IC封装设计 Assembly Design Rule:SMT,DA,WB,Mold. Flp Chip Flp Chip CSP Glop TOP 由由口口凸口 山卤由卤由白 G B CSP Flip Chip Board (TOP) Board (BTM) Flip Chp 0 Flp Chip Flp Chp E Shielding Box D Bwww.chinafastprint.com Assembly Design Rule：SMT，DA，WB，Mold。 IC封装设计