肖日松等:基于MEMS技术的微型模具制作工艺研究 3结论 [3] Qu W, Wenzel C, Jahn A, et al. UV-LIGA: A Promising and Low-Cost Variant for Miero system Technology, IEEE, 0-7803- 微型模具由于结构和精度要求,宜采用基于 45B3-499,1999 MEMS技术的加工技术进行制作。本文在硅模具和4黄庆安硅微机械加工技术,北京科学出版社195 背板生长的基础上,提出了无背板生长制作工艺路5]HoCH, Chin K p, Yang C R,cta, Ultrathick SU.8mod 线,并对三种工艺路线的工艺步骤进行了简介,同时 formation and removal, and its application to the fabrication of LIGA-like micromotors with embedded roots. Sensors and Ac- 介绍了工艺路线中所采用的MEMS加工方法,即UV 光刻微电铸以及湿法刻蚀的工作原理。对工艺路(61 Dentinger P M,cmwM,cwsH, Removal of su-8 pho- 线和实验结果的比较研究表明,硅模具和背板生长 toresist for thick film applications. Microelectronic Engineering 所得的模具呈54.74的斜面,影响模具垂直精度,同 2002,6162:993-1000 时硅模具容易损坏,而背板生长的模具不便装夹和[7] Peele A G, Shew B y, Vora Kd,etal. Overcoming SU8 后续处理,且其内部应力易导致模具变形。无背板 stiction in high aspect ratio structures. Microsystem Technolo- 生长工艺步骤简单,且其所得的模具侧壁垂直精度 高表面粗糙度低以及易于装夹和不易损坏,适合微81 Hsiang Yang, Shung- Wen Kang. Improvement of thickness 型模具制作的需要。 uniformity in nickel electroforming for the LiGa process. In- ternational joumal of Machine Tools& Manufacture, 2000,40 参考文献 []石庚辰微机电系统技术.北京:国防工业出版社,2002 [9] Tan Y J, Lim K Y, Understanding and improving the uniformi face and Coatings Technology, [2]王阳元,武国英,郝一龙等,硅基MEMS加工技术及其 2003,l67:255-262 标准工艺研究电子学报,002,30(11):1-8 Research on fabrication of micro-mould based on MEMs technology Xiao Risong (Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education Dalian University of Technology, Dalian 116024) (Research Center of Microsystems of Technology, Dalian University of Technology, Dalian 116024) Abstract researches of silicon mould and back board growing technics ackles board growing technique is proposed for the demand of structure and precision in the article, and three MEMS techniques, i.e. lithography, micro- e experimental results indicate that the walls of silicon mould and back board growing mould bevel at 54. 74, and silicon mould is easy to damage, and back board growing mould is inclined to be distorted for the influence of inter stresses. Whereas the backless board growing technics can attain moulds of vertical wall, smooth surface, longer using life, and satisfy the demand of structure an Key words: micro-mould, MEMS, UV-LIGA, lithography, micro-electroforming, wet etching 万方数据肖Ft松等：基于MEMS技术的微型模具制作工艺研究 3 结论 微型模具由于结构和精度要求，宜采用基于 MEMS技术的加工技术进行制作。本文在硅模具和 背板生长的基础上，提出了无背板生长制作工艺路 线，并对三种工艺路线的工艺步骤进行了简介，同时 介绍了工艺路线中所采用的MEMS加工方法，即UV 光刻、微电铸以及湿法刻蚀的工作原理。对工艺路 线和实验结果的比较研究表明，硅模具和背板生长 所得的模具呈54．74。的斜面，影响模具垂直精度，同 时硅模具容易损坏，而背板生长的模具不便装夹和 后续处理，且其内部应力易导致模具变形。无背板 生长工艺步骤简单，且其所得的模具侧壁垂直精度 高，表面粗糙度低以及易于装夹和不易损坏，适合微 型模具制作的需要。 参考文献 [1]石庚辰．微机电系统技术．北京：国防工业出版社，2002 [2]王阳元，武国英，郝一龙等．硅基MEMS加工技术及其 标准工艺研究．电子学报，2002，30(11)：1-8 [3]Qu W，Wenzel C，Jahn A，et a1．UV-LIGA：A Promising and l ow-Cost Variant for Micro-system Technology，IEEE，0-7803— 45 13—4／99．1999 [4]黄庆安．硅微机械加工技术．北京：科学出版社，1995 [5]f{o c H，Chin K P，Yang C R，et a1．Uhrathick SU一8 mold formation and removal，and its application to the fabrication of UGA-like micromotors with embedded roots．Sensors and Ac— tuators A，2002，102：130—138 [6]Dentinger PM，Clift W M，Goods S H．Removal of SU一8 pho— toresist for thick film applications．Microelectronic Engineering， 2002，61—62：993—1000 [7]Peele A G，Shew B Y，Vora K D，et a1．Overcoming SU一8 stiction in high aspect ratio structures．Microsystem Technolo一 础s，2005，11：221—224 [8]Hsiharng Yang，Shung—Wen Kang．Improvement of thickness uniformity in nickel electroforming for the LIGA pIUcess．／n— ternational扣z胛“以of Machine Tools&Manufacture，2000，40： 1065．1072 [9]Tan Y J，Lim K Y．Understanding and improving the unifomfi— ty of electro-deposition．Surface and Coatings Technology， ’2003．167：255—262 Research on fabrication of micro-mould based on MEMS technology Xiao Risong一。，Du Liqun一。，“u Chong一“，“u Haijun“，Qin Jiang“ (”Key Laboratory for Precision and Non—traditional Machining Technology of Ministry of Education， Dalian University of Technology，Dalian 1 16024) (“Research Center of Microsystems of Technology，Dalian University of Technology，Dalian 1 16024) Abstract Based on the mseamhes of silicon mould and back beard growing technics，the backless beard growing technique is proposed for the demand of structure and precision in the article，and three MEMS techniques，i．e．1ithography，micro— electmfonning in UV—LIGA and wet etching in silicon machining，are presented．]he experimental results indicate that the walls of silicon mould and back board growing mould bevel at 54．74。，and silicon mould is easy to damage，and back beard growing mould is inclined to be distorted for the influence of inter stresses．Whereas the backless board growing technics Can attain moulds of vertical wall，smooth stlrface，longer using life，and satisfy the demand of structure and precision． Key words：micro—mould，MEMS，UV—LIGA，lithography，micro—electroforming，wet etching 万方数据