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[16]Tang K Y.Collagen Physics and Chemistry.Beijing:Science Beijng:Metallurgical Industry Press,2004 Press,2012 (华一新.治金过程动力学导论.北京：治金工业出版社， (汤克勇.胶原物理与化学.北京：科学出版社，2012) 2004)李 坚等: 铜电解液中硫酸质量浓度和温度对明胶分解的影响 ［5］ Huang J，Li J，Sun C Y，et al． Effects of glue on power consump￾tion and quality of cathode zinc of long period zinc electrodeposi￾tion． Nonferrous Met Extr Metall，2011( 1) : 12 ( 黄娟，李坚，孙成余，等． 骨胶对长周期锌电积能耗及阴极 质量的影响． 有色金属: 冶炼部分，2011( 1) : 12) ［6］ Lafront A M，Zhang W，Ghali E，et al． Effect of gelatin and anti￾mony on zinc electrowinning by electrochemical noise measure￾ments． Can Metall Q，2009，48( 4) : 337 ［7］ Gao T X，Li S X，Liu A X． Ｒole of additive in nickel electrolysis cathodic process and its on-line control． Chin J Nonferrous Met， 2006，16( 10) : 1806 ( 高天星，李仕雄，刘爱心． 镍电解阴极过程中添加剂的作用 及其在线监控． 中国有色金属学报，2006，16( 10) : 1806) ［8］ Brown G M，Hope G A． SEＲS study of the adsorption of gelatin at a copper electrode in sulfuric acid solution． J Electroanal Chem， 1995，397( 1 － 2) : 293 ［9］ Quinet M，Lallemand F，Ｒicq L，et al． Influence of organic addi￾tives on the initial stages of copper electrodeposition on polycrystal￾line platinum． Electrochim Acta，2009，54( 5) : 1529 ［10］ Gladysz O，Los P． The electrochemical nucleation of copper on disc-shaped ultramicroelectrode in industrial electrolyte． Electro￾chim Acta，2008，54( 2) : 801 ［11］ Okamoto N，Takahashi S，Saito T，et al． Formation factor of nodule by copper electrodeposition． ECS Trans，2009，16( 22) : 49 ［12］ Yu Ｒ L，Liu Q M，Qiu G Z，et al． Inhibition behavior of some new mixed additives upon copper electrowinning． Trans Nonfer￾rous Met Soc China，2008，18( 5) : 1280 ［13］ Aghazadeh M，Zakeri A，Bafghi M S． Modeling and optimization of surface quality of copper deposits recovered from brass scrap by direct electrowinning． Hydrometallurgy，2012，111 － 112: 103 ［14］ Xu Ｒ，Liang Q H． Gelatin production and application technolo￾gy． Beijing: China Light Industry Press，2000 ( 徐润，梁庆华． 明胶的生产及应用技术． 北京: 中国轻工业 出版社，2000) ［15］ Nijenhuis K． thermoreversible networks: viscoelastic properties and structure of gels． Adv Polym Sci，1997，130: 160 ［16］ Tang K Y． Collagen Physics and Chemistry． Beijing: Science Press，2012 ( 汤克勇． 胶原物理与化学． 北京: 科学出版社，2012) ［17］ Bharucha N Ｒ，Zavorsky Z，Leroy Ｒ L． Electrochemical deter￾mination of glue in copper refinery electrolyte． Metall Trans B， 1978，9( 4) : 509 ［18］ Saban M D，Scott J D，Cassidy Ｒ M． Collagen proteins in elec￾trorefining: rate constants for glue hydrolysis and effects of molar mass on glue activity． Metall Trans B，1992，23( 2) : 125 ［19］ Krzewska S，Pajdowski L，PoDsiadly H，et al． Electrochemical determination of thiourea and glue in the industrial copper elec￾trolyte． Metall Trans B，1984，15( 3) : 451 ［20］ Blechta V K，Wang Z Z，Krueger D W． Glue analysis and behav￾ior in copper electrolyte． Metall Trans B，1993，24( 2) : 277 ［21］ Stantke P． Using CollaMat to measure glue in copper electrolyte． JOM，2002，54( 4) : 19 ［22］ Ｒezaei E． Simultaneous electrochemical determination of glue and thiourea in copper refining by using artificial neural network / / Proceedings of the 8th WSEAS International Conference on Arti￾ficial Intelligence， Knowledge Engineering and Data Bases ( AIKED '09) ，Cambridge，2009: 154 ［23］ Safizadeh F，Lafront A M，Ghali E，et al． Monitoring the influ￾ence of gelatin and thiourea on copper electrodeposition emplo￾ying electrochemical noise technique． Can Metall Q，2010，49 ( 1) : 21 ［24］ Smith P K，Krohn Ｒ I，Hermanson G T，et al． Measurement of protein using bicinchoninic acid． Anal Biochem，1985，150( 1) : 76 ［25］ Wang J Z，Fan M． Protein Technical Manuals． Beijing: Science Press，2000 ( 汪家政，范明． 蛋白技术手册． 北京: 科学出版社，2000) ［26］ Xu J Y． Biochemical Experiment and Guidance． 2nd Ed． Bei￾jing: Chinese Medical Science and Technology Press，2009 ( 许激扬． 生物化学实验与指导． 2 版． 北京: 中国医药科技 出版社，2009) ［27］ Guo A G，Guo Z K． Biochemical Experimental Technology． Bei￾jing: Higher Education Press，2007 ( 郭蔼光，郭泽坤． 生物化学实验技术． 北京: 高等教育出版 社，2007) ［28］ Hua Y X． An Introduction to Metallurgical Process Dynamics． Beijng: Metallurgical Industry Press，2004 ( 华一新． 冶金过程动力学导论． 北京: 冶金工业出版社， 2004) · 785 ·