一、填空题: 1、陶瓷材料的晶体缺陷有点缺陷、线缺陷、面缺陷,其中导电性与点缺陷有直接 关系。 2、陶瓷材料的塑性和韧性较低,这是陶瓷材料的最大弱点。 3、陶瓷材料热膨胀系数小,这是由晶体结构和化学键决定的

一、填空题: 1、陶瓷材料的晶体缺陷有低,这是陶瓷材料的最大弱点。 2、陶瓷材料的和较低 3、陶瓷材料热膨胀系数小,这是由和决定的

Understanding materials, their properties and behavior is fundamental to engineering design, and a key application of materials science. Written for all students of engineering, materials science and design, this book describes the procedures for material selection in mechanical design in order to ensure that the most suitable materials for a given application are identified from the full range of materials and section shapes available. Extensively revised for this fourth edition, Materials Selection in Mechanical Design is recognized as one of the leading materials selection texts, and provides a unique and genuinely innovative resource

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added

This book describes semiconductors from a materials science perspective rather than from condensed matter physics or electrical engineering viewpoints. It includes discussion of current approaches to organic materials for electronic devices. It further describes the fundamental aspects of thin film nucleation and growth, and the most common physical and chemical vapor deposition techniques. Examples of the application of the concepts in each chapter to specific problems or situations are included, along with recommended readings and homework problems

Describing the fundamental physical properties of materials used in electronics, the thorough coverage of this book will facilitate an understanding of the technological processes used in the fabrication of electronic and photonic devices. The book opens with an introduction to the basic applied physics of simple electronic states and energy levels. Silicon and copper, the building blocks for many electronic devices, are used as examples. Next, more advanced theories are developed to better account for the electronic and optical behavior of ordered materials, such as diamond, and disordered materials, such as amorphous silicon. Finally, the principal quasi-particles (phonons, polarons, excitons, plasmons, and polaritons) that are fundamental to explaining phenomena such as component aging (phonons) and optical performance in terms of yield (excitons) or communication speed (polarons) are discussed

一、名词解释(6题共30分,每题5分) (1).塑性:外力作用下,材料发生不可逆的永久性变形而不破坏的能力 (2).刚度:外应力作用下材料抵抗弹性变形能力。 (3).抗蠕变性:材料在恒定应力(或恒定载荷)作用下抵抗变形的能力

1.材料的物理性质表述为电学性质、磁学性质、光学性质和热学性质。 2.材料的硬度表征为布氏硬度、洛氏硬度和维氏硬度等。 3.材料的化学性质主要表现为催化性质和防化性质

§2.1 性质与使用性能 1. 基础概念 2. 性质与性能的区别与关系 3. 材料的失效分析 4. 材料（产品）使用性能的设计 5. 材料性能数据库 6. 其它问题 §2.2 成分与结构 1. 材料的结构 2. 成分结构检测技术 3.与其它要素的关系 4.材料的成分.结构数据库 5.新的机遇 §2.3 合成与加工 1.定义 2.合成与加工的主要内容 3.与其它要素的关系 4.发展方向 §2.4 仪器与设备 1. 成分、结构表征仪器 2.材料性能的检测仪器 2.合成与加工过程中使用的设备 3.过程控制的探测元件及装置 §2.5 分析与建模（材料设计） 1. 引言 2. 材料设计的基本内容 3. 材料设计计算机基础

一、填空题: 1、由两种或两种以上不同的物质,经人工组合而成的叫做复合材料。 2、复合材料可分为和两大类