卢建红等：聚二硫二丙烷磺酸钠在二元络合化学镀铜体系中的作用 ·1385· Physico-Chimica Sinica,2004,20(2):113 matical model for electroless copper deposition on planar sub- (谷新，胡光辉，王周成，等.化学镀铜过程混合电位本质的 strates.Electrochem Soc,1999,146(1):111 研究.物理化学学报，2004,20(2)：113) [17]Pauliukaite R,Stalnionis G,Jusys Z,et al.Effect of Cu(Il) [11]Norkus E,Vaskelis A,Jaciauskiene J,et al.Environmentally ligands on electroless copper deposition rate in formaldehyde so- friendly natural polyhydroxylic compounds in electroless copper lutions:An EQCM study.J Appl Electrochem,2006,36(11 ) plating baths:application of xylitol,D-mannitol and D-sorbitol as 1261 copper(II)ligands.J Appl Electrochem,2005,35(1):41 [18]Jusys Z,Pauliukaite R,Vaskelis A.EQCM study of the effect of [12]Mishra K G,Paramguru R K.Kinetics and mechanism of elec- ligands on the rate of Cul reduction by formaldehyde.Phys troless copper deposition at moderate-to-high copper ion and low- Chem Chem Phys,1999,1:313 to-moderate formaldehyde concentrations.Metall Mater Trans B, [19]Vaskelis A,Jaciauskiene J,Stalnioniene 1,et al.Accelerating 1999,30(2):223 effect of ammonia on electroless copper deposition in alkaline [13]Lee C H,Lee S C.Kim J J.Bottom-up filling in Cu electroless formaldehyde-containing solutions.Electroanal Chem,2007, deposition using bis-(3-sulfopropyl )-disulfide (SPS).Electro- 600(1):6 chim Acta,2005,50(16-17):3563 [20]Jusys Z,Stalnionis G,Juzeliinas E,et al.The kinetic HD iso- [14]Paunovic M.Ligand effects in electroless copper deposition. tope effect in electroless copper plating.An EQCM study.Elec- Electrochem Soc,1977,124(3):349 trochim Acta,1998,43(34):301 [15]Norkus E.Kepeniene V,Vaskelis A,et al.Application of envi- [21]Mishra K G,Paramguru R K.Surface modification with copper ronmentally friendly ligands for alkaline electroless copper plating by electroless deposition technique:an overview.Afr J Pure Appl systems:electroless copper deposition using trisodium salt of 2- Chem,2010,4(6):87 hydroxy-1,2,3-propanetricarboxylic acid as Cu (II)ligand. [22]Hu F T,Yang S,Wang HZ.et al.Electroless silver coating on Chemija,2006,17(4):20 copper microcones for low-temperature solid-state bonding. [16]Ramasubramanian M,Popov B N.White R E,et al.A mathe- Electron Mater,2015,44(11)4516卢建红等: 聚二硫二丙烷磺酸钠在二元络合化学镀铜体系中的作用 Physico鄄Chimica Sinica, 2004, 20(2): 113 (谷新, 胡光辉, 王周成, 等. 化学镀铜过程混合电位本质的 研究. 物理化学学报, 2004, 20(2): 113) [11] Norkus E, Va觢kelis A, Jac姚iauskiene · J, et al. Environmentally friendly natural polyhydroxylic compounds in electroless copper plating baths: application of xylitol, D鄄mannitol and D鄄sorbitol as copper(II) ligands. J Appl Electrochem, 2005, 35(1): 41 [12] Mishra K G, Paramguru R K. Kinetics and mechanism of elec鄄 troless copper deposition at moderate鄄to鄄high copper ion and low鄄 to鄄moderate formaldehyde concentrations. Metall Mater Trans B, 1999, 30(2): 223 [13] Lee C H,Lee S C,Kim J J. Bottom鄄up filling in Cu electroless deposition using bis鄄(3鄄sulfopropy1)鄄disulfide ( SPS). Electro鄄 chim Acta, 2005, 50(16鄄17): 3563 [14] Paunovic M. Ligand effects in electroless copper deposition. J Electrochem Soc, 1977, 124(3): 349 [15] Norkus E, Kepeniene · V, Va觢kelis A, et al. Application of envi鄄 ronmentally friendly ligands for alkaline electroless copper plating systems: electroless copper deposition using trisodium salt of 2鄄 hydroxy鄄1, 2, 3鄄propanetricarboxylic acid as Cu ( II ) ligand. Chemija, 2006, 17(4): 20 [16] Ramasubramanian M, Popov B N, White R E, et al. A mathe鄄 matical model for electroless copper deposition on planar sub鄄 strates. J Electrochem Soc, 1999, 146(1): 111 [17] Pauliukait佴 R, Stalnionis G, Jusys Z, et al. Effect of Cu( II) ligands on electroless copper deposition rate in formaldehyde so鄄 lutions: An EQCM study. J Appl Electrochem, 2006, 36(11): 1261 [18] Jusys Z, Pauliukaite R, Va觢kelis A. EQCM study of the effect of ligands on the rate of Cu 域 reduction by formaldehyde. Phys Chem Chem Phys, 1999, 1: 313 [19] Va觢kelis A, Jac姚iauskiene · J, Stalnioniene · I, et al. Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde鄄containing solutions. J Electroanal Chem, 2007, 600(1): 6 [20] Jusys Z, Stalnionis G, Juzeli俦nas E, et al. The kinetic HD iso鄄 tope effect in electroless copper plating. An EQCM study. Elec鄄 trochim Acta, 1998, 43(3鄄4): 301 [21] Mishra K G, Paramguru R K. Surface modification with copper by electroless deposition technique: an overview. Afr J Pure Appl Chem, 2010, 4(6): 87 [22] Hu F T, Yang S, Wang H Z, et al. Electroless silver coating on copper microcones for low鄄temperature solid鄄state bonding. J Electron Mater, 2015, 44(11): 4516 ·1385·