IC封装设计 Substrate加工工艺：Surface Finish FC Metal Finish Spec Wire Bond Bump Fiducial LGA Pad SMT Pad Mark Electrolytic Ni/Au Soft Au,Ni 3~15 um,Au 0.5~1.0 um X OSP Tamura WPF 207:0.2~0.4 um thickness X X ENIG Ni3~15um,Au0.03~0.12um X ENAG Ni 3~15 um,Au 0.5~1.0 um Presoldering Eutectic/Leadfree SAC 305 Immersion Tin Atotech 0.8 um min X X ENEPIG Ni5~10um,Pd0.05~0.15um, Au0.05~0.15um Capability ok with production experience in assembly Capability ok,no production experience in assembly Capability ok,tighter design rule X Not recommendedwww.chinafastprint.com Substrate加工工艺：Surface Finish IC封装设计