工程科学学报，第41卷，第5期：610-617.2019年5月 Chinese Joural of Engineering,Vol.41,No.5:610-617,May 2019 DOI:10.13374/j.issn2095-9389.2019.05.007;http://journals.ustb.edu.cn 低温取向硅钢常化工艺和渗氮工艺对组织、织构和磁 性能的影响 李霞)，杨平)四，贾志伟2)，张海利2) 1)北京科技大学材料科学与工程学院，北京1000832)鞍钢集团钢铁研究院，鞍山114000 区通信作者，E-mail:yang@mater..usth.cdu.cm 摘要利用电子背散射衍射技术(EBSD)、扫描电镜(SEM)分析了低温取向硅钢常化工艺、渗氨工艺对常化组织、再结晶组 织与抑制剂的影响，对比研究了常化冷却速率、渗氨温度和渗氨量对再结晶组织，织构和磁性能的影响规律.结果表明，常化 冷却速率越快，一次再结晶品粒尺寸越小.常化冷却速率较慢时，高温渗氨的样品一次再结晶晶粒尺寸偏大，使二次再结晶驱 动力降低，二次再结晶温度提高，且渗氮量低，追加抑制剂不足，最终二次再结晶不完善.高温渗氮与低温渗氨导致脱碳板中 抑制剂尺寸不同，高温渗氮表层抑制剂与次表层抑制剂尺寸基本无差异，低温渗氨表层抑制剂尺寸比次表层抑制剂尺寸大 低温渗氮且渗氮量低的样品虽然二次再结晶较完善，但由于其常化温度低、常化冷却速率快，一次再结晶晶粒尺寸小，二次再 结晶开始温度稍早，黄铜取向晶粒出现，最终磁性差.渗氨量较高的高温渗氨和低温渗氮样品虽都能基本完成二次再结晶，但 磁性存在差异，磁性差的原因是高温渗氨样品的最终退火板中出现较多的偏{210}<001>取向晶粒. 关键词取向硅钢；常化冷却速度：渗氮温度：抑制剂：磁性能 分类号TG142.71 Effects of normalizing process and nitriding process on the microstructure,texture,and magnetic properties in low-temperature grain-oriented silicon steel LI Xia,YANG Ping,JIA Zhi-wei,ZHANG Hai-li2) 1)School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China 2)Ansteel Iron and Steel Research Institute,Anshan 114000,China XCorresponding author,E-mail:yangp@mater.ustb.edu.cn ABSTRACT The influences of the normalization parameters and nitriding parameters on the microstructure of normalized samples, the primary recrystallization microstructure,and inhibitors were analyzed by electron backscatter diffraction (EBSD)and scanning elec- tron microscopy (SEM)techniques.The effects of normalizing cooling rates,nitriding temperatures and nitrogen content on the primary recrystallization and secondary recrystallization microstructure,textures,and properties were studied.The results show that grain sizes decrease with the increasing normalizing cooling rate;when the rate is slow,the grain size of high-temperature nitriding sample increa- ses with the slow normalizing cooling rate,reducing the driving force for secondary recrystallization and increasing secondary recrystalli- zation temperature.The acquired inhibitor is insufficient,which leads to unsuccessful secondary recrystallization.High-temperature ni- triding and low-temperature nitriding lead to different sizes of inhibitors in the decarburized sheets;however,inhibitors in the surface and subsurface regions of high-temperature nitriding samples are primarily of the same size,while the inhibitors in the surface region of low-temperature nitriding samples are larger than those of the subsurface inhibitors.The lower-temperature nitriding sample with low ni- trogen content exhibits a poor magnetic property.As the grain size remains small at a low normalizing temperature and high normalizing 收稿日期：2018-05-23工程科学学报,第 41 卷,第 5 期:610鄄鄄617,2019 年 5 月 Chinese Journal of Engineering, Vol. 41, No. 5: 610鄄鄄617, May 2019 DOI: 10. 13374 / j. issn2095鄄鄄9389. 2019. 05. 007; http: / / journals. ustb. edu. cn 低温取向硅钢常化工艺和渗氮工艺对组织、织构和磁 性能的影响 李 霞1) , 杨 平1)苣 , 贾志伟2) , 张海利2) 1) 北京科技大学材料科学与工程学院, 北京 100083 2) 鞍钢集团钢铁研究院, 鞍山 114000 苣通信作者, E鄄mail: yangp@ mater. ustb. edu. cn 摘 要 利用电子背散射衍射技术(EBSD)、扫描电镜(SEM)分析了低温取向硅钢常化工艺、渗氮工艺对常化组织、再结晶组 织与抑制剂的影响,对比研究了常化冷却速率、渗氮温度和渗氮量对再结晶组织、织构和磁性能的影响规律. 结果表明,常化 冷却速率越快,一次再结晶晶粒尺寸越小. 常化冷却速率较慢时,高温渗氮的样品一次再结晶晶粒尺寸偏大,使二次再结晶驱 动力降低,二次再结晶温度提高,且渗氮量低,追加抑制剂不足,最终二次再结晶不完善. 高温渗氮与低温渗氮导致脱碳板中 抑制剂尺寸不同,高温渗氮表层抑制剂与次表层抑制剂尺寸基本无差异,低温渗氮表层抑制剂尺寸比次表层抑制剂尺寸大. 低温渗氮且渗氮量低的样品虽然二次再结晶较完善,但由于其常化温度低、常化冷却速率快,一次再结晶晶粒尺寸小,二次再 结晶开始温度稍早,黄铜取向晶粒出现,最终磁性差. 渗氮量较高的高温渗氮和低温渗氮样品虽都能基本完成二次再结晶,但 磁性存在差异,磁性差的原因是高温渗氮样品的最终退火板中出现较多的偏{210} < 001 > 取向晶粒. 关键词 取向硅钢; 常化冷却速度; 渗氮温度; 抑制剂; 磁性能 分类号 TG142郾 71 收稿日期: 2018鄄鄄05鄄鄄23 Effects of normalizing process and nitriding process on the microstructure, texture, and magnetic properties in low鄄temperature grain鄄oriented silicon steel LI Xia 1) , YANG Ping 1)苣 , JIA Zhi鄄wei 2) , ZHANG Hai鄄li 2) 1) School of Materials Science and Engineering, University of Science and Technology Beijing,Beijing 100083, China 2) Ansteel Iron and Steel Research Institute, Anshan 114000, China 苣Corresponding author, E鄄mail: yangp@ mater. ustb. edu. cn ABSTRACT The influences of the normalization parameters and nitriding parameters on the microstructure of normalized samples, the primary recrystallization microstructure, and inhibitors were analyzed by electron backscatter diffraction (EBSD) and scanning elec鄄 tron microscopy (SEM) techniques. The effects of normalizing cooling rates, nitriding temperatures and nitrogen content on the primary recrystallization and secondary recrystallization microstructure, textures, and properties were studied. The results show that grain sizes decrease with the increasing normalizing cooling rate; when the rate is slow, the grain size of high鄄temperature nitriding sample increa鄄 ses with the slow normalizing cooling rate, reducing the driving force for secondary recrystallization and increasing secondary recrystalli鄄 zation temperature. The acquired inhibitor is insufficient, which leads to unsuccessful secondary recrystallization. High鄄temperature ni鄄 triding and low鄄temperature nitriding lead to different sizes of inhibitors in the decarburized sheets; however, inhibitors in the surface and subsurface regions of high鄄temperature nitriding samples are primarily of the same size, while the inhibitors in the surface region of low鄄temperature nitriding samples are larger than those of the subsurface inhibitors. The lower鄄temperature nitriding sample with low ni鄄 trogen content exhibits a poor magnetic property. As the grain size remains small at a low normalizing temperature and high normalizing