·738· 工程科学学报，第37卷，第6期 2]Kim B K,Lee S J,Kim J Y,et al.Origin of surface defects in containing compounds using a mixed aluminum-silver excitation PCB final finishes by the electroless nickel immersion gold source.J Electron Spectrosc Relat Phenom,1990,50(2):159 process.J Electron Mater,2008,37(4):527 [12]Notter I M,Gabe D R.Porosity of electrodeposited coatings:its B3]Zhang X D.Zhao L,Chen G H,et al.Research on testing meth- cause,nature,effect and management.Corros Rev,1992,10(3- od for gold-plating porosity of PCB.Printed Circuit Inf,2009(9): 4):217 27 [13]Trethewey K P,Chamberlain J.Corrosion for Science and Engi- (张宣东，赵丽，陈国辉，等.PCB镀金层孔隙率检验方法研 neering.Beijing:World Publishing Corporation,2000 究.印制电路信息，2009(9)：27) [14]Liu Q,Dong C F,Xiao K,et al.The influence of activity on 4]Krumbein S J.Corrosion through porous gold plate.IEEE Trans electrochemical characteristics of copper.Adr Mater Res,2011, Parts Mater Packag,1969,5(2)89 146:654 5]Bowcott HJ,Cleaver A J.Comrosion of electrical components by [15]Speight,James G.LANGEs Handbook of Chemistry.6th Ed their atmospheric environment.Proc IEE Part B Electron Commun America:McGrew-Hill,2004 Eng,1962,109(22):559 [16]Cao C N.Corrosion Electrochemistry.Beijing:Chemical Industry Zou S,Li X,Dong C,et al.Electrochemical migration,whisker Press,1994 formation,and corrosion behavior of printed circuit board under (曹楚南.腐蚀电化学.北京：化学工业出版社，1994) wet H2S environment.Electrochim Acta,2013,114:363 [17]Zhang G A,Cheng Y F.On the fundamentals of electrochemical ]Slade P G.Electrical Contacts:Principles and Applications.2nd corrosion of X65 steel in CO,containing formation water in the Ed.Boca Raton:CRC Press,2013 presence of acetic acid in petroleum production.Corros Sci, Le Solleu J P.Sliding contacts on printed circuit boards and wear 2009,51(1):87 behavior.Eur Phys J Appl Phys,2010,50(1):12902 [18]Quijada C,Huerta F J,Morallon E,et al.Electrochemical be- 9]Zou S W.Li X G,Dong C F,et al.Effect of mold on corrosion haviour of aqueous SO2 at polyerystalline gold electrodes in acidic behavior of printed circuit board-copper and ENIG finished.Acta media:a voltammetric and in situ vibrational study:Part 1.Re- Metall Sin,2012,48(6):687 duction of SO2:deposition of monomeric and polymeric sulphur. (邹士文，李晓刚，董超芳，等.霉菌对裸铜和镀金处理的印 Electrochim Acta,2000,45(11):1847 制电路板腐蚀行为的影响.金属学报，2012,48(6)：687) [19]Quijada C,Morallon E,Vazquez J L,et al.Electrochemical be- [10]Brion D.Photoelectron spectroscopy of the superficial degradation haviour of aqueous SO2 at polyerystalline gold electrodes in acidic of FeS2,CuFeS2,ZnS and PbS in air and in water.Appl Suf media.A voltammetric and in-situ vibrational study:Part Il.Ox- Sci,1980,5(2):133 idation of S02 on bare and sulphur-modified electrodes.Electro- [11]Yu X R,Liu F,Wang Z Y,et al.Auger parameters for sulfur- chim Acta,2001,46(5):651工程科学学报，第 37 卷，第 6 期 ［2］ Kim B K，Lee S J，Kim J Y，et al． Origin of surface defects in PCB final finishes by the electroless nickel immersion gold process． J Electron Mater，2008，37(4): 527 ［3］ Zhang X D，Zhao L，Chen G H，et al． Research on testing meth￾od for gold-plating porosity of PCB． Printed Circuit Inf，2009(9): 27 (张宣东，赵丽，陈国辉，等． PCB 镀金层孔隙率检验方法研 究． 印制电路信息，2009(9): 27) ［4］ Krumbein S J． Corrosion through porous gold plate． IEEE Trans Parts Mater Packag，1969，5(2): 89 ［5］ Bowcott H J，Cleaver A J． Corrosion of electrical components by their atmospheric environment． Proc IEE Part B Electron Commun Eng，1962，109(22): 559 ［6］ Zou S，Li X，Dong C，et al． Electrochemical migration，whisker formation，and corrosion behavior of printed circuit board under wet H2 S environment． Electrochim Acta，2013，114: 363 ［7］ Slade P G． Electrical Contacts: Principles and Applications． 2nd Ed． Boca Raton: CRC Press，2013 ［8］ Le Solleu J P． Sliding contacts on printed circuit boards and wear behavior． Eur Phys J Appl Phys，2010，50(1): 12902 ［9］ Zou S W，Li X G，Dong C F，et al． Effect of mold on corrosion behavior of printed circuit board-copper and ENIG finished． Acta Metall Sin，2012，48(6): 687 (邹士文，李晓刚，董超芳，等． 霉菌对裸铜和镀金处理的印 制电路板腐蚀行为的影响． 金属学报，2012，48(6): 687) ［10］ Brion D． Photoelectron spectroscopy of the superficial degradation of FeS2，CuFeS2，ZnS and PbS in air and in water． Appl Surf Sci，1980，5(2): 133 ［11］ Yu X R，Liu F，Wang Z Y，et al． Auger parameters for sulfur￾containing compounds using a mixed aluminum-silver excitation source． J Electron Spectrosc Relat Phenom，1990，50(2): 159 ［12］ Notter I M，Gabe D R． Porosity of electrodeposited coatings: its cause，nature，effect and management． Corros Rev，1992，10(3- 4): 217 ［13］ Trethewey K P，Chamberlain J． Corrosion for Science and Engi￾neering． Beijing: World Publishing Corporation，2000 ［14］ Liu Q，Dong C F，Xiao K，et al． The influence of activity on electrochemical characteristics of copper． Adv Mater Res，2011， 146: 654 ［15］ Speight，James G． LANGE's Handbook of Chemistry． 6th Ed． America: McGrew-Hill，2004 ［16］ Cao C N． Corrosion Electrochemistry． Beijing: Chemical Industry Press，1994 (曹楚南． 腐蚀电化学． 北京: 化学工业出版社，1994) ［17］ Zhang G A，Cheng Y F． On the fundamentals of electrochemical corrosion of X65 steel in CO2 -containing formation water in the presence of acetic acid in petroleum production． Corros Sci， 2009，51(1): 87 ［18］ Quijada C，Huerta F J，Morallón E，et al． Electrochemical be￾haviour of aqueous SO2 at polycrystalline gold electrodes in acidic media: a voltammetric and in situ vibrational study: Part 1． Re￾duction of SO2 : deposition of monomeric and polymeric sulphur． Electrochim Acta，2000，45(11): 1847 ［19］ Quijada C，Morallon E，Vázquez J L，et al． Electrochemical be￾haviour of aqueous SO2 at polycrystalline gold electrodes in acidic media． A voltammetric and in-situ vibrational study: Part II． Ox￾idation of SO2 on bare and sulphur-modified electrodes． Electro￾chim Acta，2001，46(5): 651 ·738·