测试流程 Masks Packaged Device Manufacturing Package Test Burn-In In-line Wafer Tests ---◆Fallout Wafer Sort GO/ no-GO Test+-- Customer Incoming escapes inspection DC Parametrics Functional System Integration IDDQ Logic Delay ----Fallout System Test 2 Die Test Customer escapes 2020/9/4 集成电路可测性设计 82020/9/4 集成电路可测性设计 8 测试流程