二、测试的基本知识
二、测试的基本知识
讨论几个概念 IC验证(IC Verification) IC测试(IC Testing) 2020/9/4 集成电路可测性设计 3
2020/9/4 集成电路可测性设计 3 讨论几个概念 IC验证（IC Verification） IC测试（IC Testing）
讨论几个概念 Verification: Testing 1. Goal-Functional Correctness before (Manufacturing/Production Test) tapeout 2. Methodologies-Simulation along with 1.Wafer Sort Testing Formal,Power aware,Emulation and 2. Burn-In Stress Testing prototyping 3. Fault/Defects Testing 3. Increasing scope -Performance,Power, 4. Characterization Safety.Security 4. Critical as any bug escaped is costly 5. Functional Testing for production Testing (Manufacturing/Production Test) Verification Validation Volume Chip Design and Development-Life cycle Shipment Specifications Architecture RTL Design Physical Chip In House Design Tapeout Microarchitecture back from fab】
2020/9/4 集成电路可测性设计 4 讨论几个概念
讨论几个概念 design manufacture Specifications Silicon description in Design Code/Netlist/ IC chips sentences or codes layout Physical devices =? Verification Testing (for bugs) (for defects) Source from i NTU 2020/9/4 集成电路可测性设计 5
讨论几个概念 2020/9/4 集成电路可测性设计 5 Source from NTU
测试(Testing) A manufacturing step that e ensures that the physical device, manufactured from the synthesized design,has no manufacturing defect PASS FAIL ATPG ATE 测 ATE 合格/ 建模 测试图形 测试施加 被测电路 试 比较 不合格 生成 响 →BIST← 理想结果 Testing is a Decision！!！ 2020/9/4 集成电路可测性设计 6
2020/9/4 集成电路可测性设计 6 测试（Testing） A manufacturing step that ensures that the physical device, manufactured from the synthesized design, has no manufacturing defect PASS FAIL Testing is a Decision!!!
测试的结果 测试的重要性 -四种不同的结果，对产品意义重大 测试错误的代价：Rule of Ten Good IC Defective IC Pass tests True PASS Test Escapes (less is better) Fail tests Yield Loss True Reject (less is better) Source from NTU 2020/9/4 集成电路可测性设计 7
2020/9/4 集成电路可测性设计 7 测试的结果 测试的重要性 四种不同的结果，对产品意义重大 测试错误的代价：Rule of Ten Source from NTU
测试流程 Masks Packaged Device Manufacturing Package Test Burn-In In-line Wafer Tests ---◆Fallout Wafer Sort GO/ no-GO Test+-- Customer Incoming escapes inspection DC Parametrics Functional System Integration IDDQ Logic Delay ----Fallout System Test 2 Die Test Customer escapes 2020/9/4 集成电路可测性设计 8
2020/9/4 集成电路可测性设计 8 测试流程
测试分类 Testing(generally speaking) Design Explicit Testing Implicit Testing Or Verification On-line Testing Characterization Production Test Reliability Test Diagnosis Test Test Wafer Test Package Test System Test Burn-in Acc.Life test Gross DC parametric AC parametric Boolean Delay Test Functional IDDQ. Test Test Test Test Test VLV Source from NTU 2020/9/4 集成电路可测性设计 9
2020/9/4 集成电路可测性设计 9 测试分类 Source from NTU
生产测试 目的：用以确定制造的产品是否达到设计参数要求， 也称为产品测试。 冬裸片测试（或探针测试）--中测 封装后测试。-一成测 2020/9/4 集成电路可测性设计 10
2020/9/4 集成电路可测性设计 10 生产测试 目的: 用以确定制造的产品是否达到设计参数要求， 也称为产品测试。 裸片测试（或探针测试）---中测 封装后测试。 ---成测
自动测试设备 ATE Advantest HP93000 Tester *Teradyne 750 Tester Mosaid Tester C200e ADVANT 2020/9/4 集成电路可测性设计 11
2020/9/4 集成电路可测性设计 11 自动测试设备（ATE） Advantest HP93000 Tester Teradyne 750 Tester Mosaid Tester