edition, Materials Selection in Mechanical Design is recognized as one of the leading materials selection texts, and provides a unique and genuinely innovative resource

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added

This book describes semiconductors from a materials science perspective rather than from condensed matter physics or electrical engineering viewpoints. It includes discussion of current approaches to organic materials for electronic devices. It further describes the fundamental aspects of thin film nucleation and growth, and the most common physical and chemical vapor deposition techniques. Examples of the application of the concepts in each chapter to specific problems or situations are included, along with recommended readings and homework problems

Describing the fundamental physical properties of materials used in electronics, the thorough coverage of this book will facilitate an understanding of the technological processes used in the fabrication of electronic and photonic devices. The book opens with an introduction to the basic applied physics of simple electronic states and energy levels. Silicon and copper, the building blocks for many electronic devices, are used as examples. Next, more advanced theories are developed to better account for the electronic and optical behavior of ordered materials, such as diamond, and disordered materials, such as amorphous silicon. Finally, the principal quasi-particles (phonons, polarons, excitons, plasmons, and polaritons) that are fundamental to explaining phenomena such as component aging (phonons) and optical performance in terms of yield (excitons) or communication speed (polarons) are discussed

一、名词解释(6题共30分,每题5分) (1).塑性:外力作用下,材料发生不可逆的永久性变形而不破坏的能力 (2).刚度:外应力作用下材料抵抗弹性变形能力。 (3).抗蠕变性:材料在恒定应力(或恒定载荷)作用下抵抗变形的能力